JP2016136547A - 電界効果トランジスタ - Google Patents
電界効果トランジスタ Download PDFInfo
- Publication number
- JP2016136547A JP2016136547A JP2013099523A JP2013099523A JP2016136547A JP 2016136547 A JP2016136547 A JP 2016136547A JP 2013099523 A JP2013099523 A JP 2013099523A JP 2013099523 A JP2013099523 A JP 2013099523A JP 2016136547 A JP2016136547 A JP 2016136547A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- source electrode
- drain electrode
- electrode
- effect transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005669 field effect Effects 0.000 title claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims description 37
- 150000004767 nitrides Chemical class 0.000 claims description 36
- 230000005684 electric field Effects 0.000 abstract description 13
- 238000000034 method Methods 0.000 description 24
- 229910002704 AlGaN Inorganic materials 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- 238000010586 diagram Methods 0.000 description 15
- 230000015556 catabolic process Effects 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000005533 two-dimensional electron gas Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013099523A JP2016136547A (ja) | 2013-05-09 | 2013-05-09 | 電界効果トランジスタ |
PCT/JP2014/051779 WO2014181556A1 (fr) | 2013-05-09 | 2014-01-28 | Transistor à effet de champ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013099523A JP2016136547A (ja) | 2013-05-09 | 2013-05-09 | 電界効果トランジスタ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016136547A true JP2016136547A (ja) | 2016-07-28 |
Family
ID=51867043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013099523A Pending JP2016136547A (ja) | 2013-05-09 | 2013-05-09 | 電界効果トランジスタ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2016136547A (fr) |
WO (1) | WO2014181556A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11443956B2 (en) | 2020-02-06 | 2022-09-13 | Sumitomo Electric Industries, Ltd. | Method for manufacturing semiconductor device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6372524B2 (ja) * | 2016-06-29 | 2018-08-15 | サンケン電気株式会社 | 半導体装置及びその製造方法 |
JP7157138B2 (ja) * | 2018-03-22 | 2022-10-19 | パナソニックホールディングス株式会社 | 窒化物半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008086001A2 (fr) * | 2007-01-10 | 2008-07-17 | International Rectifier Corporation | Mise en forme de zone active pour dispositif au nitrure iii et procédé de fabrication |
US7750370B2 (en) * | 2007-12-20 | 2010-07-06 | Northrop Grumman Space & Mission Systems Corp. | High electron mobility transistor having self-aligned miniature field mitigating plate on a protective dielectric layer |
JP2010278150A (ja) * | 2009-05-27 | 2010-12-09 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
JP5825018B2 (ja) * | 2011-09-29 | 2015-12-02 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
-
2013
- 2013-05-09 JP JP2013099523A patent/JP2016136547A/ja active Pending
-
2014
- 2014-01-28 WO PCT/JP2014/051779 patent/WO2014181556A1/fr active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11443956B2 (en) | 2020-02-06 | 2022-09-13 | Sumitomo Electric Industries, Ltd. | Method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
WO2014181556A1 (fr) | 2014-11-13 |
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