JP2016123982A - SiC材料の加工方法 - Google Patents
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
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- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
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- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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Abstract
【解決手段】SiC材料の切断予定面に対しレーザ光を吸収させて複数の線状の変質領域を形成した後、SiC材料を切断予定面に沿って切断するSiC材料の加工方法であって、所定方向へ延びる複数の線状の主変質領域12を第1ピッチP1で並べて形成し、当該所定方向へ延びる変質領域群13とし、変質領域群13を第1ピッチP1より長い第2ピッチP2で並べて複数形成するようにした。
【選択図】図3
Description
図1に示すように、SiC材料1は、円筒状に形成され、所定の切断予定面100で切断されることにより、複数のSiC基板210に分割される。本実施形態においては、SiC材料1は6H型SiCからなり、直径を例えば3インチとすることができる。また、分割された各SiC基板210は、例えば半導体デバイスの基板として利用される。
図2に示すように、レーザ照射装置300は、レーザ光をパルス発振するレーザ発振器310と、発振されたレーザ光の方向を変えるミラー320と、レーザ光をフォーカシングする光学レンズ330と、レーザ光の照射対象であるSiC積層体1を支持するステージ340と、を備えている。尚、図2には特に細かい光学系は図示していないが、レーザ照射装置300は、焦点位置調整、ビーム形状調整、収差補正等が可能となっている。また、レーザ照射装置300は、レーザ光の経路を真空状態に維持するハウジング350を有している。本実施形態においては、このレーザ照射装置300を用い、6H型SiCのSiC材料1にレーザ光を照射して、レーザ光の内部に変質領域を形成し、SiC材料1を切断する。
11 未変質領域
12 主変質領域
13 変質領域群
22 補助変質領域
23 補助変質領域群
100 切断予定面
210 SiC基板
300 レーザ照射装置
310 レーザ発振器
320 ミラー
330 光学レンズ
340 ステージ
350 ハウジング
Claims (6)
- SiC材料の切断予定面に対しレーザ光を吸収させて複数の線状の変質領域からなる変質パターンを形成した後、前記SiC材料を前記切断予定面に沿って切断するSiC材料の加工方法であって、
前記変質パターンは、所定方向へ延び第1のピッチで並べられた複数の線状の主変質領域からなる変質領域群を有し、
前記変質領域群は、前記第1のピッチより長い第2ピッチで複数並べられるSiC材料の加工方法。 - 前記変質パターンは、前記所定方向と異なる方向へ延びる複数の線状の補助変質領域を有し、
前記補助変質領域は、少なくとも隣接する2つの前記変質領域群を跨ぐように形成される請求項1に記載のSiC材料の加工方法。 - 前記各補助変質領域は、前記変質領域群に対して略直交する方向へ延びる請求項2に記載のSiC材料の加工方法。
- 1つの前記変質領域群に含まれる主変質領域の数は、2以上10以下である請求項1から3のいずれか1項に記載のSiC材料の加工方法。
- 前記第1のピッチは、1.0μm以上50μm未満であり、
前記第2のピッチは、50μm以上500μm以下である請求項1から4のいずれか1項に記載のSiC材料の加工方法。 - SiC材料の切断予定面に対しレーザ光を吸収させて複数の線状の変質領域からなる変質パターンを形成した後、前記SiC材料を前記切断予定面に沿って切断するSiC材料の加工方法であって、
前記変質パターンは、所定方向へ延びる複数の線状の主変質領域を有し、
前記各主変質領域間のピッチは、少なくとも2種類以上であるSiC材料の加工方法。
Priority Applications (3)
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JP2014264140A JP5917677B1 (ja) | 2014-12-26 | 2014-12-26 | SiC材料の加工方法 |
PCT/JP2015/082171 WO2016103977A1 (ja) | 2014-12-26 | 2015-11-16 | SiC材料の加工方法 |
US15/539,708 US20170355041A1 (en) | 2014-12-26 | 2015-11-16 | METHOD FOR PROCESSING SiC MATERIAL |
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JP2014264140A JP5917677B1 (ja) | 2014-12-26 | 2014-12-26 | SiC材料の加工方法 |
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JP2016123982A true JP2016123982A (ja) | 2016-07-11 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107717248A (zh) * | 2016-08-10 | 2018-02-23 | 株式会社迪思科 | SiC晶片的生成方法 |
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JP6395633B2 (ja) * | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP6395632B2 (ja) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP6429715B2 (ja) * | 2015-04-06 | 2018-11-28 | 株式会社ディスコ | ウエーハの生成方法 |
JP6472333B2 (ja) | 2015-06-02 | 2019-02-20 | 株式会社ディスコ | ウエーハの生成方法 |
JP6478821B2 (ja) * | 2015-06-05 | 2019-03-06 | 株式会社ディスコ | ウエーハの生成方法 |
JP6482425B2 (ja) * | 2015-07-21 | 2019-03-13 | 株式会社ディスコ | ウエーハの薄化方法 |
JP6472347B2 (ja) * | 2015-07-21 | 2019-02-20 | 株式会社ディスコ | ウエーハの薄化方法 |
JP6690983B2 (ja) | 2016-04-11 | 2020-04-28 | 株式会社ディスコ | ウエーハ生成方法及び実第2のオリエンテーションフラット検出方法 |
WO2017199784A1 (ja) * | 2016-05-17 | 2017-11-23 | エルシード株式会社 | 加工対象材料の切断方法 |
JP6669594B2 (ja) * | 2016-06-02 | 2020-03-18 | 株式会社ディスコ | ウエーハ生成方法 |
JP6678522B2 (ja) * | 2016-06-10 | 2020-04-08 | 株式会社ディスコ | ウエーハ生成方法及び剥離装置 |
JP2018093046A (ja) * | 2016-12-02 | 2018-06-14 | 株式会社ディスコ | ウエーハ生成方法 |
JP6858587B2 (ja) | 2017-02-16 | 2021-04-14 | 株式会社ディスコ | ウエーハ生成方法 |
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JP4110219B2 (ja) * | 2002-08-30 | 2008-07-02 | 株式会社東京精密 | レーザーダイシング装置 |
NL1030004C2 (nl) * | 2005-09-21 | 2007-03-22 | Fico Singulation B V | Inrichting en werkwijze voor het separeren van elektronische componenten. |
JP2007142001A (ja) * | 2005-11-16 | 2007-06-07 | Denso Corp | レーザ加工装置およびレーザ加工方法 |
JP5480169B2 (ja) * | 2011-01-13 | 2014-04-23 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP5917862B2 (ja) * | 2011-08-30 | 2016-05-18 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
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- 2014-12-26 JP JP2014264140A patent/JP5917677B1/ja active Active
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2015
- 2015-11-16 US US15/539,708 patent/US20170355041A1/en not_active Abandoned
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107717248A (zh) * | 2016-08-10 | 2018-02-23 | 株式会社迪思科 | SiC晶片的生成方法 |
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JP5917677B1 (ja) | 2016-05-18 |
US20170355041A1 (en) | 2017-12-14 |
WO2016103977A1 (ja) | 2016-06-30 |
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