JP2016143726A - Printed wiring board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent cracks from extending into a product area and a product from being failed when cut to a multiple piece printed wiring board from a panel which manufactures a plurality of printed wiring boards in bulk.SOLUTION: A multiple piece printed wiring board 100 includes: a product area 20 composed of a plurality of printed wiring boards; and a dummy area 10 formed around one or two or more product areas 20. On an outer peripheral end edge side of the dummy area 10, a dummy pattern 11 is formed, and a dummy post or a dummy wall 12 is formed while connected only to a part of the dummy pattern 11.SELECTED DRAWING: Figure 1B

Description

  The present invention relates to a printed wiring board and a manufacturing method thereof.

  Patent Document 1 discloses forming copper patterns of various shapes in a dummy region around a package region (product region). That is, as shown in FIG. 7, a dummy wiring formed by a wiring 91 parallel to the product region 90 and a wiring 92 perpendicular to the product region 90 is formed.

JP 2007-19496 A

  However, even if the dummy wiring 91 is formed on one surface of the resin insulating layer, when the resin insulating layer is cut, an impact is applied to the entire thickness of the resin insulating layer. Therefore, a crack may enter from not only the surface but also from the middle part of the thickness of the resin insulating layer, and the crack may extend in the horizontal direction and the vertical direction. Therefore, even if the dummy wiring layer is formed on the surface, the crack may reach the product area and the product may be defective.

  The multi-cavity printed wiring board of the present invention has a product area composed of a plurality of printed wiring boards and a dummy area formed around one or more of the product areas. The multi-cavity printed wiring board of the present invention includes a resin insulating layer having a first surface and a second surface that is the opposite surface of the first surface. Furthermore, each printed wiring board in the product area is connected to the first conductor layer, the first conductor layer embedded so that only one surface is exposed on the first surface side of the resin insulation layer, and the resin insulation layer A conductor post that penetrates and has an end exposed on the second surface side, and the dummy area penetrates the dummy pattern formed on the first surface of the resin insulation layer and the resin insulation layer; A dummy post or a dummy wall connected to the dummy pattern so that an end portion is exposed on the second surface side, and the dummy post or the dummy wall is connected to only a part of the dummy pattern. Yes.

A method for manufacturing a multi-piece printed wiring board according to the present invention includes a product area including a plurality of printed wiring boards, and a multi-piece printed wiring having a dummy area formed around one or more of the product areas. It is a manufacturing method of a board. A method for manufacturing a multi-piece printed wiring board according to the present invention includes preparing a metal film, and wiring patterns and dummy of the first conductor layer for a plurality of multi-piece printed wiring boards on the metal film. Forming a pattern, forming a conductor post and a dummy post or a dummy wall on the partial pattern of the first conductive layer and the partial pattern of the dummy pattern, respectively, and exposing the first conductive layer Forming the resin insulating layer so as to cover the surface and the side surface of the conductor post and the dummy post or the dummy wall; and polishing the second surface side of the resin insulating layer to thereby form the conductor post and the dummy post. Alternatively, the end of the dummy wall is exposed, the support plate and the metal film are removed, and one or more product areas are included. That is cut and separated into several up printed wiring board, and includes a be performed in the order of performing either first, a. The dummy post or the dummy wall is connected to only a part of the dummy pattern, and penetrates through the resin insulating layer so that an end thereof is exposed to the second surface side of the resin insulating layer. It is formed.

Plane explanatory drawing of the panel of the multi-cavity printed wiring board of one embodiment of the present invention. Cross-sectional explanatory drawing of 1B-1B in the manufacturing process of the multi-cavity printed wiring board of FIG. 1A. Cross-sectional explanatory drawing which shows the cutting process from the panel of FIG. 1A to a multi-piece printed wiring board. Cross-sectional explanatory drawing which shows the cutting process from the panel of FIG. 1A to a multi-piece printed wiring board. FIG. 1B is an enlarged explanatory view of an example of a dummy pattern and a dummy post shown in FIG. 1A. FIG. 1B is an enlarged explanatory view of another example of a dummy pattern and a dummy post shown in FIG. 1A. FIG. 1B is an enlarged explanatory view of an example of a dummy pattern and a dummy wall shown in FIG. 1A. The enlarged explanatory view of an example of the dummy pattern shown in Drawing 1A, a dummy post, and a dummy wall. Explanatory drawing of an example of the pattern of the 2nd surface of each printed wiring board shown by FIG. 1A. Explanatory drawing of an example of the pattern of the 1st surface of each printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Explanatory drawing of each process of an example of the manufacturing method of the printed wiring board shown by FIG. 1A. Sectional drawing of the 1st conductor layer and conductor post in which the surface protective film is formed. Sectional drawing of the part by which the solder | pewter is apply | coated to the edge part of a conductor post. Sectional drawing of the panel of the multi-cavity printed wiring board of other embodiment of this invention. The figure which shows the example in which the dummy pattern was formed in the conventional dummy area | region.

  Next, a multi-piece printed wiring board according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1A shows an explanatory plan view of a panel 200 having a plurality of multi-piece printed wiring boards. When the panel 200 is cut and separated along a cutting line DD, the multi-piece print of one embodiment of a strip shape is shown. A plurality of wiring boards 100 are obtained. Moreover, FIG. 1B is sectional explanatory drawing of a manufacturing middle process. In FIG. 1B, an example of a printed wiring board in which the same circuit pattern is formed on both sides of the support board 80 of the multi-cavity printed wiring board is described, but it is not limited to such an example. The wiring board having different circuit patterns can be formed on both sides of the support plate 80, or the wiring board can be formed only on one surface. Moreover, FIG. 1B is explanatory drawing in the middle of the manufacturing process of the 1B-1B cross section of FIG. 1A, Comprising: The state before passing through the process of removing the support plate 80 and the metal film 81 so that it may mention later is shown. . Therefore, a state in which the multi-cavity printed wiring board 100 is formed on both surfaces of the support plate 80 via the metal film 81 is shown, and the first surface SF1 side of the multi-cavity printed wiring board 100 is the center side, That is, it is located on the support plate 80 side.

  As shown in FIG. 1A, the multi-cavity printed wiring board 100 of this embodiment includes a product area 20 composed of a plurality of printed wiring boards 1a, 1b, 1c,... And one or more product areas 20. A medium-sized composite wiring board having a dummy area (strip area) 10 formed around it. As shown in FIG. 1B, a first surface SF1 and a second surface SF2 opposite to the first surface are formed. The resin insulating layer 30 is provided. In the product area 20, a first conductor layer 21 is formed so that only one surface is exposed on the first surface SF 1 side of the resin insulating layer 30, and the conductor post 25 connected to the first conductor layer 21. However, it is formed so as to penetrate the resin insulating layer 30 and to expose its end on the second surface SF2 side (see FIG. 4G). In the dummy area 10, the dummy pattern 11 is formed on the first surface SF1 side of the resin insulating layer 30 so as to go around the product area 20 and connected to the dummy pattern 11, or A dummy wall 12 (hereinafter, a dummy post or a dummy wall is also referred to as a “dummy post or the like”) penetrates the resin insulating layer 30, and ends thereof on the second surface SF2 side are formed in a dot shape independently of each other. Alternatively, it is formed so as to be exposed in a connected dot pattern or linear pattern. The dummy post or the dummy wall 12 is connected to only a part of the dummy pattern 11.

  Here, the product area means an area where a plurality of printed wiring boards as products are arranged, and the dummy area means one or more product areas in which the printed wiring boards as products are not formed. It is a surrounding area and is a portion where a dummy pattern, also called a strip area, is formed.

  That is, a printed wiring board used for a package of a semiconductor device has a size of about 1 cm square, and a plurality of printed wiring boards are formed as a large panel at the manufacturing stage. It is made into a strip-like multi-piece printed wiring board, and after semiconductor elements are mounted, it is separated into individual printed wiring boards. To cut from this panel into strip-shaped printed wiring boards, it is cut with a router or a mold, but at that time, a crack runs on the resin insulation layer, and multiple printed wiring boards are formed. It may become defective collectively.

  An object of an embodiment of the present invention is that when a large-sized panel that collectively manufactures a plurality of printed wiring boards is cut into a medium-sized strip-shaped printed wiring board, the cracks are generated. It extends in the area and prevents the product from becoming defective.

  Another object is that the resin insulation layer of the printed wiring board is formed of a resin that does not include a core material such as glass fiber, and the wiring pattern is formed only on one surface of the resin insulation layer. In this case, even when a wiring pattern is not formed, it is possible to prevent defects associated with cracks during cutting. Yet another purpose is to form a uniform post, such as a dummy post, that prevents the progress of cracks in the dummy area when it is formed with an electroplated film together with a conductor post in the product area. It is an object of the present invention to provide a multi-piece printed wiring board having a structure that can be manufactured more easily and a manufacturing method thereof.

  For example, as shown in FIG. 2A (a), the dummy pattern 11 has a dot pattern shape that is connected independently or by wiring or the like on the first surface SF1 of the dummy area 10 of the resin insulating layer 30 (see FIG. 1B). Or in a linear form. FIG. 2A shows a dummy pattern 11 having a hexagonal planar shape, but the shape of the dummy pattern is not limited to this, and it may be a triangle, a rectangle or a rhombus, a polygon more than that, It may be a cross shape or a circle or an ellipse. FIG. 2A shows an example in which all dummy patterns 11 are arranged in an intricate manner. That is, as shown in FIG. 2A, the dummy patterns are arranged in a so-called zigzag pattern in which two adjacent patterns are shifted by 1/2 pitch, or the patterns are arranged so as to bite each other. It is preferable to do. This is because, by such an arrangement, the straight line passing through the gap portion of the dummy pattern 11 hits any dummy pattern 11 and does not extend to the product area 20 through the dummy area 10 regardless of the direction. Because. As a result, when a large-sized panel 200 is cut into a medium-sized strip-shaped printed circuit board 100, even if a crack is generated at the cut portion, the crack enters the edge 10a (see FIG. 1A). However, it is considered that the possibility of entering the product area 20 (see FIG. 1A) by extending along the linear direction on the first surface SF1 and passing through the dummy area 10 can be prevented. However, the dummy pattern 11 is not limited to such a structure. For example, the dummy patterns 11 may be irregularly arranged or regularly arranged in a matrix.

  As described above, cracks may occur when the panel 200 is cut into the strip-shaped, medium-sized printed circuit board 100. When such a dummy pattern 11 is provided on the surface, the crack product It is preferable because the dummy pattern easily prevents entry into the area 20 side. However, there is a possibility that cracks entering the intermediate portion in the thickness direction of the resin insulating layer 30 or the second surface SF2 side cannot be completely prevented from entering the product area 20. Therefore, in the present embodiment, not only the dummy pattern 11 is formed on the first surface SF1 of the resin insulating layer 30, but also the dummy post or the dummy wall 12 formed so as to be connected to the dummy pattern 11 includes the resin insulating layer. 30 is formed so as to penetrate through 30. The dummy post or the dummy wall 12 may be independently formed in an arbitrary shape without being influenced by the shape of the dummy pattern 11. By forming the dummy post or the dummy wall 12 so as to penetrate the resin insulating layer 30, it is considered that the crack can easily be prevented from entering any part of the resin insulating layer in the thickness direction. Therefore, the effect of preventing cracks from entering the product area 20 can be further improved.

From this point of view, a large number of dummy posts or dummy walls 12 penetrating the resin insulating layer 30 in the dummy area 10 are formed as many as possible with the same diameter (width) as the diameter (width) of the dummy pattern 11. It is considered that the mechanical strength of the individual printed wiring board 100 is improved and the penetration of cracks can be prevented. On the other hand, conductor posts 25 are also formed in the product area, and both of them can be formed by electroplating at the same time. If the number of dummy posts or dummy walls 12 increases and the total cross-sectional area thereof becomes too large, the current density during electroplating will be lower than that of the conductor posts 25. When the current density is lowered, the plating film formation speed is reduced, and therefore it is considered that the height of the dummy post or dummy wall 12 and the height of the conductor post 25 are varied. Accordingly, the ratio of the total cross-sectional area of the dummy post or the dummy wall 12 to the area of the dummy area 10 (remaining copper ratio) and the ratio of the total cross-sectional area of the entire conductor post 25 to the area of the product area 20 (remaining copper ratio) are approximately. Preferably equal. The “remaining copper ratio” means the ratio of the total cross-sectional area of the conductor post or dummy post to the total area of the portion, including the case where the material of the conductor post or dummy post is not copper. .

  The end portion of the conductor post 25 needs to be exposed to the second surface SF2 side of the resin insulating layer 30 for connection to the outside. Further, the dummy post or the dummy wall 12 also penetrates the resin insulating layer 30 and has an end portion on the second surface SF2 in that the progress of a crack generated in any part in the thickness direction of the resin insulating layer 30 is also prevented. It is preferable to be exposed to the side. Therefore, if the post height is too different due to variations in plating thickness, it is necessary to polish a conductor post having a high post height in accordance with the short post height. In this case, the polishing step for uniformly aligning all the conductor posts 25 and the end surfaces of the dummy posts or the dummy walls 12 and the second surface SF2 of the resin insulating layer 30 becomes longer as the difference in height between the two is larger, This can also increase the possibility of product damage during the polishing process. Therefore, it is necessary to make the electroplating thickness, that is, the height of the conductor post 25 and the dummy post or the dummy wall 12 as constant as possible. Therefore, the difference between the remaining copper ratio on the second surface SF2 side of the product area 20 and the remaining copper ratio on the second surface SF2 side of the dummy area 10 is preferably as small as possible and more preferably 10% or less. . From this point of view, it is considered preferable that the number of dummy posts or dummy walls 12 is determined.

  The dummy pattern 11 on which the dummy posts or the dummy walls 12 are formed is preferably formed on the entire surface of the dummy area 10 for the purpose of preventing the progress of cracks in the dummy area 10. In addition, the dummy pattern 11 may be preferably formed as a plurality of dot-like or linear conductor patterns rather than a so-called solid pattern in that the printed wiring board is less likely to warp or bend. Therefore, for example, many dummy patterns 11 as shown in FIG. 2A (a) are formed on the entire surface of the dummy area 10. On the other hand, the necessary number of conductor posts 25 is provided according to the electric circuit in the printed wiring board. Therefore, in the present embodiment, the dummy pattern 11 is densely formed in a wide range, and the difference in the remaining copper ratio between the product area 20 on the second surface SF2 side of the resin insulating layer 30 and the dummy area 10 is reduced. A dummy post or a dummy wall 12 is connected to only a part of the dummy pattern 11. It is considered that the remaining copper ratio on the second surface SF2 side of the resin insulating layer 30 in the dummy area 10 itself is preferably 5 to 30%.

  In the printed wiring board of the example of the embodiment shown in FIG. 2A, the dummy pattern 11 independently formed on the first surface SF <b> 1 (see FIG. 1B) of the resin insulating layer 30 and the second of the resin insulating layer 30. As shown in FIG. 2A (b), the surface SF2 side (see FIG. 1B) has dummy posts 121 formed so as to be connected to the dummy pattern 11 so that the ends are exposed in a dot shape independently of each other. doing. A dummy post 121 is formed only on a part of the pattern 11 g of the dummy pattern 11. In FIG. 2A (b), the second surface SF2 side is shown by transmission from the first surface SF1 side. That is, the dummy post 121 is thinned out with respect to the dummy pattern 11. As a result, the remaining copper ratio of the dummy area 10 is reduced and becomes close to the remaining copper ratio of the product area 20. Thereby, the dummy post 121 has the effect of preventing cracks from entering the product area 20 side of the multi-piece printed wiring board and enhancing the strength of the printed wiring board, while having a substantially uniform height of the conductor post 25. And the dummy post 121 is formed by electroplating. As a result, the polishing process of the resin insulating layer in the manufacturing process can be completed in a short time.

  The dummy pattern 11 to which the dummy posts 121 are connected has a desired residual copper ratio on the second surface SF2 side of the resin insulating layer 30 in the dummy area 10 and can prevent as much crack penetration as possible from the product area 20 side. The dummy posts 121 are preferably selected so as to be distributed in the dummy area 10. The dummy posts 121 may be formed in a single row, or may be provided over a plurality of rows of two or more. For example, the dummy posts 121 are shifted with respect to the dummy pattern 11 by being shifted from each other in two adjacent rows. It may be provided regularly such as a zigzag pattern thinned out. Alternatively, as shown in FIG. 2A (b), irregularities may be thinned out more than other portions, for example, at a portion where the possibility of progress of cracks is low due to the structure of the printed wiring board.

  In FIG. 2A, the dummy pattern 11 is a hexagonal dot pattern, and the dummy post 121 formed in connection with the dummy pattern 11 (specifically, the pattern 11g) has a planar shape such that the end 12b of the dummy post 121 is It is an example of a circle as shown in FIG. 2A (b). As described above, the planar shape of the dummy post 121 can be formed in various shapes such as a circle, a rectangle or other polygons, an ellipse, and a rhombus regardless of the shape of the dummy pattern 11. In this case, it may be formed in an independent dot shape, or may be formed in a pattern connected to each other by a dummy wall 122 as will be described later.

  The shapes of the dummy pattern 11 and the dummy post or the dummy wall will be described in more detail with reference to FIGS. 2B to 2D, as in FIG. 2A, (a) is an explanatory plan view of the first surface SF1 of the resin insulating layer 30, and (b) is shown in (a) of each drawing. An explanatory view on the second surface SF2 side of the resin insulating layer 30 is shown by transmission from the first surface SF1 side. FIG. 2B (a) shows an example in which the dummy pattern 11 is not formed as a continuous pattern like a wiring, but is formed as an independent dot pattern 11a as in FIG. 2A (a). . In this case, there is an advantage that the gas generated from the resin or the like when heated in the manufacturing stage is easily removed compared to the case where the dummy pattern 11 is formed in a continuous pattern. In addition, problems such as the occurrence of warping and bending of the printed wiring board during manufacture are easily avoided. As described above with reference to FIG. 2A, various shapes may be adopted for such an independent dot pattern 11a, and FIG. 2B (a) shows an example of a circular shape. Has been. In addition, the dot pattern 11a is not arranged so that adjacent patterns bite into each other like the dummy pattern 11 shown in FIG. 2A, but is similarly arranged in a staggered manner and is relatively difficult to crack. Has been.

  As described above, only the part of the dot pattern 11a, that is, the dummy post 121 is formed by being thinned out with respect to the dummy pattern 11 as shown in FIG. 2B. In the example shown in FIG. 2B, the dummy posts 121 are formed by thinning out every other row in an upwardly inclined row in FIG. 2B with respect to the dummy pattern 11 in which the dot patterns 11a are formed in a staggered arrangement. Has been. Thereby, the difference between the remaining copper ratio of the dummy area 10 on the second surface SF2 side of the resin insulating layer 30 and the remaining copper ratio of the product area 20 is reduced, and preferably the difference is within 10%. It is formed. As a result, even if both the conductor post 25 and the dummy post 121 are formed simultaneously by electroplating, both of them are formed to have substantially the same height, and their end portions are exposed on the second surface SF2 of the resin insulating layer 30. As a result, the amount by which the resin insulating layer 30 is polished may be reduced.

  In the example shown in FIG. 2B, the dummy posts 121 are thinned out every other row with respect to the dummy pattern 11, but as described above, the dummy posts 121 may be provided in an arbitrary arrangement pattern. Further, as described for the dummy pattern 11, the dummy post 121 is also preferably provided so that cracks can be prevented from extending straight and reaching the product area 20 easily. For example, dummy posts 121 are provided with a larger width or narrower spacing than shown in FIG. 2B, and the dummy posts 121 are formed so as to overlap each other when viewed from any side of the multi-sided printed wiring board 100. It may be preferable.

  FIG. 2C (a) shows an example of a linear dummy pattern. That is, a striped pattern in which a plurality of linear patterns 11b made of conductors extending in a line intersects with a striped pattern in which a plurality of linear patterns 11c orthogonal to the linear pattern 11b are aligned. A dummy mesh pattern 11 is formed as a whole connected in a state. The intervals between the linear patterns may be equal so that the mesh-like dummy pattern 11 becomes a regular matrix pattern, or may be different from each other.

  2D (a) is a dummy pattern in which the dot pattern 11a similar to FIG. 2B (a) and the linear patterns 11b and 11c similar to FIG. 2C (a) are connected to form the whole. 11 is shown. In other words, a plurality of individual dot patterns 11a having a circular planar shape are formed in a matrix, and the dummy patterns 11 are formed by connecting the adjacent dot patterns 11a with the linear patterns 11b and 11c. ing. Unlike the case where only individual patterns are formed, the dummy pattern 11 illustrated in FIGS. 2C (a) and 2D (a) does not pass through the dummy area 10 through a straight line through the gap portion of the dummy pattern 11. It is formed without any breaks. In particular, a closed loop is formed by the linear patterns 11b and 11c or by the four dot patterns 11a and the linear patterns 11b and 11c. In this way, by always forming a closed pattern, any portion of the dummy area 10 that is cracked is prevented from progressing by any of the dot-like or linear patterns 11a to 11c. 10 cannot be passed. Therefore, it is easy to prevent the crack from entering the product area 20 side. 2C (a) and 2D (a) are only preferable examples of the dummy pattern 11, and the dummy pattern 11 may have a discontinuous portion, but the crack does not pass through the dummy area 10. Preferably it is formed.

  A dummy post or dummy wall 12 (see FIG. 1B) is provided by thinning out the dummy pattern 11 of the preferred embodiment shown in FIGS. 2C (a) and 2D (a). That is, the dummy post 121 or the dummy wall 122 is formed by connecting to only part of the dot pattern 11a and / or the linear patterns 11b and 11c (see FIG. 2C (b) and FIG. 2D (b)).

  In the example shown in FIG. 2C, dummy walls 122 are formed every other line connected to the linear patterns 11b and 11c formed in parallel. The dummy wall 122 is shown in the same shape as the linear patterns 11b and 11c in FIG. 2C, but is substantially the same as the conductor post 25 as shown as a dummy post or dummy wall 12 in FIG. 4G and the like. It has a height and is erected in a partition shape on the dummy pattern 11. Two or more dummy walls 122 may be thinned out with respect to the linear patterns 11b and 11c, or two or more dummy walls may be thinned out continuously. Moreover, it may be thinned out at irregular intervals instead of a constant pitch. As described above, the dummy wall 122 is thinned and formed with respect to the dummy pattern 11, so that the remaining copper ratio in the dummy area 10 is lowered and is approaching the remaining copper ratio in the product area 20.

  In the example shown in FIG. 2D, the dummy posts 121 and the dummy walls 122 are the same as the examples shown in FIGS. 2B and 2C for the dot pattern 11a and the linear patterns 11b and 11c constituting the dummy pattern 11, respectively. It is formed by thinning out. However, in the example shown in FIG. 2D, unlike FIG. 2B and FIG. 2C, the dot pattern 11a and the linear patterns 11b and 11c have no regularity like every other row or every other line, and are not at regular positions. It is drawn. Thus, even when the linear patterns 11b and 11c are formed, a pattern in which the dummy wall 122 is connected to the surface thereof can be arbitrarily selected. That is, like the dummy posts 121, the intervals between the dummy walls 122 need not be uniform. For example, as described above, when there is a difference in the likelihood of cracks depending on the location in the dummy area 10, the dummy posts 121 and / or the dummy walls 122 corresponding to the situation are appropriately thinned out. Good.

  Thus, the dummy pattern 11 may be a dot pattern 11a, a linear pattern 11b, 11c, or a combination thereof, and a dummy post 121 or a dummy wall is formed on each dummy pattern 11 along the dummy pattern 11. 122 or both are formed. For example, the dummy area 10 can have both a dummy post 121 on the dot pattern 11a constituting the dummy pattern 11 and a dummy wall 122 on the linear patterns 11b and 11c. However, in the multi-piece printed wiring board 100 of the embodiment, the dummy post or the dummy wall 12 is formed to be connected to only a part of the dummy pattern 11 instead of the whole. Thereby, the progress of the crack generated at the edge 10a (see FIG. 1A) to the product area 20 is effectively prevented, and the dummy post and / or the dummy wall 12 having a small height difference from the conductor post 25 is obtained. As a result, the amount of polishing at the end is reduced, making it easier to manufacture a multi-piece printed wiring board 100 and reducing the possibility of damage.

  The printed wiring board can be applied to various structures. For example, FIG. 1B can be applied to a structure in which the 1B-1B cross-sectional explanatory view of FIG. In this structure, the dummy pattern 11 is mounted on the first surface SF <b> 1 of the resin insulating layer 30 in the dummy area 10 on the printed circuit boards 1 a, 1 b, 1 c in the product area 20, and semiconductor elements (not shown) are mounted. It is formed simultaneously with the first conductor layer 21 having the second pattern 21b, the first pattern 21a on which the conductor posts 25 are formed, and the like. Further, the outermost resin insulating layer which is the outermost layer of the laminated resin insulating layer 31 (see FIG. 6) laminated on the second surface SF2 or the second surface SF2 opposite to the first surface SF1 of the resin insulating layer 30. A wiring pattern is not formed on the exposed surface, and only the end portion 25a of the conductor post 25 (see FIG. 4G) connected to the conductor layer on the first conductor layer 21 side is exposed. A dummy post or a dummy wall 12 is formed in connection with the dummy pattern 11 in the dummy area 10. As described above, the dummy post or the dummy wall 12 has a dot-shaped or linear end portion exposed to the second surface SF2 side regardless of the shape of the dummy pattern 11. Ideally, it is desirable that the dummy post or the dummy wall 12 is formed so that a straight line does not pass through the gap portion and does not come out into the product area. If the crack can be prevented, the printed wiring board in the product area can be prevented from being defective. If the number of dummy posts or dummy walls 12 is increased, the probability of blocking can be increased. However, if the above-described remaining copper ratio is too larger than the remaining copper ratio of the product area 20, the height of the posts varies. The problem is likely to occur. Therefore, the dummy posts or the dummy walls 12 are formed only on a part of the pattern 11g of the dummy pattern 11, and the number thereof is determined by the balance between the two.

  That is, as described above, the printed wiring board having a structure in which the wiring pattern is formed only on one surface of the resin insulating layer 30 and only the conductor post 25 is exposed on the other surface side is cracked at the edge 10a. Is easy to extend to the product area 20, an example of which is shown. Note that the second surface SF2 side of the resin insulating layer 30 is connected to a motherboard or the like via the conductor post 25. However, as described above, the printed wiring board to which the structure having the dummy post or the dummy wall 12 of the present embodiment is applied is not limited to such a printed wiring board in which a wiring pattern is formed only on one side. A method for manufacturing the printed wiring board 100 will be described in detail later, but there are two methods for cutting the panel 200 into the strip-shaped multi-piece printed wiring board 100. Is done.

  First, FIG. 1B shows an explanatory diagram of the 1B-1B cross section of FIG. 1A in the state of the final manufacturing process. That is, it is not a complete cross-sectional view, but is a view of only a main part partially omitted, and the dummy pattern 11 and the dummy post or the dummy wall 12 are shown in only one row. As described above, the first conductor layer 21 and the resin insulating layer 30 are laminated on the support plate 80 via the metal film 81, and finally the support plate 80 is removed to form a printed wiring board. The support plate 80 is, for example, bonded to the dummy substrate 80a (see FIG. 4A), for example, the carrier copper foil 80b side of the metal film 81 with the carrier copper foil 80b. Then, the first conductor layer 21 including the second pattern 21b and the like is formed on the metal film 81 together with the dummy pattern, and the dummy post or the dummy wall 12 is formed together with the conductor post (not shown), and the resin insulating layer 30 is embedded.

  Thereafter, when the support plate 80 is peeled off, a large panel 200 formed on both surfaces of the support plate 80 is obtained. In the state where the large panel 200 is formed, the first method is to cut along the DD line. FIG. 1C shows a state in which the support plate 80 is peeled and the metal film 81 is further removed and then cut. In this way, cutting is easy, but the thin large panel 200 must be handled, so it is necessary to proceed with caution.

  On the other hand, the second method is to cut from the state of FIG. This is shown in FIG. 1D. That is, FIG. 1D shows a state of being cut and separated in the state of FIG. 1B. Thereafter, the strip-shaped multi-cavity printed wiring board 100 is peeled off from the support plate 80 to become the respective multi-cavity printed wiring boards 100. After this, etching removal of the metal film 81 described later is performed. With this method, the handling during the cutting operation is easy, but the work of peeling the multi-piece printed wiring board 100 from the support plate 80 and the removal of the metal film 81 are the medium size of each of the multi-piece printed wiring boards 100. Since it is necessary to do by size, man-hours are required.

  The resin insulating layer 30 is not particularly limited, but as described above, cracks are likely to extend when a core material such as glass fiber is not contained. This is thought to be because cracks tend to stop if there is a core material, but there is no place to stop if there is no core material, and the crack progresses. Therefore, this embodiment is particularly effective when a resin containing no core material is used. Examples of the resin that does not contain the core material include a resin film for interlayer insulation (a film formed only with an inorganic filler and a resin composition) or a mold resin (a resin that is poured into a mold and hardened). Either of them is acceptable. However, the present embodiment is not limited to the resin without the core material, and the effect of the present embodiment can be achieved even with the resin with the core material. In addition, it is preferable that the inorganic filler impregnated in the resin insulating layer 30 is contained in an amount of 70 to 90% by weight. Further, when a molding resin is used, when a molding resin material having a thermal expansion coefficient of 3 to 120 ppm / ° C. and an elastic modulus of 0.01 to 30 GPa is used, it is mounted on the printed wiring board 100. This is preferable because a large thermal stress is unlikely to be generated at a joint portion of an electronic component.

  As described above, in the present embodiment, the dummy pattern 11 is formed in the dummy area 10, and the dummy post or the dummy wall 12 is formed only on a part of the dummy pattern 11. When cutting from 200 to a multi-piece printed wiring board 100, for example, even when a crack has occurred in the edge 10 a of the multi-piece printed wiring board 100, the crack is prevented from entering the product area 20. It is possible that a uniform height conductor post 25 and dummy post or dummy wall 12 could be manufactured with less process time.

  An example of the pattern of each printed wiring board 1 constituting the multi-cavity printed wiring board 100 is shown in FIGS. 3A shows an arrangement example of the resin insulation layer 30 of the conductor post 25 of the printed wiring board 1 on the second surface SF2, and FIG. 3B shows an arrangement example of the first surface SF1 of the resin insulation layer 30. Yes. As shown in FIG. 3A, conductor post rows 26 formed by arranging a plurality of conductor posts 25 in one direction are arranged in two rows along each side of the printed wiring board 1. Three or more conductor post rows 26 may be juxtaposed. As shown in FIG. 3A, the conductor post rows 26 are spaced apart from the conductor post rows 26 formed along each side, and in a lattice form at the center. A conductor post 25 may be disposed. Further, for example, the resin insulating layer 30 may be formed in a lattice shape over the entire second surface SF2. Although not shown in FIG. 3A, simultaneously with these conductor posts 25, the dummy posts or dummy walls 12 of the aforementioned dummy area 10 are also formed.

  The first conductor layer 21 on the first surface SF1 side of the resin insulating layer 30 of the printed wiring board 1 shown in FIG. 3A includes, for example, first and second patterns 21a, 21b, and A wiring pattern 21d that connects the first pattern 21a and the second pattern 21b can be formed. That is, the conductor post 25 shown in FIG. 3A is formed on the surface (second surface SF2) opposite to the surface (first surface SF1) shown in FIG. 3B of each first pattern 21a. . In the example shown in FIG. 3B, the second pattern 21b is a connection pad 21c to which a semiconductor element (not shown) is connected. For example, the second pattern 21b is electrically connected to an electrode such as an IC chip by a solder bump or a bonding wire. . FIG. 3B is an example of a connection pad 21c connected to a semiconductor element in which electrodes are arranged on each of four sides of a rectangular outer shape, and four connection pad rows in which the connection pads 21c are arranged at a constant pitch. However, they are arranged so as to form a rectangle as a whole. Further, the connection pad 21c (second pattern 21b) and the first pattern 21a formed around the connection pad 21c are connected by a wiring pattern 21d. Thereby, the electrode of the semiconductor element (not shown) can be electrically connected to another wiring board such as a mother board (not shown) via the conductor post 25. Note that each pattern of the first conductor layer 21 shown in FIG. 3B is merely an example, and an arbitrary conductor pattern may be formed according to an electric circuit formed in the printed wiring board 1.

  Next, the first conductor layer 21 is formed on the first surface SF1 of the resin insulating layer 30 described above, and the second surface SF2 side is a printed wiring board in which only the conductor posts 25 are exposed. In the example in which the dummy pattern 11 and the dummy post or the dummy wall 12 are formed in the dummy area 10 provided in FIG. 4, the manufacturing method will be described with reference to FIGS. 4A to 4G are the main parts, the central part is omitted, the first conductor layer 21 is also simplified, and one dummy pattern 11 is shown on each side. . Here, in order to briefly show that the dummy post or the dummy wall 12 is formed only on a part of the dummy pattern 11, the dummy post or the dummy wall 12 is formed only on the dummy pattern 11g on one side. Has been.

  First, as shown in FIG. 4A, a metal film 81 is prepared. Specifically, as a starting material, a support plate 80 and a metal film 81 made of a dummy substrate 80a and a carrier copper foil 80b are prepared, and carrier copper foil 80b is laminated on both sides of the dummy substrate 80a, and is pressed and heated. By being joined together, the support plate 80 is formed, and the metal film 81 is bonded to the carrier copper foil 80b of the support plate 80. The carrier copper foil 80b may be bonded to the metal film 81 in advance, and the carrier metal foil 80b side of the metal film 81 with the carrier copper foil 80b may be attached to the dummy substrate 80a of the support plate 80. The support plate 80 is preferably made of a semi-cured prepreg material made of a material in which a core material such as glass cloth is impregnated with an insulating resin such as epoxy containing an inorganic filler, but is not limited thereto. Instead, other materials may be used. As the material of the metal film 81, a material on which the first conductor layer 21 can be formed is used, and a copper foil having a thickness of about 1 to 3 μm is preferably used. The carrier copper foil 80b is, for example, a copper foil having a thickness of about 15 to 30 μm, preferably about 18 μm. However, the thickness of the carrier copper foil 80b is not limited to this, and may be another thickness.

  The method for joining the carrier copper foil 80b and the metal film 81 is not particularly limited. For example, the carrier copper foil 80b may be bonded to a substantially adhesive surface of the both surfaces by an easily peelable thermoplastic adhesive, In a blank portion near the outer periphery where the conductor pattern of one conductor layer 21 is not provided, the conductor pattern may be bonded by an adhesive or ultrasonic connection. For example, a double-sided copper-clad laminate may be used for the support plate 80, the surface copper foil may be the carrier copper foil 80b, and the single metal film 81 may be bonded thereon using the method described above.

  4A to 4E, the metal film 81 is bonded to both surfaces of the support plate 80, and the first conductor layer 21, the conductor post 25, the dummy post or dummy wall 12, and the resin insulating layer 30 are formed on each surface. An example of a manufacturing method is shown. If it manufactures by such a method, it is preferable at the point that the 1st conductor layer 21, the conductor post 25, the dummy post, the dummy wall 12, etc. are formed simultaneously. However, the first conductor layer 21 or the like may be formed only on one surface of the support plate 80, or conductor layers having different circuit patterns may be formed on both sides. In the following description, since the same circuit pattern is formed on both surfaces, only one surface will be described, the description on the other surface side will be omitted, and some of the reference numerals on the other surface side in each drawing are also partly described. It is omitted.

  Next, wiring patterns 21 a and 21 b and a dummy pattern 11 of the first conductor layer 21 for a multi-piece printed wiring board are formed on the metal film 81. The method for forming the wiring patterns 21a and 21b and the dummy pattern 11 of the first conductor layer 21 is not particularly limited. For example, an electroplating method is used. In this case, first, a resist material (not shown) is applied or laminated on the entire surface of the metal film 81 and patterned to form a predetermined region other than the portion where the first conductor layer 21 and the dummy pattern 11 are formed. A plating resist film (not shown) is formed. Subsequently, for example, a plating layer by electroplating is formed on the exposed surface of the metal film 81 on which the plating resist film is not formed using the metal film 81 as a seed layer (feeding layer) for electroplating. Thereafter, the plating resist film is removed. As a result, as shown in FIG. 4B, the first pattern 21a (pattern on which the conductor post 25 is formed), the second pattern 21b (pad on which a semiconductor element or the like is mounted) and the like are formed. The conductor layer 21 and the dummy pattern 11 are formed on the metal film 81 with a predetermined circuit pattern. The first conductor layer 21 is preferably made of the same material as a conductor post 25, a dummy post or a dummy wall 12 described later, and preferably made of copper. The first conductor layer 21 and the dummy pattern 11 can be preferably formed to a thickness of about 5 to 30 μm, but are not limited thereto.

  Next, as shown in FIG. 4C, conductor posts 25 and dummy posts or dummy walls 12 are respectively formed on a part of the first conductor layer 21 (first pattern 21a) and a part of the dummy pattern 11g. It is formed. Specifically, first, the conductor post 25 and the dummy post or the dummy wall 12 are the surfaces (exposed surfaces) opposite to the surfaces of the first conductor layer 21 and the dummy pattern 11 that are in contact with the metal film 81. A plating resist film (not shown) is formed on the metal film 81 exposed without being covered with the first conductor layer 21 and the dummy pattern 11, except for the part where the film is formed. The plating resist film is formed to a thickness of at least about 10 to 150 μm. Subsequently, a plating layer by electroplating is formed in the opening portion of the plating resist film on the first pattern 21a and the dummy pattern 11 using the metal film 81 as an electroplating seed layer (power feeding layer). Thereafter, the plating resist film is removed. As a result, as shown in FIG. 4C, conductor posts 25 made of an electroplating layer are formed on the exposed surface of the first pattern 21a, and dummy posts or dummy walls are similarly formed on the exposed surface of some dummy patterns 11g. 12 is formed. The conductor posts 25 and the dummy posts or the dummy walls 12 are preferably made of the same material as the first conductor layer 21 and are preferably made of copper. The conductor posts 25 and the dummy posts or the dummy walls 12 can be preferably formed to a thickness of about 10 to 150 μm, but are not limited thereto. In this embodiment, since the dummy post or the dummy wall 12 is formed only on the partial pattern 11g of the dummy pattern 11, as described above, the remaining copper ratio on the second surface SF2 side of the product area 20, The difference from the remaining copper ratio on the second surface SF2 side of the dummy area 10 is small, preferably 10% or less, and the heights of the conductor posts 25 and the dummy posts 12 formed simultaneously by electroplating are substantially the same. As a result, the time required for the polishing step of the resin insulating layer 30 for exposing the ends of the conductor posts 25 and the dummy posts 12 described later can be shortened.

  Although not shown in the figure after the conductor post 25 and the dummy post or dummy wall 12 are formed, the conductor post 25 and the dummy post or dummy wall 12 are preferably used in order to improve adhesion to the resin insulating layer 30 described later. A roughening process is performed on the side surfaces of the first conductive layer 21 and the exposed surfaces of the conductive post 25 and the dummy post or the portion where the dummy wall 12 is not formed. The method of roughening treatment is not particularly limited, and examples thereof include soft etching treatment and blackening (oxidation) -reduction treatment. Each surface to be roughened is preferably processed to a surface roughness of 0.1 to 1 μm in arithmetic mean roughness. Further, when a roughening process is performed, an annealing process for growing an electroplated copper crystal may be performed between the removal of the plating resist film 85 and the roughening process in order to stabilize the roughening.

  Next, as shown in FIG. 4D, a resin insulating layer 30 is formed so as to cover the exposed surfaces of the first conductor layer 21 and the dummy pattern 11, the side surfaces of the conductor posts 25, and the side surfaces of the dummy posts or the dummy walls 12. The Specifically, although not shown, a sheet-like or film-like insulating material (prepreg) is laminated on the conductor post 25 and the dummy post or the dummy wall 12 and is pressed toward the support plate 80 side. Heated with. The insulating material is softened by heating and flows between the first pattern 21a and the dummy pattern 11 and the second pattern 21b, between the second patterns 21b, and between the conductor posts 25 and the dummy posts or the dummy walls 12, It becomes a semi-cured state. Thereafter, by further heating, the insulating material is completely cured, and as shown in FIG. 4D, the resin insulating layer 30 is formed, and the first pattern 21a, the second pattern 21b, the dummy pattern 11, the conductor post 25, and A dummy post or dummy wall 12 is embedded in the resin insulating layer 30. Thus, the method of forming the resin insulating layer 30 by laminating sheet-like or film-like insulating materials is preferable in that the resin insulating layer 30 can be formed by a general printed wiring board manufacturing facility. After the resin insulating layer 30 is formed, buffing is preferably performed to remove burrs generated when the resin insulating layer 30 is formed.

  Next, as shown in FIG. 4E, by polishing the second surface SF2 side of the resin insulating layer 30, the end portions of the conductor posts 25 and the dummy posts or the dummy walls 12 are exposed. Specifically, on the side opposite to the metal film 81 side of the resin insulating layer 30 (exposed surface side), preferably all the conductor posts 25 and the dummy posts or the tips of the dummy walls 12 are the second surfaces SF2 of the resin insulating layer 30. Polishing is performed by buffing or chemical mechanical polishing (CMP) until exposed to the side. Preferably, it is further polished to a predetermined height. At this time, if the heights of the conductor post 25 and the dummy post or the dummy wall 12 are not uniform, the end of the shortest conductor post 25 is exposed and the polishing amount (polishing length) until a predetermined height is reached. Therefore, it is considered that a long polishing time is required. On the other hand, as described above, in the present embodiment, the remaining copper ratio on the second surface SF2 side of the dummy area 10 is close to the remaining copper ratio on the second surface SF2 side of the product area 20, so the heights are uniform. Conductor posts 25 and dummy posts or dummy walls 12 are formed by electroplating. As a result, the polishing process may be short, reducing manufacturing costs and reducing the possibility of damage during polishing.

  Next, the support plate 80 is peeled off, the metal film 81 is further removed, and cutting or separation into a multi-piece printed wiring board including one or two or more product areas is performed first. The support plate 80 and the metal film 81 are removed and cut and separated along the line DD in FIG. 1A. That is, there are two timings for cutting the multi-piece printed wiring board 100 from the panel 200 as described with reference to FIGS. 1C and 1D described above, but any one of the methods is used. When the separation of the support plate 80 is performed first, for example, as shown in FIG. 4F, first, the support plate 80 and the metal film 81 are separated. Specifically, for example, the entire printed wiring board in the process is heated, and a thermoplastic adhesive (not shown) that joins the carrier copper foil 80b of the support plate 80 and the metal film 81 is softened. A force in a direction along the interface with the metal film 81 is applied to the carrier copper foil 80b of the support plate 80, and the carrier copper foil 80b and the metal film 81 are separated. Alternatively, as described above, when both are bonded by an adhesive or ultrasonic connection in a blank portion near the outer periphery, the support plate 80 and the metal film 81 are on the inner peripheral side of the bonding portion, and the resin insulating layer 30. The carrier copper foil 80b and the metal film 81 may be separated by cutting together with an adhesive or the like and cutting off the joint portion by an adhesive or the like. As a result, two printed wiring board panels 200 formed on both sides of the support plate 80 at the center are obtained. FIG. 4F shows the state, and only the in-process product of the panel 200 shown on the lower surface side of the support plate 80 in FIG. 4E is shown.

  Subsequently, as shown in FIG. 4G, the metal film 81 is removed, for example, by etching or the like. As described above, when copper is used for the metal film 81, the first conductor layer 21, the conductor post 25 and the dummy pattern 11, the dummy post or the dummy wall 12, all the constituent materials are the same etching. Dissolved in the liquid. For this reason, when the metal film 81 is etched, a surface of the conductor post 25 and the dummy post or the dummy wall 12 exposed to the second surface SF2 side of the resin insulating layer 30 is exposed to the etching solution, whereby the metal film 81 is exposed. Etched together. Even after all the metal film 81 is removed, the exposed surface of the first conductor layer 21 and the dummy pattern 11 exposed on the first surface SF1 of the resin insulating layer 30 by the removal of the metal film 81, and the conductor post 25 are removed. The tip portion 25a and the dummy post or the tip portion 12b of the dummy wall 12 are etched by being exposed to an etching solution. As a result, as shown in FIG. 4G, the exposed surface of the first conductor layer 21 and the exposed surface of the dummy pattern 11 are recessed from the first surface SF1 of the resin insulating layer 30, and the end 25a of the conductor post 25 and the dummy post Alternatively, the end 12b of the dummy wall 12 is recessed from the second surface SF2 of the resin insulating layer 30, and the recess from the second surface SF2 of the resin insulating layer 30 of the end 25a of the conductor post 25 is the first. It becomes larger than the dent from 1st surface SF1 of the resin insulating layer 30 of the conductor layer 21. FIG. The cutting from the panel 200 to the multi-piece printed wiring board 100 may be performed with the metal film 81 shown in FIG. 4F remaining, or after the metal film 81 after FIG. 4G is removed. May be. This method is the method shown in FIG. 1C described above. In FIG. 1C, dents such as the surface of the first conductor layer 21 from the first and second surfaces SF1 and SF2 of the resin insulating layer 30 and the end surface 25a of the conductor post 25 are omitted.

  On the other hand, in the method shown in FIG. 1D, the step of FIG. 4E is followed by cutting along the line DD in FIG. 1A, and thereafter, the support plate 80 is removed and the metal film 81 is removed by etching. Thus, a multi-piece printed wiring board 100 is obtained.

  After the removal of the metal film 81, the surface protective film 28 (see FIG. 5A) is preferably formed on the exposed surfaces of the first conductor layer 21 and the dummy pattern 11, the end 25a of the conductor post 25, the end of the dummy post or the dummy wall 12. It is formed in the part 12b. The surface protective film 28 may be formed by forming a plurality of or a single metal film such as Ni / Au, Ni / Pd / Au, or Sn by a plating method. Further, the OSP may be formed by immersion in a liquid protective material or spraying of the protective material. The surface protective film 28 may be formed on both the exposed surface of the first conductor layer 21 and the end portion 25a of the conductor post 25, or may be formed on only one of them. Further, the surface protective film 28 may not be formed on the surface of the dummy pattern 11 or the end portion 12 b of the dummy post or the dummy wall 12. Furthermore, a surface protective film made of a different material may be formed on the exposed surface of the first conductor layer 21 and the end portion 25a of the conductor post 25.

  Further, in addition to the formation of the surface protective film, or without the surface protective film being formed, a bonding material layer made of a bonding material for bonding the conductor post 25 to an external motherboard or the like on the end portion 25a of the conductor post 25. 27 (see FIG. 5B) may be formed. Solder is preferably used as the material of the bonding material layer 27, and may be formed by applying paste-like solder or placing a solder ball, and once cured after being melted or using a plating method. However, the material and forming method of the bonding material layer are not particularly limited, and other materials and methods can be used.

  By passing through the above process, the multi-piece printed wiring board 100 cut | disconnected by the DD line | wire of FIG. 1A is completed. That is, in the dummy area 10, only the dummy pattern 11 formed on the first surface SF1 of the resin insulating layer 30 and the partial pattern 11g of the dummy pattern 11 penetrate the resin insulating layer 30, and the second surface SF2. A medium-sized multi-piece printed wiring board 100 having a dummy post or a dummy wall 12 formed so as to be connected to the dummy pattern 11 so that the end portion 12b is exposed in a dot shape or a line shape on the side is obtained.

  The first conductor layer 21 is entirely embedded on the first surface SF1 side of the resin insulating layer 30 so that one surface is exposed on the first surface SF1 side of the resin insulating layer 30. That is, the first conductor layer 21 and the resin insulating layer 30 are formed not only on the other surface of the first conductor layer 21 but also on the side surface of the first conductor layer 21, specifically, on the first conductor layer 21. Also in contact with the side surfaces of the first pattern 21a and the second pattern 21b. Therefore, even when the first pattern 21a and the second pattern 21b are formed with a fine pitch and the area of one surface of the first conductor layer 21 is reduced, the adhesion between the first conductor layer 21 and the resin insulating layer 30 is maintained. Can be done. Further, since the first conductor layer 21 is embedded in the resin insulating layer 30, the printed wiring board 1 itself can be thinned.

  As described above, the first conductor layer 21 is formed with the first pattern 21a and the second pattern 21b. In the present embodiment, the first pattern 21a is electrically connected to another printed wiring board (not shown) connected to the printed wiring board 1 on the second surface SF2 side of the resin insulating layer 30. It is a wiring pattern. Here, the other printed wiring board may be a mother board such as an electronic device in which the printed wiring board 1 is used, or a laminate of an insulating layer and a conductor layer that constitutes a multilayer wiring board together with the printed wiring board 1. It may be a body. The second pattern 21b may be a connection pad to which, for example, a semiconductor element (not shown) is connected. The first conductor layer 21 may be formed with a wiring pattern other than the first and second patterns 21a and 21b. For example, the electrode of the semiconductor element connected to the second pattern 21b that is electrically connected to the outside is formed on the first conductor layer 21 so as to connect the second pattern 21b and the first pattern 21a. The first pattern 21a and the conductor post 25 are electrically connected via the wiring pattern 21d (see FIG. 3B).

  The example shown in FIGS. 4A to 4G is an example in which the first conductor layer 21 is formed on one side having only one insulating layer. However, a conductor layer is further provided on the second surface SF2 side of the resin insulating layer 30. When the conductor layer is not formed on the lower end side of the outermost (lowermost) resin insulation layer, cracks are likely to run in the resin insulation layer as well. Therefore, even when the resin insulating layers are laminated in multiple layers, it is preferable that a dummy post or a dummy wall be formed in the dummy area of the lowermost resin insulating layer. In this case, the resin insulating layer other than the lowermost layer may have a conductor layer formed on only one side or a conductor layer formed on both sides. In short, one surface of the resin insulating layer has a conductor on It is preferable that a dummy post or a dummy wall is formed in a dummy area on the outer periphery of the resin insulating layer in which only the conductor post is exposed without forming the layer. Of course, it is preferable that the conductor post and the conductor pattern are provided also in the resin insulating layer when the conductor layers are provided on both surfaces.

  In FIG. 6, the second conductor layer 22 is formed on the second surface SF <b> 2 side of the resin insulating layer 30, the second resin insulating layer 31 is further formed on the surface, and the second resin insulating layer 31 penetrates through the second resin insulating layer 31. The second conductor post 29 and the second dummy post or dummy wall 12a are formed so as to be connected to the two conductor layer 22. The exposed surface SF3 of the second resin insulating layer 31 which is the outermost layer is composed of two conductor layers. A printed wiring board is shown in which no conductor layer is formed on the side and only the second conductor post 29 is exposed.

  In order to manufacture such a printed wiring board, following the process of FIG. 4E described above, for example, a metal film is formed on the second surface SF2 of the resin insulating layer 30 by an electroless plating method. The pattern of the second conductor layer 22 and the pattern of the second dummy pattern 13 and the second conductor post 29 and the second dummy post or dummy wall 12a are formed by the electroplating film, and the method shown in FIGS. 4D and 4E is formed thereon. The second resin insulation layer 31 is formed in the same manner as in FIG. 4B, and thereafter, the support plate 80 is removed, and the metal film 81 is further removed, before or after the removal of the support plate 80 and the metal film 81, as in FIG. 4F. The panel is cut into a medium format substrate. Also in this embodiment, the second dummy post or the dummy wall 12a is not limited to the pattern exposed on the SF3 side of the second resin insulating layer 31 in a dot shape, but is a connected dot pattern or a linear pattern, or those patterns. The second resin insulating layer 31 may be exposed on the SF3 side in combination. Further, the second dummy posts or dummy walls 12a are thinned out with respect to the second dummy patterns 13 so that the number of second dummy posts or dummy walls 12a is smaller than the number of second dummy patterns 13. It is preferable that the pattern 13a is formed only on a part of the pattern 13a and is adjusted so that the residual copper ratio on the SF3 side of the dummy area is close to the residual copper ratio on the SF3 side of the product area.

  In addition, regarding a manufacturing method, it is not limited to this method, A various method can be employ | adopted. For example, when the resin insulating layer 30 is formed, a metal foil such as a copper foil and a resin film may be pressed and heated, and the second conductor post 29, the second dummy post, or the dummy wall 12a is formed. However, after the second resin insulating layer 31 is formed, an opening may be formed so that the second conductor post 29, the second dummy post, or the dummy wall 12a is embedded in the opening. Furthermore, when a multilayer printed wiring board is formed, a desired multilayer printed wiring board can be formed by repeating these steps.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 10 Dummy area 11 Dummy pattern 11a Dot pattern 11b, 11c Linear pattern 12 Dummy post or dummy wall 121 Dummy post 122 Dummy wall 12b End of dummy post or dummy wall 20 Product area 21 First conductor layer 21a First pattern 21b Second pattern 25 Conductor post 25a End of conductor post 27 Bonding material layer 28 Surface protective film 30 Resin insulating layer 80 Support plate 80a Dummy substrate 80b Carrier copper foil 81 Metal film SF1 First surface of resin insulating layer SF2 Second surface of resin insulation layer

Claims (19)

A multi-piece printed wiring board having a product area composed of a plurality of printed wiring boards and a dummy area formed around one or more of the product areas,
A resin insulation layer having a first surface and a second surface opposite to the first surface, and each printed wiring board in the product area is exposed only on the first surface side of the resin insulation layer. A first conductor layer embedded so as to have a conductor post connected to the first conductor layer and penetrating through the resin insulating layer and having an end exposed on the second surface side;
The dummy area includes a dummy pattern formed on the first surface of the resin insulating layer and a dummy that penetrates the resin insulating layer and is connected to the dummy pattern so that an end portion is exposed on the second surface side. With a post or dummy wall,
The dummy post or the dummy wall is connected to only a part of the dummy pattern. 2. The printed wiring board according to claim 1, wherein a difference between a remaining copper ratio in the dummy area and a remaining copper ratio in the product area is 10% or less on the second surface of the resin insulating layer. 3. The printed wiring board according to claim 1, wherein the dummy pattern is a circle, an ellipse, a rhombus, or a polygon. It is a printed wiring board of any one of Claims 1-3, Comprising: The said dummy post is formed in at least 2 rows, and each dummy post is arrange | positioned at zigzag form. 3. The printed wiring board according to claim 1, wherein the dummy pattern has a linear pattern arranged in parallel and intersects to be formed in a mesh shape, and the dummy wall is formed only on a part of the linear pattern. 4. Is formed. It is a printed wiring board of any one of Claims 1-5, Comprising: The said resin insulation layer is formed with resin which does not contain a core material. It is a printed wiring board of any one of Claims 1-6, Comprising: The laminated resin insulating layer is further formed in the said 2nd surface of the said resin insulating layer, and outermost layer resin of this laminated resin insulating layer Dummy posts or dummy walls are exposed on the insulating layer. It is a printed wiring board of any one of Claims 1-7, Comprising: Both the said conductor post and the said dummy post, or a dummy wall are formed of the electroplating film. It is a printed wiring board of any one of Claims 1-8, Comprising: The remaining copper rate of the said dummy area is 5 to 30% on the 2nd surface side of the said resin insulation layer. 10. The printed wiring board according to claim 1, wherein a height of the conductor post and the dummy post or the dummy wall is 10 to 150 μm, and a thickness of the first conductor layer is 5. ˜30 μm. It is a printed wiring board of any one of Claims 1-10, Comprising: The said resin insulation layer is for mold forming whose coefficient of thermal expansion is 3-120 ppm / degreeC, and whose elasticity modulus is 0.01-30 GPa. Made of resin material. It is a printed wiring board of any one of Claims 1-11, Comprising: The said resin insulation layer contains 70 to 90 weight% of inorganic fillers. It is a printed wiring board of any one of Claims 1-12, Comprising: The roughening process which roughens surface roughness is given to the side surface of the said conductor post and / or the said dummy post or a dummy wall. It is a printed wiring board of any one of Claims 1-13, Comprising: The surface protective film is formed in the said edge part of the said conductor post. 15. The printed wiring board according to claim 14, wherein a surface protection film made of a material different from a material of the surface protection film formed on the end portion of the conductor post is formed on the exposed surface of the first conductor layer. ing. It is a printed wiring board of any one of Claims 1-15, Comprising: Solder is apply | coated to the said edge part of the said conductor post. A method of manufacturing a multi-piece printed wiring board having a product area including a plurality of printed wiring boards and a dummy area formed around one or more of the product areas,
Preparing a metal film,
Forming a wiring pattern and a dummy pattern of the first conductor layer for a plurality of multi-cavity printed wiring boards on the metal film;
Forming a conductor post and a dummy post or a dummy wall on the partial pattern of the first conductor layer and the partial pattern of the dummy pattern, respectively;
Forming a resin insulating layer so as to cover the exposed surface of the first conductor layer and the side surface of the conductor post and the dummy post or the dummy wall;
Polishing the second surface side of the resin insulating layer to expose the end of the conductor post and the dummy post or dummy wall;
Removing the support plate and the metal film, and cutting and separating into a multi-piece printed wiring board including one or two or more product areas, in the order in which one is performed,
Including
The dummy post or the dummy wall is connected to only a part of the dummy pattern, and is formed so as to penetrate through the resin insulating layer and to expose an end portion on the second surface side of the resin insulating layer. The The method for manufacturing a multi-cavity printed wiring board according to claim 17, wherein the conductor post and the dummy post or the dummy wall are simultaneously formed by electroplating. The method for manufacturing a multi-cavity printed wiring board according to claim 17 or 18, wherein a roughening process is performed on a side surface of the conductor post and the dummy post or the dummy wall before forming the resin insulating layer.

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