JP2016143725A - Printed wiring board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent cracks from extending into a product area and a product from being failed when cut to a multiple piece printed wiring board from a panel which manufactures a plurality of printed wiring boards in bulk.SOLUTION: A multiple piece printed wiring board 100 includes: a product area 20 composed of a plurality of printed wiring boards 1a and 1b; and a dummy area 10 formed around one or two more product areas 20. On an outer peripheral end edge side of the dummy area 10, a plurality of independent dummy patterns 11 are formed, and a dummy post whose thickness is smaller than that of a conductive post is formed while being connected to the dummy pattern 11.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a printed wiring board and a manufacturing method thereof.

  Patent Document 1 discloses forming copper patterns of various shapes in a dummy region around a package region (product region). That is, as shown in FIG. 7, a dummy wiring formed by a wiring 91 parallel to the product region 90 and a wiring 92 perpendicular to the product region 90 is formed.

JP 2007-19496 A

  However, even if the dummy wiring 91 is formed on one surface of the resin insulating layer, when the resin insulating layer is cut, an impact is applied to the entire thickness of the resin insulating layer. Therefore, a crack may enter from not only the surface but also from the middle part of the thickness of the resin insulating layer, and the crack may extend in the horizontal direction and the vertical direction. Therefore, even if the dummy wiring layer is formed on the surface, the crack may reach the product area and the product may be defective.

  The multi-cavity printed wiring board of the present invention has a product area composed of a plurality of printed wiring boards and a dummy area formed around one or more of the product areas. The multi-cavity printed wiring board of the present invention includes a resin insulating layer having a first surface and a second surface that is the opposite surface of the first surface. Furthermore, each printed wiring board in the product area is connected to the first conductor layer, the first conductor layer embedded so that only one surface is exposed on the first surface side of the resin insulation layer, and the resin insulation layer A conductor post that penetrates and has an end exposed on the second surface side, and the dummy area penetrates the dummy pattern formed on the first surface of the resin insulation layer and the resin insulation layer; A dummy post connected to the dummy pattern so that ends thereof are exposed independently of each other on the second surface side, and the thickness of the dummy post is smaller than the thickness of the conductor post Has been.

  A method for manufacturing a multi-piece printed wiring board according to the present invention includes a product area including a plurality of printed wiring boards, and a multi-piece printed wiring having a dummy area formed around one or more of the product areas. It is a manufacturing method of a board. The method of manufacturing a multi-piece printed wiring board according to the present invention includes preparing a metal film, a wiring pattern of the first conductor layer for a plurality of multi-piece printed wiring boards on the metal film, and the Forming a dummy pattern, forming a pattern of the first conductor layer and a conductor post and a dummy post on the dummy pattern, respectively, an exposed surface of the first conductor layer, and the conductor post and Forming a resin insulating layer so as to cover the side surface of the dummy post; and polishing the second surface side of the resin insulating layer to expose ends of the conductor post and the dummy post; Either removing the support plate and the metal film and cutting and separating into a multi-piece printed wiring board including one or more product areas. It includes and be carried out in order to do so, the. The dummy area has a dummy post that is thinner than the conductor post.

Plane explanatory drawing of the panel of the multi-cavity printed wiring board of one embodiment of the present invention. Cross-sectional explanatory drawing of 1B-1B in the manufacturing process of the multi-cavity printed wiring board of FIG. 1A. Cross-sectional explanatory drawing which shows the cutting process from the panel of FIG. 1A to a multi-piece printed wiring board. Cross-sectional explanatory drawing which shows the cutting process from the panel of FIG. 1A to a multi-piece printed wiring board. Explanatory drawing of an example of the conductor post and dummy post of the multi-piece printed wiring board shown by FIG. 1A. FIG. 1B is an enlarged explanatory diagram of an example of a dummy pattern shown in FIG. 1A. The enlarged explanatory view of an example of the end face of the dummy post connected to the dummy pattern shown in Drawing 1A. Explanatory drawing of the other example of the dummy pattern formed in the multi-cavity printed wiring board of one Embodiment. FIG. 2D is an explanatory diagram of an example of a dummy post connected to the dummy pattern shown in FIG. 2C. Explanatory drawing of the further another example of the dummy pattern formed in the multi-cavity printed wiring board of one Embodiment. FIG. 2D is an explanatory diagram of an example of a dummy post connected to the dummy pattern shown in FIG. 2E. Explanatory drawing of an example of the pattern of the 2nd surface of each printed wiring board shown by FIG. 1A. Explanatory drawing of an example of the pattern of the 1st surface of each printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Sectional drawing of the 1st conductor layer and conductor post in which the surface protective film is formed. Sectional drawing of the part by which the solder | pewter is apply | coated to the edge part of a conductor post. Sectional drawing of the panel of the multi-cavity printed wiring board of other embodiment of this invention. The figure which shows the example in which the dummy pattern was formed in the conventional dummy area | region.

  Next, a multi-piece printed wiring board according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1A shows a plan view of a panel having a plurality of multi-piece printed wiring boards, and the multi-piece printed wiring of one embodiment of a strip shape by being cut and separated along the cutting line DD. A plurality of plates 100 are obtained. Moreover, FIG. 1B is sectional explanatory drawing of a manufacturing middle process. In FIG. 1B, an example of a printed wiring board in which the same circuit pattern is formed on both sides of the support board 80 of the multi-cavity printed wiring board is described, but it is not limited to such an example. The wiring board having different circuit patterns can be formed on both sides of the support plate 80, or the wiring board can be formed only on one surface. Moreover, FIG. 1B is explanatory drawing in the middle of the manufacturing process of the 1B-1B cross section of FIG. 1A, Comprising: The state before passing through the process of removing the support plate 80 and the metal film 81 so that it may mention later is shown. . Therefore, a state in which the multi-cavity printed wiring board 100 is formed on both surfaces of the support plate 80 via the metal film 81 is shown, and the first surface SF1 side of the multi-cavity printed wiring board 100 is the center side, That is, it is located on the support plate 80 side.

  As shown in FIG. 1A, the multi-cavity printed wiring board 100 of this embodiment includes a product area 20 composed of a plurality of printed wiring boards 1a, 1b, 1c,... And one or more product areas 20. A medium-sized composite wiring board having a dummy area (strip area) 10 formed around it. As shown in FIG. 1B, a first surface SF1 and a second surface SF2 opposite to the first surface are formed. The resin insulating layer 30 is provided. In the product area 20, a first conductor layer 21 is formed so that only one surface is exposed on the first surface SF 1 side of the resin insulating layer 30, and the conductor post 25 connected to the first conductor layer 21. However, it is formed so as to penetrate the resin insulating layer 30 and to expose its end on the second surface SF2 side (see FIG. 4G). In the dummy area 10, the dummy pattern 11 is formed on the first surface SF <b> 1 side of the resin insulating layer 30 so as to go around the product area 20, and connected to the dummy pattern 11. However, it penetrates the resin insulating layer 30 and is formed so that the end portions are exposed independently from each other on the second surface SF2 side. As shown in FIG. 1E, the dummy post 12 is formed to be thinner than the conductor post 25. FIG. 1E is an example in which the dummy posts 12 are arranged in a dot pattern. In FIG. 1A, the dummy pattern 11 is drawn large for the sake of clarity, but the actual dummy pattern 11 is formed in a fine pattern similar to the dummy post 12 illustrated in FIG. 1E. .

  Here, the product area means an area where a plurality of printed wiring boards as products are arranged, and the dummy area means one or more product areas in which the printed wiring boards as products are not formed. It is a surrounding area and is a portion where a dummy pattern, also called a strip area, is formed. Further, the thickness of the post of the conductor post 25 or the dummy post 12 means the size of the outer shape of the post. When the cross section of the post is circular, its diameter is shown. When the cross section is rectangular or polygonal, its diagonal line is shown. When the cross section is elliptical, it means the dimension of the major axis.

  That is, a printed wiring board used for a package of a semiconductor device has a size of about 1 cm square, and a plurality of printed wiring boards are formed as a large panel at the manufacturing stage. It is made into a strip-like multi-piece printed wiring board, and after semiconductor elements are mounted, it is separated into individual printed wiring boards. To cut from this panel into strip-shaped printed wiring boards, it is cut with a router or a mold, but at that time, a crack runs on the resin insulation layer, and multiple printed wiring boards are formed. It may become defective collectively.

  An object of an embodiment of the present invention is that when a large-sized panel that collectively manufactures a plurality of printed wiring boards is cut into a medium-sized strip-shaped printed wiring board, the cracks are generated. It extends into the area and prevents the product from becoming defective.

  Another object is that the resin insulation layer of the printed wiring board is formed of a resin that does not include a core material such as glass fiber, and the wiring pattern is formed only on one surface of the resin insulation layer. In this case, even when a wiring pattern is not formed, it is possible to prevent defects associated with cracks during cutting. Yet another object is that when a large number of dummy posts that prevent the progress of cracks in the dummy area are formed with electroplated films together with the conductor posts in the product area, the height of each post is formed to be substantially uniform and more manufactured. It is an object of the present invention to provide a multi-piece printed wiring board having a structure that can be easily made and a method for manufacturing the same.

  For example, as shown in FIG. 2A, the dummy pattern 11 is independently formed in a dot pattern on the first surface SF1 of the dummy area 10 of the resin insulating layer 30 (see FIG. 1B) without being connected by wiring or the like. Has been. However, the present invention is not limited to this, and the dummy patterns 11 may be connected as will be described later. FIG. 2A shows a dummy pattern 11 having a hexagonal planar shape, but the shape of the dummy pattern is not limited to this, and it may be a triangle, a rectangle or a rhombus, a polygon more than that, It may be a cross shape or a circle or an ellipse. FIG. 2A shows an example in which all dummy patterns 11 are arranged in an intricate manner. That is, as shown in FIG. 2A, the dummy patterns are arranged in a so-called zigzag pattern in which two adjacent patterns are shifted by 1/2 pitch, or the patterns are arranged so as to bite each other. It is preferable to do. This is because, due to such an arrangement, the straight line passing through the gap portion of the dummy pattern 11 hits one of the dummy patterns 11 regardless of the direction, does not pass through the dummy area 10 and extend to the product area. It is. As a result, when a large-sized panel is cut into a medium-sized strip-shaped multi-piece printed wiring board 100, even if a crack occurs at the cut portion, the crack that has entered the edge 10a (see FIG. 1A) It is considered that the possibility of entering the product area 20 (see FIG. 1A) through the dummy area 10 by extending along the linear direction on the first surface SF1 can be prevented. However, as will be described later, the dummy pattern 11 is not limited to such a structure. For example, the dummy patterns 11 may be irregularly arranged or regularly arranged in a matrix.

  In many cases, cracks that enter when the panel 200 is cut into the strip-shaped medium-sized printed wiring board 100 are in particular on the first surface SF 1 side of the resin insulating layer 30. Therefore, it is preferable to provide such a dummy pattern 11 because the dummy pattern can easily prevent cracks from entering the product area 20. However, there is a possibility that cracks entering the intermediate portion in the thickness direction of the resin insulating layer 30 or the second surface SF2 side cannot be completely prevented from entering the product area 20. Therefore, in the present embodiment, not only the dummy pattern 11 is formed on the first surface SF1 of the resin insulating layer 30, but also the dummy posts 12 connected to the dummy pattern 11 penetrate the resin insulating layer 30. To be formed. By forming the dummy post 12 through the resin insulating layer 30, it is considered that it is easy to prevent the crack from entering any part of the resin insulating layer in the thickness direction. Therefore, the effect of preventing cracks from entering the product area 20 can be further improved.

  From this point of view, the dummy posts 12 penetrating the resin insulating layer 30 in the dummy area 10 are formed as many as possible with the same diameter (width) as the diameter (width) of the dummy pattern, so that a multi-piece printed wiring board is obtained. It is considered that the mechanical strength of 100 is improved and the penetration of cracks can be prevented. On the other hand, conductor posts 25 are also formed in the product area, and both of them can be formed by electroplating at the same time. If the number of dummy posts 12 increases and the total cross-sectional area of all the dummy posts 12 becomes too large, the current density during electroplating will be lower than that of the conductor posts 25. When the current density is lowered, the plating film formation speed is reduced, and therefore, it is considered that the height of the dummy post 12 and the height of the conductor post 25 vary. Therefore, it is preferable that the ratio of the total cross-sectional area of the dummy post 12 to the area of the dummy area 10 (remaining copper ratio) and the ratio of the total cross-sectional area of the entire conductor post 25 to the area of the product area 20 (remaining copper ratio) are substantially equal. . That is, the “remaining copper ratio” means the ratio of the total cross-sectional area of the conductor post or dummy post to the total area of the portion, and includes the case where the material of the conductor post or dummy post is not copper.

  Since both ends of the dummy post and the conductor post need to be exposed to the second surface SF2 side of the resin insulating layer 30, if the post height is too different due to the variation in the plating thickness, it is adjusted to the short post height. Therefore, it is necessary to polish a conductor post having a high post height. In this case, the polishing step for uniformly aligning the end surfaces of all the conductor posts 25 and the dummy posts 12 and the second surface SF2 of the resin insulating layer 30 becomes longer as the height difference between the two becomes larger. The potential for product damage during the polishing process may also increase. Therefore, it is necessary to make the thickness of electroplating, that is, the height of the conductor post 25 and the dummy post 12 as constant as possible. For this reason, the difference between the remaining copper ratio on the second surface SF2 side of the product area 20 and the remaining copper ratio on the second surface SF2 side of the dummy area 10 is preferably 10% or less. It is considered preferable that the thickness of is determined. As described above, in order to prevent the linear progression of cracks, it may be preferable that a large number of dummy posts 12 are formed in an intricate arrangement pattern. On the other hand, the necessary number of conductor posts 25 is provided according to the electric circuit in the printed wiring board. Therefore, in this embodiment, the dummy post 12 is formed smaller than the thickness of the conductor post 25 in order to reduce the difference in the remaining copper ratio between the product area 20 and the dummy area 10 while forming many dummy posts 12. In addition, it is preferable that the remaining copper ratio of the 2nd surface side of the resin insulation layer of dummy area 10 itself is 5 to 30%.

  The printed wiring board according to the present embodiment includes dummy posts 12 that are formed in connection with the dummy pattern 11 so that the end portions are exposed independently of each other on the second surface SF2 side of the resin insulating layer 30. The thickness of the post 12 is made smaller than the thickness of the conductor post 25 of the printed wiring board in the product area 20. FIG. 1E partially shows an example of the arrangement of the conductor posts 25 and the dummy posts 12 on the second surface SF2 of the resin insulating layer 30 of the multi-cavity printed wiring board 100 shown in FIG. 1A. In the example shown in FIG. 1E, the substantially circular ends of the dummy posts 12 are exposed on the second surface SF2 of the resin insulating layer 30 in a dot pattern arrangement. Of course, the arrangement of the conductor posts 25 and the shape of the dummy posts 12 are not limited to these, and can be variously formed as described later. However, the thickness of the dummy posts 12 is made smaller than the thickness of the conductor posts 25. As a result, the remaining copper ratio in the dummy area 10 becomes close to the remaining copper ratio in the product area 20, preventing cracks due to multiple printed wiring boards from entering the product area 20 and enhancing the strength of the printed wiring board. While having the effect, the conductor posts 25 and the dummy posts 12 having a uniform height can be formed by electroplating. That is, the dummy post 12 may provide desired mechanical strength and crack prevention effect to the multi-cavity printed wiring board 100, and the resin insulating layer polishing process in the manufacturing process may be completed in a short time. In addition, from the point that the remaining copper ratio of the dummy area 10 is not too high, preferably, one cross-sectional area of the dummy post 12 is 30 to 85% of one cross-sectional area of the conductor post 25. It is desirable. Although it is preferable that the cross-sectional areas of all the dummy posts 12 are within this range, the present invention is not limited to this, and, for example, a portion less than 30% or more than 85% may be included.

  In the example shown in FIG. 1A, the dummy pattern 11 is formed in an independent dot shape as described above. In this way, when the dummy pattern 11 is formed as an independent pattern instead of a continuous pattern like a wiring, the gas generated from the resin or the like when heated in the manufacturing stage is a continuous pattern. This is easier to remove than when the dummy pattern 11 is formed. In addition, problems such as the occurrence of warping and bending of the printed wiring board during manufacture are easily avoided. As described above, various shapes can be adopted as the planar shape of the dummy pattern 11. In FIG. 2A, the dummy pattern 11 is a hexagonal dot pattern as an example. In that case, the end side of the dummy post 12 may be a circular dot pattern as shown in an enlarged manner in FIGS. 1E and 2B. As described above, the shape of the dummy post 12 can be formed in various shapes such as a circle, a rectangle, a square (polygon), an ellipse, and a rectangle regardless of the shape of the dummy pattern 11, but in either case, It is formed on the second surface SF2 of the resin insulating layer 30 so as to be exposed independently, and is arranged in a dot pattern, for example. Further, the dummy post 12 can easily prevent the crack from entering the product area 20 even if a crack occurs when the large-sized panel 200 is cut into the medium-sized multi-piece printed wiring board 100. For example, it may be arranged in a so-called zigzag shape (staggered foot shape) that is formed in two or more rows and provided at a position shifted by a half pitch between the two rows. The remaining copper ratio, which is the ratio of the cross-sectional area of all the dummy posts 12 to the entire area of the dummy area 10, is preferably within 10% of the remaining copper ratio of the conductor posts 25 in the product area 20. It is formed. As a result, even if both the conductor posts 25 and the dummy posts 12 are formed simultaneously by electroplating, the heights of both are formed substantially the same, and these end portions 25 a and 12 b are formed on the second surface of the resin insulating layer 30. The amount of polishing the resin insulating layer may be reduced so as to be exposed to SF2.

  Unlike the example shown in FIG. 2A, the dummy pattern 11 may be a pattern in which independent patterns are connected, or a pattern that is continuous over a certain range. 2C and 2E show other examples of such a dummy pattern 11, respectively. FIGS. 2D and 2F are respectively connected to the dummy pattern 11 illustrated in FIG. 2C or FIG. 2E. An example of a dummy post 12 is shown. In the example shown in FIG. 2C, the dummy pattern 11 is formed as a matrix in which individual patterns 11b having an independent substantially square shape are vertically and horizontally aligned, and each individual pattern 11b is connected by a connection pattern 11c. Has been. When the dummy pattern 11 is formed as shown in FIG. 2C, the dummy pattern 11 prevents the crack from progressing in any direction in the vicinity of the occurrence location, regardless of the portion of the dummy area 10 where the crack occurs. obtain. Furthermore, since the dummy pattern 11 exists over the entire area of the partial dummy area 10, it is considered that the multiple printed wiring board 100 is unlikely to warp. For example, as shown in FIG. 2D, the dummy post 12 formed by connecting to the dummy pattern 11 is formed at a position corresponding to the individual pattern 11 b, that is, connected to the individual pattern 11. Alternatively, instead of or in addition to the dummy posts 12 connected to the individual patterns 11b, dummy posts 12 connected to the connection patterns 11c may be formed.

  In addition, FIG. 2E shows an example of a dummy pattern 11 d that is continuous so as to surround the product area 20. For example, when there is no problem of warping or the like in the multi-cavity printed wiring board 100, it is preferable that the dummy pattern 11d is continuously formed in this manner because the room for progress of cracks is further reduced. . The arrangement of the dummy posts 12 formed by connecting to the dummy pattern 11 illustrated in FIG. 2E is not particularly limited as long as it is a position on the dummy pattern 11. For example, as shown in FIG. 2F, the dummy pattern 11 d One or a plurality of rows may be formed in a row along the line. When formed in a plurality of rows, a staggered arrangement may be used as described above. In both the examples shown in FIGS. 2D and 2F, the dummy posts 12 are formed so as to be exposed on the second surface of the resin insulating layer 30 independently, and the thickness of the conductor posts 25 in the product area 20 is increased. It is formed smaller than this. 2D and 2F are examples of the dummy post 12 having a substantially circular end, but the dummy post 12 may have any other shape as described above.

  The printed wiring board can be applied to various structures. For example, FIG. 1B can be applied to a structure in which a 1B-1B cross-sectional explanatory view of FIG. In this structure, the dummy pattern 11 is mounted on the first surface SF <b> 1 of the resin insulating layer 30 in the dummy area 10 on the printed circuit boards 1 a, 1 b, 1 c in the product area 20, and semiconductor elements (not shown) are mounted. It is formed simultaneously with the first conductor layer 21 having the second pattern 21b, the first pattern 21a on which the conductor posts 25 are formed, and the like. Further, the outermost resin insulating layer which is the outermost layer of the laminated resin insulating layer 31 (see FIG. 6) laminated on the second surface SF2 or the second surface SF2 opposite to the first surface SF1 of the resin insulating layer 30. A wiring pattern is not formed on the exposed surface, and only the end portion 25a of the conductor post 25 (see FIG. 4G) connected to the conductor layer on the first conductor layer 21 side is exposed. A dummy post 12 is formed in connection with the dummy pattern 11 in the dummy area 10. The relationship between the dummy pattern 11 and the dummy post 12 is as described above, and regardless of the shape of the dummy pattern 11, each end face of the dummy post 12 is independently exposed to the second surface SF2 side. Ideally, it is desirable that the dummy post 12 is formed so that a straight line does not pass through the gap portion and does not come out into the product area. Otherwise, most of the generated cracks are prevented. If this can be done, it is possible to avoid defective printed wiring boards in the product area. If the number of dummy posts 12 is increased, the probability of blocking can be increased. However, if the above-mentioned remaining copper ratio is too larger than the remaining copper ratio of the product area 20, there is a problem that the height of the posts varies. Since it is likely to occur, it is determined by the balance between the two.

  That is, as described above, the printed wiring board having a structure in which the wiring pattern is formed only on one surface of the resin insulating layer 30 and only the conductor post 25 is exposed on the other surface side is cracked at the edge 10a. Is easy to extend to the product area 20, an example of which is shown. Note that the second surface SF2 side of the resin insulating layer 30 is connected to a motherboard or the like via the conductor post 25. However, as described above, the printed wiring board to which the structure having the dummy posts 12 of the present embodiment is applied is not limited to such a printed wiring board in which a wiring pattern is formed only on one side. The method for manufacturing the printed wiring board 100 will be described in detail later, but there are two methods for cutting the panel from the panel into the multi-piece printed wiring board 100. Is done.

  First, FIG. 1B shows an explanatory diagram of the 1B-1B cross section of FIG. 1A in the state of the final manufacturing process. That is, it is not a complete cross-sectional view, but is a view of only a main part partially omitted, and the dummy pattern 11 and the dummy post 12 are shown in only one row. As described above, the first conductor layer 21 and the resin insulating layer 30 are laminated on the support plate 80 via the metal film 81, and finally the support plate 80 is removed to form a printed wiring board. The support plate 80 is, for example, bonded to the dummy substrate 80a (see FIG. 4A), for example, the carrier copper foil 80b side of the metal film 81 with the carrier copper foil 80b. Then, the first conductor layer 21 including the second pattern 21b and the like is formed on the metal film 81 together with the dummy pattern, and the dummy post 12 is formed together with the conductor post (not shown), and is embedded by the resin insulating layer 30. It has a structure.

  Thereafter, when the support plate 80 is peeled off, a large panel formed on both surfaces of the support plate 80 is obtained. In the state where the large panel 200 is formed, the first method is to cut along the DD line. FIG. 1C shows a state in which the support plate 80 is peeled and the metal film 81 is further removed and then cut. In this way, cutting is easy, but the thin large panel 200 must be handled, so it is necessary to proceed with caution.

  On the other hand, the second method is to cut from the state of FIG. This is shown in FIG. 1D. That is, FIG. 1D shows a state of being cut and separated in the state of FIG. 1B. Thereafter, the strip-shaped multi-cavity printed wiring board 100 is peeled off from the support plate 80 to become the respective multi-cavity printed wiring boards 100. After this, etching removal of the metal film 81 described later is performed. With this method, the handling during the cutting operation is easy, but the work of peeling the multi-piece printed wiring board 100 from the support plate 80 and the removal of the metal film 81 are the medium size of each of the multi-piece printed wiring boards 100. Since it is necessary to do by size, man-hours are required.

  Also, the resin insulating layer 30 is not particularly limited, but as described above, cracks tend to extend when a core material such as glass fiber is not contained. This is thought to be because cracks tend to stop if there is a core material, but there is no place to stop if there is no core material, and the crack progresses. Therefore, this embodiment is particularly effective when a resin containing no core material is used. Examples of the resin that does not contain the core material include a resin film for interlayer insulation (a film formed only with an inorganic filler and a resin composition) or a mold resin (a resin that is poured into a mold and hardened). Either of them is acceptable. However, the present embodiment is not limited to the resin without the core material, and the effect of the present embodiment can be achieved even with the resin with the core material. In addition, it is preferable that the inorganic filler impregnated in the resin insulating layer 30 is contained in an amount of 70 to 90% by weight. Further, when a molding resin is used, when a molding resin material having a thermal expansion coefficient of 3 to 120 ppm / ° C. and an elastic modulus of 0.01 to 30 GPa is used, it is mounted on the printed wiring board 100. This is preferable because a large thermal stress is unlikely to be generated at a joint portion of an electronic component.

  As described above, in this embodiment, the dummy pattern 11 is formed in the dummy area 10, and the dummy post 12 is further formed to have a smaller thickness than the conductor post 25 in the product area 20. As a result, when the panel 200 is cut into the multi-piece printed wiring board 100, for example, even when the edge 10a of the multi-piece printed wiring board 100 is cracked, the crack is generated in the product area 20. It is considered that the conductor post 25 and the dummy post 12 having a uniform height can be manufactured with less process time while being able to suppress intrusion.

  An example of the pattern of each printed wiring board 1 constituting the multi-cavity printed wiring board 100 is shown in FIGS. 3A shows an arrangement example of the resin insulation layer 30 of the conductor post 25 of the printed wiring board 1 on the second surface SF2, and FIG. 3B shows an arrangement example of the first surface SF1 of the resin insulation layer 30. Yes. As shown in FIG. 3A, conductor post rows 26 formed by arranging a plurality of conductor posts 25 in one direction may be formed in two rows along each side of the printed wiring board 1. Three or more conductor post rows 26 may be juxtaposed. As shown in FIG. 3A, the conductor post rows 26 are spaced apart from the conductor post rows 26 formed along each side, and in a lattice form at the center. A conductor post 25 may be disposed. Further, for example, the resin insulating layer 30 may be formed in a lattice shape over the entire second surface SF2. Although not shown in FIG. 3A, the dummy posts 12 of the aforementioned dummy area 10 are formed simultaneously with the conductor posts 25.

  The first conductor layer 21 on the first surface SF1 side of the resin insulating layer 30 of each printed wiring board 1 shown in FIG. 3A includes, for example, first and second patterns 21a and 21b as shown in FIG. 3B. And the wiring pattern 21d which connects the 1st pattern 21a and the 2nd pattern 21b may be formed. That is, the conductor post 25 shown in FIG. 3A is formed on the surface (second surface SF2) opposite to the surface (first surface SF1) shown in FIG. 3B of each first pattern 21a. . In the example shown in FIG. 3B, the second pattern 21b is a connection pad 21c to which a semiconductor element (not shown) is connected. For example, the second pattern 21b is electrically connected to an electrode such as an IC chip by a solder bump or a bonding wire. . FIG. 3B is an example of a connection pad 21c connected to a semiconductor element in which electrodes are arranged on each of four sides of a rectangular outer shape, and four connection pad rows in which the connection pads 21c are arranged at a constant pitch. However, they are arranged so as to form a rectangle as a whole. Further, the connection pad 21c (second pattern 21b) and the first pattern 21a formed around the connection pad 21c are connected by a wiring pattern 21d. Thereby, the electrode of the semiconductor element (not shown) can be electrically connected to another wiring board such as a mother board (not shown) via the conductor post 25. Note that each pattern of the first conductor layer 21 shown in FIG. 3B is merely an example, and an arbitrary conductor pattern may be formed according to an electric circuit formed in the printed wiring board 1.

  Next, the first conductor layer 21 is formed on the first surface SF1 of the resin insulating layer 30 described above, and the second surface SF2 side is a printed wiring board in which only the conductor posts 25 are exposed. In the example in which the dummy pattern 11 and the dummy post 12 are formed in the dummy area 10 provided in FIG. 4, the manufacturing method will be described with reference to FIGS. 4A to 4G are the main parts, the central part is omitted, and the first conductor layer 21 is also shown in a simplified manner. One dummy pattern 11 and one dummy post 12 are also provided on each side. It is shown.

  First, as shown in FIG. 4A, a metal film 81 is prepared. Specifically, as a starting material, a support plate 80 and a metal film 81 made of a dummy substrate 80a and a carrier copper foil 80b are prepared, and carrier copper foil 80b is laminated on both sides of the dummy substrate 80a, and is pressed and heated. By being joined together, the support plate 80 is formed, and the metal film 81 is bonded to the carrier copper foil 80b of the support plate 80. The carrier copper foil 80b may be bonded to the metal film 81 in advance, and the carrier metal foil 80b side of the metal film 81 with the carrier copper foil 80b may be attached to the dummy substrate 80a of the support plate 80. The support plate 80 is preferably made of a semi-cured prepreg material made of a material in which a core material such as glass cloth is impregnated with an insulating resin such as epoxy containing an inorganic filler, but is not limited thereto. Instead, other materials may be used. As the material of the metal film 81, a material on which the first conductor layer 21 can be formed is used, and a copper foil having a thickness of about 1 to 3 μm is preferably used. The carrier copper foil 80b is, for example, a copper foil having a thickness of about 15 to 30 μm, preferably about 18 μm. However, the thickness of the carrier copper foil 80b is not limited to this, and may be another thickness.

  The method for joining the carrier copper foil 80b and the metal film 81 is not particularly limited. For example, the carrier copper foil 80b may be bonded to a substantially adhesive surface of the both surfaces by an easily peelable thermoplastic adhesive, In a blank portion near the outer periphery where the conductor pattern of one conductor layer 21 is not provided, the conductor pattern may be bonded by an adhesive or ultrasonic connection. For example, a double-sided copper-clad laminate may be used for the support plate 80, the surface copper foil may be the carrier copper foil 80b, and the single metal film 81 may be bonded thereon using the method described above.

  4A to 4E, the metal film 81 is bonded to both surfaces of the support plate 80, and the first conductor layer 21, the conductor post 25, the dummy post 12, and the resin insulating layer 30 are formed on each surface. An example of the method is shown. If it manufactures by such a method, it is preferable at the point that the 1st conductor layer 21, the conductor post 25, the dummy post 12, etc. are formed simultaneously. However, the first conductor layer 21 or the like may be formed only on one surface of the support plate 80, or conductor layers having different circuit patterns may be formed on both sides. In the following description, since the same circuit pattern is formed on both surfaces, only one surface will be described, the description on the other surface side will be omitted, and some of the reference numerals on the other surface side in each drawing are also partly described. It is omitted.

  Next, wiring patterns 21 a and 21 b and a dummy pattern 11 of the first conductor layer 21 for a multi-piece printed wiring board are formed on the metal film 81. The method for forming the wiring patterns 21a and 21b and the dummy pattern 11 of the first conductor layer 21 is not particularly limited. For example, an electroplating method is used. In this case, first, a resist material (not shown) is applied or laminated on the entire surface of the metal film 81 and patterned to form a predetermined region other than the portion where the first conductor layer 21 and the dummy pattern 11 are formed. A plating resist film (not shown) is formed. Subsequently, for example, a plating layer by electroplating is formed on the exposed surface of the metal film 81 on which the plating resist film is not formed using the metal film 81 as a seed layer (feeding layer) for electroplating. Thereafter, the plating resist film is removed. As a result, as shown in FIG. 4B, the first pattern 21a (pattern on which the conductor post 25 is formed), the second pattern 21b (pad on which a semiconductor element or the like is mounted) and the like are formed. The conductor layer 21 and the dummy pattern 11 are formed on the metal film 81 with a predetermined circuit pattern. The first conductor layer 21 is preferably made of the same material as the conductor posts 25 and dummy posts 12 described later, and is preferably made of copper. The first conductor layer 21 and the dummy pattern 11 can be preferably formed to a thickness of about 5 to 30 μm, but are not limited thereto.

  Next, as shown in FIG. 4C, the conductor posts 25 and the dummy posts 12 are respectively formed on the partial patterns 21 a and the dummy patterns 11 of the first conductor layer 21. Specifically, the conductor post 25 is formed on the first pattern 21 a of the first conductor layer 21, and the dummy post 12 having a smaller thickness than the conductor post 25 is formed on the dummy pattern 11. That is, first, a surface (exposed surface) opposite to the surface of the first conductor layer 21 and the dummy pattern 11 that is in contact with the metal film 81, where the conductor post 25 and the dummy post 12 are formed. A plating resist film (not shown) is formed on the metal film 81 which is exposed without being covered with the first conductor layer 21 and the dummy pattern 11 except for the part. In order to form the dummy post 12 whose thickness is smaller than that of the conductor post 25, the opening of the plating resist film on the dummy pattern 11 for forming the dummy post 12 is formed on the conductor post on the first pattern 21a. 25 is formed smaller than the opening for formation. The plating resist film is formed to a thickness of at least about 10 to 150 μm. Subsequently, a plating layer by electroplating is formed in the opening portion of the plating resist film on the first pattern 21a and the dummy pattern 11 using the metal film 81 as an electroplating seed layer (power feeding layer). Thereafter, the plating resist film is removed. As a result, as shown in FIG. 4C, a conductor post 25 made of an electroplating layer is formed on the exposed surface of the first pattern 21a, and similarly compared with the conductor post 25 on the exposed surface of the dummy pattern 11. A dummy post 12 having a small thickness is formed. The conductor posts 25 and the dummy posts 12 are preferably made of the same material as that of the first conductor layer 21 and are preferably made of copper. The conductor posts 25 and the dummy posts 12 can be preferably formed to a thickness of about 10 to 150 μm, but are not limited thereto. In the present embodiment, since the thickness of the dummy post 12 is smaller than the thickness of the conductor post 25, as described above, the remaining copper ratio on the second surface SF2 side of the product area 20 and the dummy area 10 The difference from the remaining copper ratio on the second surface SF2 side is small, preferably 10% or less, and the heights of the conductor posts 25 and the dummy posts 12 formed simultaneously by electroplating are substantially the same. As a result, the time required for the polishing step of the resin insulating layer 30 for exposing the ends of the conductor posts 25 and the dummy posts 12 described later can be shortened.

  Although not shown in the figure after the conductor posts 25 and the dummy posts 12 are formed, the side surfaces of the conductor posts 25 and the dummy posts 12 and the first conductors are preferably used in order to improve the adhesion to the resin insulating layer 30 described later. A roughening process is performed on the side surface of the layer 21 and the exposed surface of the portion where the conductor post 25 and the dummy post 12 are not formed. The method of roughening treatment is not particularly limited, and examples thereof include soft etching treatment and blackening (oxidation) -reduction treatment. Each surface to be roughened is preferably processed to a surface roughness of 0.1 to 1 μm in arithmetic mean roughness. Further, when a roughening process is performed, an annealing process for growing an electroplated copper crystal may be performed between the removal of the plating resist film 85 and the roughening process in order to stabilize the roughening.

  Next, as illustrated in FIG. 4D, the resin insulating layer 30 is formed so as to cover the exposed surface of the first conductor layer 21, the side surface of the conductor post 25, and the side surface of the dummy post 12. Specifically, although not shown, a sheet-like or film-like insulating material (prepreg) is laminated on the conductor post 25 and the dummy post 12, and is pressurized and heated toward the support plate 80 side. The The insulating material is softened by heating and flows between the first pattern 21a and the second pattern 21b, between the second patterns 21b, and between the conductor posts 25 and the dummy posts 12, and is in a semi-cured state. Thereafter, the insulating material is completely cured by further heating, and as shown in FIG. 4D, the resin insulating layer 30 is formed, and the first pattern 21a, the second pattern 21b, the conductor post 25, and the dummy post 12 are formed. Embedded in the resin insulating layer 30. Thus, the method of forming the resin insulating layer 30 by laminating sheet-like or film-like insulating materials is preferable in that the resin insulating layer 30 can be formed by a general printed wiring board manufacturing facility. After the resin insulating layer 30 is formed, buffing is preferably performed to remove burrs generated when the resin insulating layer 30 is formed.

  Next, as shown in FIG. 4E, the ends of the conductor posts 25 and the dummy posts 12 are exposed by polishing the second surface SF2 side of the resin insulating layer 30. Specifically, on the side (exposed surface side) opposite to the metal film 81 side of the resin insulating layer 30, preferably, the tips of all the conductor posts 25 and the dummy posts 12 are exposed to the second surface SF2 side of the resin insulating layer 30. Until then, polishing is performed by buff polishing or chemical mechanical polishing (CMP). More preferably, it is further polished to a predetermined height. At this time, if the heights of the conductor posts 25 and the dummy posts 12 are not uniform, the end of the shortest conductor post 25 is exposed, and the amount of polishing (polishing length) until reaching a predetermined height increases. It is considered that a long polishing time is required. On the other hand, as described above, in the present embodiment, the remaining copper ratio on the second surface SF2 side of the dummy area 10 is close to the remaining copper ratio on the second surface SF2 side of the product area 20, so the heights are uniform. The conductor post 25 and the dummy post 12 are formed by electroplating. As a result, the polishing process may be short, reducing manufacturing costs and reducing the possibility of damage during polishing.

  Next, the support plate 80 is peeled off, the metal film 81 is further removed, and cutting or separation into a multi-piece printed wiring board including one or two or more product areas is performed first. The support plate 80 and the metal film 81 are removed and cut and separated along the line DD in FIG. 1A. That is, there are two timings for cutting the multi-piece printed wiring board 100 from the panel 200 as described with reference to FIGS. 1C and 1D described above, but any one of the methods is used. When the separation of the support plate 80 is performed first, for example, as shown in FIG. 4F, first, the support plate 80 and the metal film 81 are separated. Specifically, for example, the entire printed wiring board in the process is heated, and a thermoplastic adhesive (not shown) that joins the carrier copper foil 80b of the support plate 80 and the metal film 81 is softened. A force in a direction along the interface with the metal film 81 is applied to the carrier copper foil 80b of the support plate 80, and the carrier copper foil 80b and the metal film 81 are separated. Alternatively, as described above, when both are bonded by an adhesive or ultrasonic connection in a blank portion near the outer periphery, the support plate 80 and the metal film 81 are on the inner peripheral side of the bonding portion, and the resin insulating layer 30. The carrier copper foil 80b and the metal film 81 may be separated by cutting together with an adhesive or the like and cutting off the joint portion by an adhesive or the like. As a result, two printed wiring board panels 200 formed on both sides of the support plate 80 at the center are obtained. FIG. 4F shows the state, and only the in-process product of the panel 200 shown on the lower surface side of the support plate 80 in FIG. 4E is shown.

  Subsequently, as shown in FIG. 4G, the metal film 81 is removed, for example, by etching or the like. As described above, when copper is used for the metal film 81, the first conductor layer 21, the conductor post 25, the dummy pattern 11, and the dummy post 12, all the constituent materials are dissolved in the same etching solution. Is done. For this reason, when the metal film 81 is etched, the surfaces of the conductor post 25 and the dummy post 12 exposed to the second surface SF2 side of the resin insulating layer 30 are exposed to the etching solution, so that the conductor post 25 together with the metal film 81 is exposed. The tip portion of the dummy post 12 is also etched. Even after all the metal film 81 is removed, the exposed surface of the first conductor layer 21 and the dummy pattern 11 exposed on the first surface SF1 of the resin insulating layer 30 by the removal of the metal film 81, and the conductor post 25 are removed. The tip portion 25a and the tip portion 12b of the dummy post 12 are etched by being exposed to an etching solution. As a result, as shown in FIG. 4G, the exposed surface of the first conductor layer 21 and the exposed surface of the dummy pattern 11 are recessed from the first surface SF1 of the resin insulating layer 30, and the end 25a of the conductor post 25 and the dummy post 12, the end 12b of the resin insulation layer 30 is recessed from the second surface SF2, and the recess of the end 25a of the conductor post 25 from the second surface SF2 of the resin insulation layer 30 is the first conductor layer 21. It becomes larger than the dent from the first surface SF1 of the resin insulating layer 30. The cutting from the panel 200 to the multi-piece printed wiring board 100 may be performed with the metal film 81 shown in FIG. 4F remaining, or after the metal film 81 after FIG. 4G is removed. May be. This method is the method shown in FIG. 1C described above. In FIG. 1C, dents such as the surface of the first conductor layer 21 from the first and second surfaces SF1 and SF2 of the resin insulating layer 30 and the end surface 25a of the conductor post 25 are omitted.

  On the other hand, in the method shown in FIG. 1D, the step of FIG. 4E is followed by cutting along the line DD in FIG. 1A, and thereafter, the support plate 80 is removed and the metal film 81 is removed by etching. Thus, a multi-piece printed wiring board 100 is obtained.

  After the removal of the metal film 81, the surface protective film 28 (see FIG. 5A) is preferably formed on the exposed surface of the first conductor layer 21 and the dummy pattern 11, the end 25a of the conductor post 25, and the end 12b of the dummy post 12. It is formed. The surface protective film 28 may be formed by forming a plurality of or a single metal film such as Ni / Au, Ni / Pd / Au, or Sn by a plating method. Further, the OSP may be formed by immersion in a liquid protective material or spraying of the protective material. The surface protective film 28 may be formed on both the exposed surface of the first conductor layer 21 and the end portion 25a of the conductor post 25, or may be formed on only one of them. Further, the surface protective film 28 may not be formed on the surface of the dummy pattern 11 or the end portion 12 b of the dummy post 12. Furthermore, a surface protective film made of a different material may be formed on the exposed surface of the first conductor layer 21 and the end portion 25a of the conductor post 25.

  Further, in addition to the formation of the surface protective film, or without the surface protective film being formed, a bonding material layer made of a bonding material for bonding the conductor post 25 to an external motherboard or the like on the end portion 25a of the conductor post 25. 27 (see FIG. 5B) may be formed. Solder is preferably used as the material of the bonding material layer 27, and may be formed by applying paste-like solder or placing a solder ball, and once cured after being melted or using a plating method. However, the material and forming method of the bonding material layer are not particularly limited, and other materials and methods can be used.

  By passing through the above process, the multi-piece printed wiring board 100 cut | disconnected by the DD line | wire of FIG. 1A is completed. That is, the dummy pattern 11 formed on the first surface SF1 of the resin insulating layer 30 and the resin insulating layer 30 are penetrated into the dummy area 10 and the end portions 12b on the second surface SF2 side independently of each other, for example, dots A medium-sized multi-piece printed wiring board is obtained in which dummy posts 12 having a thickness smaller than the thickness of the conductor posts 25 connected to the dummy patterns 11 so as to be exposed are formed.

  The first conductor layer 21 is entirely embedded on the first surface SF1 side of the resin insulating layer 30 so that one surface is exposed on the first surface SF1 side of the resin insulating layer 30. That is, the first conductor layer 21 and the resin insulating layer 30 are formed not only on the other surface of the first conductor layer 21 but also on the side surface of the first conductor layer 21, specifically, on the first conductor layer 21. Also in contact with the side surfaces of the first pattern 21a and the second pattern 21b. Therefore, even when the first pattern 21a and the second pattern 21b are formed with a fine pitch and the area of one surface of the first conductor layer 21 is reduced, the adhesion between the first conductor layer 21 and the resin insulating layer 30 is maintained. Can be done. Further, since the first conductor layer 21 is embedded in the resin insulating layer 30, the printed wiring board 1 itself can be thinned.

  As described above, the first conductor layer 21 is formed with the first pattern 21a and the second pattern 21b. In the present embodiment, the first pattern 21a is electrically connected to another printed wiring board (not shown) connected to the printed wiring board 1 on the second surface SF2 side of the resin insulating layer 30. It is a wiring pattern. Here, the other printed wiring board may be a mother board such as an electronic device in which the printed wiring board 1 is used, or a laminate of an insulating layer and a conductor layer that constitutes a multilayer wiring board together with the printed wiring board 1. It may be a body. The second pattern 21b may be a connection pad to which, for example, a semiconductor element (not shown) is connected. Furthermore, the dummy pattern 11 is formed in the above-described dummy area 10 and also serves as a base when the dummy post 12 is formed. The first conductor layer 21 may be formed with a wiring pattern other than the first and second patterns 21a and 21b. For example, the electrode of the semiconductor element connected to the second pattern 21b that is electrically connected to the outside is formed on the first conductor layer 21 so as to connect the second pattern 21b and the first pattern 21a. The first pattern 21a and the conductor post 25 are electrically connected via the wiring pattern 21d (see FIG. 3B).

  The example shown in FIGS. 4A to 4G is an example in which the first conductor layer 21 is formed on one side having only one insulating layer. However, a conductor layer is further provided on the second surface SF2 side of the resin insulating layer 30. When the conductor layer is not formed on the lower end side of the outermost (lowermost) resin insulation layer, cracks are likely to run in the resin insulation layer as well. Therefore, even when the resin insulating layers are laminated in multiple layers, it is preferable that a dummy post is formed in the dummy area of the lowermost resin insulating layer. In this case, the resin insulating layer other than the lowermost layer may have a conductor layer formed on only one side or a conductor layer formed on both sides. In short, one surface of the resin insulating layer has a conductor on It is preferable that a dummy post is formed in a dummy area on the outer periphery of the resin insulating layer in which only the conductor post is exposed without forming the layer. Of course, it is preferable that the conductor post and the conductor pattern are provided also in the resin insulating layer when the conductor layers are provided on both surfaces.

  In FIG. 6, the second conductor layer 22 is formed on the second surface SF2 side of the resin insulating layer 30, and the second resin insulating layer 31 is formed on the surface thereof. The second conductor post 29 and the second dummy post 12a are formed so as to be connected to the two conductor layer 22, and the two conductor layers are formed on the exposed surface SF3 side of the second resin insulating layer 31 which is the outermost layer. A printed wiring board is shown in which no conductor layer is formed and only the second post 29 is exposed.

  In order to manufacture such a printed wiring board, following the process of FIG. 4E described above, for example, a metal film is formed on the second surface SF2 of the resin insulating layer 30 by an electroless plating method. Then, the pattern of the second conductor layer 22 and the second conductor post 29 and the second dummy post 12a are formed by the electroplating film, and the second resin insulating layer 31 is formed thereon in the same manner as shown in FIGS. 4D and 4E. After that, as in FIG. 4F, the support plate 80 is removed, the metal film 81 is further removed, and before or after the support plate 80 and the metal film 81 are removed, the panel state is cut into a medium-sized substrate. Is formed.

  In addition, regarding a manufacturing method, it is not limited to this method, A various method can be employ | adopted. For example, when the resin insulating layer 30 is formed, a metal foil such as a copper foil and a resin film may be press-heated, and the second conductor post 29 and the second dummy post 12a may be formed in the first step. After the two resin insulation layers 31 are formed, an opening may be formed so that the second conductor post 29 and the second dummy post 12a are embedded in the opening. Furthermore, when a multilayer printed wiring board is formed, a desired multilayer printed wiring board can be formed by repeating these steps.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 10 Dummy area 11 Dummy pattern 12 Dummy post 12b End part of dummy post 20 Product area 21 1st conductor layer 21a 1st pattern 21b 2nd pattern 25 Conductor post 25a End part of conductor post 27 Bonding material layer 28 Surface Protective film 30 Resin insulating layer 80 Support plate 80a Dummy substrate 80b Carrier copper foil 81 Metal film SF1 First surface of resin insulating layer SF2 Second surface of resin insulating layer

Claims (19)

A multi-piece printed wiring board having a product area composed of a plurality of printed wiring boards and a dummy area formed around one or more of the product areas,
A resin insulation layer having a first surface and a second surface opposite to the first surface, and each printed wiring board in the product area is exposed only on the first surface side of the resin insulation layer. A first conductor layer embedded so as to have a conductor post connected to the first conductor layer and penetrating through the resin insulating layer and having an end exposed on the second surface side;
The dummy area includes a dummy pattern formed on the first surface of the resin insulating layer, the dummy pattern penetrating through the resin insulating layer, and having end portions exposed independently of each other on the second surface side. A dummy post to be connected,
The thickness of the dummy post is smaller than the thickness of the conductor post. 2. The printed wiring board according to claim 1, wherein a cross-sectional area of one of the dummy posts is 30 to 85% of a cross-sectional area of one of the conductor posts. It is a printed wiring board of Claim 1 or 2, Comprising: In the said 2nd surface, the difference of the remaining copper rate of the said dummy area and the remaining copper rate of the said product area is 10% or less. It is a printed wiring board of any one of Claims 1-3, Comprising: The said dummy pattern is circular, an ellipse, a rhombus, or a polygon, and it arranges each independently. It is a printed wiring board of any one of Claims 1-4, Comprising: The said resin insulation layer is formed with resin which does not contain a core material. It is a printed wiring board of any one of Claims 1-5, Comprising: The laminated resin insulating layer is further formed in the said 2nd surface of the said resin insulating layer, Outermost layer resin of this laminated resin insulating layer A dummy post is exposed in the insulating layer. It is a printed wiring board of any one of Claims 1-6, Comprising: Both the said conductor post and the said dummy post are formed with the electroplating film. It is a printed wiring board of any one of Claims 1-7, Comprising: The remaining copper rate of the said dummy area is 5 to 30% on the 2nd surface side of the said resin insulation layer. It is a printed wiring board of any one of Claims 1-8, Comprising: The height of the said conductor post and the said dummy post is 10-150 micrometers, and the thickness of the said 1st conductor layer is 5-30 micrometers. is there. 10. The printed wiring board according to claim 1, wherein the resin insulating layer has a coefficient of thermal expansion of 3 to 120 ppm / ° C. and an elastic modulus of 0.01 to 30 GPa. Made of resin material. It is a printed wiring board of any one of Claims 1-9, Comprising: The said resin insulating layer contains 70 to 90 weight% of inorganic fillers. It is a printed wiring board of any one of Claims 1-11, Comprising: The roughening process which roughens surface roughness is given to the side surface of the said conductor post and / or the said dummy post. It is a printed wiring board of any one of Claims 1-12, Comprising: The surface protection film is formed in the said edge part of the said conductor post. 14. The printed wiring board according to claim 13, wherein a surface protection film made of a material different from a material of the surface protection film formed on the end portion of the conductor post is formed on the exposed surface of the first conductor layer. ing. It is a printed wiring board of any one of Claims 1-14, Comprising: Solder is apply | coated to the said edge part of the said conductor post. The printed wiring board according to claim 1, wherein the dummy posts are formed in at least two rows, and the dummy posts are arranged in a staggered manner. A method of manufacturing a multi-piece printed wiring board having a product area including a plurality of printed wiring boards and a dummy area formed around one or more of the product areas,
Preparing a metal film,
Forming a wiring pattern of the first conductor layer and a dummy pattern for a plurality of multi-cavity printed wiring boards on the metal film;
Forming a conductor post and a dummy post on the partial pattern of the first conductor layer and the dummy pattern, respectively;
Forming a resin insulating layer so as to cover the exposed surface of the first conductor layer and the side surfaces of the conductor post and the dummy post;
Polishing the second surface side of the resin insulating layer to expose the ends of the conductor post and the dummy post;
Removing the support plate and the metal film, and cutting and separating into a multi-piece printed wiring board including one or two or more product areas, in the order in which one is performed,
Including
The dummy area has a dummy post that is thinner than the conductor post. 18. The method for manufacturing a multi-cavity printed wiring board according to claim 17, wherein the conductor post and the dummy post are simultaneously formed by electroplating. 19. The method of manufacturing a multi-cavity printed wiring board according to claim 17 or 18, wherein a roughening process is performed on side surfaces of the conductor post and the dummy post before the resin insulating layer is formed.

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