JP2016164964A5 - - Google Patents

Download PDF

Info

Publication number
JP2016164964A5
JP2016164964A5 JP2015182489A JP2015182489A JP2016164964A5 JP 2016164964 A5 JP2016164964 A5 JP 2016164964A5 JP 2015182489 A JP2015182489 A JP 2015182489A JP 2015182489 A JP2015182489 A JP 2015182489A JP 2016164964 A5 JP2016164964 A5 JP 2016164964A5
Authority
JP
Japan
Prior art keywords
gas
processing
substrate
processing unit
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015182489A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016164964A (ja
JP6545054B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to KR1020150144002A priority Critical patent/KR101876616B1/ko
Priority to TW104133953A priority patent/TWI667720B/zh
Priority to US14/886,325 priority patent/US10460949B2/en
Priority to CN201510685548.9A priority patent/CN105529289B/zh
Priority to CN201811000665.7A priority patent/CN109244004B/zh
Publication of JP2016164964A publication Critical patent/JP2016164964A/ja
Publication of JP2016164964A5 publication Critical patent/JP2016164964A5/ja
Priority to KR1020180075576A priority patent/KR101934237B1/ko
Application granted granted Critical
Publication of JP6545054B2 publication Critical patent/JP6545054B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015182489A 2014-10-20 2015-09-16 基板処理装置および基板処理方法 Active JP6545054B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020150144002A KR101876616B1 (ko) 2014-10-20 2015-10-15 기판 처리 장치, 기판 처리 방법 및 기억 매체
TW104133953A TWI667720B (zh) 2014-10-20 2015-10-16 Substrate processing apparatus and substrate processing method
US14/886,325 US10460949B2 (en) 2014-10-20 2015-10-19 Substrate processing apparatus, substrate processing method and storage medium
CN201811000665.7A CN109244004B (zh) 2014-10-20 2015-10-20 基板处理装置和基板处理方法
CN201510685548.9A CN105529289B (zh) 2014-10-20 2015-10-20 基板处理装置和基板处理方法
KR1020180075576A KR101934237B1 (ko) 2014-10-20 2018-06-29 기판 처리 장치, 기판 처리 방법 및 기억 매체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014213887 2014-10-20
JP2014213887 2014-10-20
JP2015036889 2015-02-26
JP2015036889 2015-02-26

Publications (3)

Publication Number Publication Date
JP2016164964A JP2016164964A (ja) 2016-09-08
JP2016164964A5 true JP2016164964A5 (https=) 2018-06-28
JP6545054B2 JP6545054B2 (ja) 2019-07-17

Family

ID=56876708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015182489A Active JP6545054B2 (ja) 2014-10-20 2015-09-16 基板処理装置および基板処理方法

Country Status (4)

Country Link
JP (1) JP6545054B2 (https=)
KR (2) KR101876616B1 (https=)
CN (1) CN109244004B (https=)
TW (1) TWI667720B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6667412B2 (ja) * 2016-09-30 2020-03-18 東京エレクトロン株式会社 基板処理装置
JP6844263B2 (ja) * 2017-01-05 2021-03-17 東京エレクトロン株式会社 基板処理装置
JP7257813B2 (ja) * 2019-02-21 2023-04-14 東京エレクトロン株式会社 水蒸気処理装置及び水蒸気処理方法
KR102202463B1 (ko) * 2019-03-13 2021-01-14 세메스 주식회사 기판 처리 장치 및 방법
KR102800139B1 (ko) * 2019-12-30 2025-04-28 주성엔지니어링(주) 기판처리방법 및 기판처리장치
JP6815542B2 (ja) * 2020-02-04 2021-01-20 東京エレクトロン株式会社 基板処理装置
WO2022065114A1 (ja) * 2020-09-24 2022-03-31 東京エレクトロン株式会社 ガスを供給する装置、基板を処理するシステム、及びガスを供給する方法
JP7600018B2 (ja) * 2021-03-30 2024-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN117448796B (zh) * 2023-10-27 2026-03-24 北京北方华创微电子装备有限公司 一种控制方法、装置、半导体设备及计算机可读存储介质

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158843A (ja) * 1996-12-06 1998-06-16 Furukawa Electric Co Ltd:The 気相成長装置
JP2002110570A (ja) * 2000-10-04 2002-04-12 Asm Japan Kk 半導体製造装置用ガスラインシステム
US6755150B2 (en) * 2001-04-20 2004-06-29 Applied Materials Inc. Multi-core transformer plasma source
JP2003049278A (ja) * 2001-08-06 2003-02-21 Canon Inc 真空処理方法及び真空処理装置
US20060176928A1 (en) * 2005-02-08 2006-08-10 Tokyo Electron Limited Substrate processing apparatus, control method adopted in substrate processing apparatus and program
US20080006650A1 (en) * 2006-06-27 2008-01-10 Applied Materials, Inc. Method and apparatus for multi-chamber exhaust control
CN101779269B (zh) * 2008-07-23 2014-05-07 新动力等离子体株式会社 多工件处理室以及包括该多工件处理室的工件处理系统
JP5195676B2 (ja) 2008-08-29 2013-05-08 東京エレクトロン株式会社 成膜装置、基板処理装置、成膜方法及び記憶媒体
US8617347B2 (en) * 2009-08-06 2013-12-31 Applied Materials, Inc. Vacuum processing chambers incorporating a moveable flow equalizer
KR101625078B1 (ko) * 2009-09-02 2016-05-27 주식회사 원익아이피에스 가스분사장치 및 이를 이용한 기판처리장치
US20110265951A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Twin chamber processing system
US8911826B2 (en) * 2012-08-02 2014-12-16 Asm Ip Holding B.V. Method of parallel shift operation of multiple reactors

Similar Documents

Publication Publication Date Title
JP2016164964A5 (https=)
US10460949B2 (en) Substrate processing apparatus, substrate processing method and storage medium
JP6541374B2 (ja) 基板処理装置
KR102316179B1 (ko) 기판 처리 방법 및 기억 매체
JP6545054B2 (ja) 基板処理装置および基板処理方法
US9607855B2 (en) Etching method and storage medium
US12215417B2 (en) Substrate processing method and substrate processing device
US20190228981A1 (en) Etching Method
US9418866B2 (en) Gas treatment method
JP6684943B2 (ja) 基板処理装置および基板処理方法
TW201635410A (zh) 基板處理裝置
KR20200083617A (ko) 기판 처리 장치
JP6923396B2 (ja) 密着強化処理装置および密着強化処理方法
US11572623B2 (en) Substrate processing apparatus