CN106024803A - 光照射模块 - Google Patents

光照射模块 Download PDF

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Publication number
CN106024803A
CN106024803A CN201610180618.XA CN201610180618A CN106024803A CN 106024803 A CN106024803 A CN 106024803A CN 201610180618 A CN201610180618 A CN 201610180618A CN 106024803 A CN106024803 A CN 106024803A
Authority
CN
China
Prior art keywords
irradiation module
light irradiation
light
led chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610180618.XA
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English (en)
Chinese (zh)
Inventor
渡边浩明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Candeo Optronics Corp
Original Assignee
Hoya Candeo Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Candeo Optronics Corp filed Critical Hoya Candeo Optronics Corp
Publication of CN106024803A publication Critical patent/CN106024803A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
CN201610180618.XA 2015-03-31 2016-03-25 光照射模块 Pending CN106024803A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015074298A JP2016195177A (ja) 2015-03-31 2015-03-31 光照射モジュール
JP2015-074298 2015-03-31

Publications (1)

Publication Number Publication Date
CN106024803A true CN106024803A (zh) 2016-10-12

Family

ID=57081398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610180618.XA Pending CN106024803A (zh) 2015-03-31 2016-03-25 光照射模块

Country Status (4)

Country Link
JP (1) JP2016195177A (enrdf_load_stackoverflow)
KR (1) KR20160117260A (enrdf_load_stackoverflow)
CN (1) CN106024803A (enrdf_load_stackoverflow)
TW (1) TW201636535A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111384037A (zh) * 2018-12-29 2020-07-07 西华大学 一种长灯丝以及一种灯丝网
CN114650629A (zh) * 2020-12-18 2022-06-21 细美事有限公司 光处理构件、包括该光处理构件的基板处理装置以及基板处理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102467343B1 (ko) * 2020-09-09 2022-11-16 (주)진영에이치앤에스 Uvc 엘이디 조립체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JP2007180320A (ja) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
CN101076223A (zh) * 2006-09-26 2007-11-21 蔡勇 铝基板磁控溅射金属化电路板及led照明器件
CN102754191A (zh) * 2010-03-09 2012-10-24 东京毅力科创株式会社 加热装置和退火装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP4432275B2 (ja) * 2000-07-13 2010-03-17 パナソニック電工株式会社 光源装置
US20080099772A1 (en) * 2006-10-30 2008-05-01 Geoffrey Wen-Tai Shuy Light emitting diode matrix
JP5330889B2 (ja) * 2009-04-14 2013-10-30 電気化学工業株式会社 照明用ｌｅｄモジュール
JP2012033742A (ja) * 2010-07-30 2012-02-16 Nk Works Kk 発光ダイオードを用いた光照射装置及び印刷装置
JP5582967B2 (ja) 2010-10-27 2014-09-03 京セラ株式会社 光照射装置、光照射モジュール、および印刷装置
JP2015038902A (ja) * 2010-10-28 2015-02-26 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
JP2013089769A (ja) * 2011-10-18 2013-05-13 Koito Mfg Co Ltd 発光モジュール
JP2013239673A (ja) * 2012-05-17 2013-11-28 Stanley Electric Co Ltd 発光装置、および車両用灯具

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JP2007180320A (ja) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
CN101076223A (zh) * 2006-09-26 2007-11-21 蔡勇 铝基板磁控溅射金属化电路板及led照明器件
CN102754191A (zh) * 2010-03-09 2012-10-24 东京毅力科创株式会社 加热装置和退火装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111384037A (zh) * 2018-12-29 2020-07-07 西华大学 一种长灯丝以及一种灯丝网
CN114650629A (zh) * 2020-12-18 2022-06-21 细美事有限公司 光处理构件、包括该光处理构件的基板处理装置以及基板处理方法
TWI810744B (zh) * 2020-12-18 2023-08-01 南韓商細美事有限公司 光處理構件、包括該光處理構件之基板處理設備以及基板處理方法
US12125720B2 (en) 2020-12-18 2024-10-22 Semes Co., Ltd. Light treating member, substrate treating apparatus including the same and substrate treating method

Also Published As

Publication number Publication date
KR20160117260A (ko) 2016-10-10
TW201636535A (zh) 2016-10-16
JP2016195177A (ja) 2016-11-17

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