JP2016195177A - 光照射モジュール - Google Patents

光照射モジュール Download PDF

Info

Publication number
JP2016195177A
JP2016195177A JP2015074298A JP2015074298A JP2016195177A JP 2016195177 A JP2016195177 A JP 2016195177A JP 2015074298 A JP2015074298 A JP 2015074298A JP 2015074298 A JP2015074298 A JP 2015074298A JP 2016195177 A JP2016195177 A JP 2016195177A
Authority
JP
Japan
Prior art keywords
light irradiation
substrate
irradiation module
metal base
led chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015074298A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016195177A5 (enrdf_load_stackoverflow
Inventor
渡邊　浩明
Hiroaki Watanabe
浩明 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Candeo Optronics Corp
Original Assignee
Hoya Candeo Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Candeo Optronics Corp filed Critical Hoya Candeo Optronics Corp
Priority to JP2015074298A priority Critical patent/JP2016195177A/ja
Priority to TW105109593A priority patent/TW201636535A/zh
Priority to CN201610180618.XA priority patent/CN106024803A/zh
Priority to KR1020160037006A priority patent/KR20160117260A/ko
Publication of JP2016195177A publication Critical patent/JP2016195177A/ja
Publication of JP2016195177A5 publication Critical patent/JP2016195177A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
JP2015074298A 2015-03-31 2015-03-31 光照射モジュール Pending JP2016195177A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015074298A JP2016195177A (ja) 2015-03-31 2015-03-31 光照射モジュール
TW105109593A TW201636535A (zh) 2015-03-31 2016-03-25 光照射模組
CN201610180618.XA CN106024803A (zh) 2015-03-31 2016-03-25 光照射模块
KR1020160037006A KR20160117260A (ko) 2015-03-31 2016-03-28 광 조사 모듈

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015074298A JP2016195177A (ja) 2015-03-31 2015-03-31 光照射モジュール

Publications (2)

Publication Number Publication Date
JP2016195177A true JP2016195177A (ja) 2016-11-17
JP2016195177A5 JP2016195177A5 (enrdf_load_stackoverflow) 2017-03-09

Family

ID=57081398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015074298A Pending JP2016195177A (ja) 2015-03-31 2015-03-31 光照射モジュール

Country Status (4)

Country Link
JP (1) JP2016195177A (enrdf_load_stackoverflow)
KR (1) KR20160117260A (enrdf_load_stackoverflow)
CN (1) CN106024803A (enrdf_load_stackoverflow)
TW (1) TW201636535A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111384037B (zh) * 2018-12-29 2025-03-07 西华大学 一种长灯丝以及一种灯丝网
KR102467343B1 (ko) * 2020-09-09 2022-11-16 (주)진영에이치앤에스 Uvc 엘이디 조립체
KR102650608B1 (ko) * 2020-12-18 2024-03-25 세메스 주식회사 광 처리 부재, 그를 포함하는 기판 처리 장치 및 기판 처리 방법

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2002094122A (ja) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd 光源装置及びその製造方法
US20080099772A1 (en) * 2006-10-30 2008-05-01 Geoffrey Wen-Tai Shuy Light emitting diode matrix
JP2010251441A (ja) * 2009-04-14 2010-11-04 Denki Kagaku Kogyo Kk 照明用ｌｅｄモジュール
WO2012014519A1 (ja) * 2010-07-30 2012-02-02 Ｎｋワークス株式会社 発光ダイオードを用いた光照射装置及び印刷装置
JP2013089769A (ja) * 2011-10-18 2013-05-13 Koito Mfg Co Ltd 発光モジュール
JP2013239673A (ja) * 2012-05-17 2013-11-28 Stanley Electric Co Ltd 発光装置、および車両用灯具
JP2015038902A (ja) * 2010-10-28 2015-02-26 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180320A (ja) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
CN101076223A (zh) * 2006-09-26 2007-11-21 蔡勇 铝基板磁控溅射金属化电路板及led照明器件
JP5526876B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 加熱装置及びアニール装置
JP5582967B2 (ja) 2010-10-27 2014-09-03 京セラ株式会社 光照射装置、光照射モジュール、および印刷装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2002094122A (ja) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd 光源装置及びその製造方法
US20080099772A1 (en) * 2006-10-30 2008-05-01 Geoffrey Wen-Tai Shuy Light emitting diode matrix
JP2010251441A (ja) * 2009-04-14 2010-11-04 Denki Kagaku Kogyo Kk 照明用ｌｅｄモジュール
WO2012014519A1 (ja) * 2010-07-30 2012-02-02 Ｎｋワークス株式会社 発光ダイオードを用いた光照射装置及び印刷装置
JP2015038902A (ja) * 2010-10-28 2015-02-26 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
JP2013089769A (ja) * 2011-10-18 2013-05-13 Koito Mfg Co Ltd 発光モジュール
JP2013239673A (ja) * 2012-05-17 2013-11-28 Stanley Electric Co Ltd 発光装置、および車両用灯具

Also Published As

Publication number Publication date
CN106024803A (zh) 2016-10-12
KR20160117260A (ko) 2016-10-10
TW201636535A (zh) 2016-10-16

Similar Documents

Publication Publication Date Title
JP4241658B2 (ja) 発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
JP3131390U (ja) Ｌｅｄと放熱シートとの結合構造
JP5770006B2 (ja) 半導体発光装置
JP5517616B2 (ja) 薄膜半導体構成素子および構成素子結合体
KR101049698B1 (ko) Ｌｅｄ 어레이 모듈 및 이의 제조방법
JP2005158957A (ja) 発光装置
KR20150022978A (ko) Led 조명 모듈 및 led 조명 장치
US7586126B2 (en) Light emitting diode lighting module with improved heat dissipation structure
US11266017B2 (en) Support for light-emitting elements and lighting device
US20090153007A1 (en) Light source module and method for manufacturing same
JP2011035264A (ja) 発光素子用パッケージ及び発光素子の製造方法
JP2016171147A (ja) 発光装置および照明装置
US20100301359A1 (en) Light Emitting Diode Package Structure
JP2010267834A (ja) 光半導体装置モジュール及びこれに用いられる熱伝導チップ
JP2016195177A (ja) 光照射モジュール
JP2011044612A (ja) 発光装置
KR20080088140A (ko) 방열 기판과 이를 포함하는 발광소자
JP2011103353A (ja) 発光モジュール
CN109216300B (zh) 组合式基板结构
EP3513442A1 (en) Heatsink including thick film layer for uv led arrays, and methods of forming uv led arrays
JP2016195177A5 (enrdf_load_stackoverflow)
KR101259876B1 (ko) 열전 소자를 갖는 엘이디 패키지 및 이의 제조 방법
US7868347B2 (en) Metal core multi-LED SMD package and method of producing the same
JP7227531B2 (ja) 発光装置及び発光モジュール
KR101248607B1 (ko) 열우물을 이용한 방열구조를 가지는 led 어레이 모듈

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170201

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171128

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180403

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180905

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181205

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20190107

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20190315