JP2016115399A5 - - Google Patents
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- JP2016115399A5 JP2016115399A5 JP2014250384A JP2014250384A JP2016115399A5 JP 2016115399 A5 JP2016115399 A5 JP 2016115399A5 JP 2014250384 A JP2014250384 A JP 2014250384A JP 2014250384 A JP2014250384 A JP 2014250384A JP 2016115399 A5 JP2016115399 A5 JP 2016115399A5
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- JP
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- Prior art keywords
- resin core
- connection terminal
- color
- transparent electrode
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011347 resin Substances 0.000 claims 22
- 229920005989 resin Polymers 0.000 claims 22
- 238000000034 method Methods 0.000 claims 11
- 239000002245 particle Substances 0.000 claims 9
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- 239000000945 filler Substances 0.000 claims 7
- 238000007689 inspection Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 4
- 238000004040 coloring Methods 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 230000000295 complement effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014250384A JP6457255B2 (ja) | 2014-12-10 | 2014-12-10 | 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 |
| KR1020177014219A KR101908876B1 (ko) | 2014-12-10 | 2015-12-09 | 접속체의 검사 방법, 접속체, 도전성 입자 및 이방성 도전 접착제 |
| PCT/JP2015/084478 WO2016093261A1 (ja) | 2014-12-10 | 2015-12-09 | 接続体の検査方法、接続体、導電性粒子及び異方性導電接着剤 |
| CN201580064653.9A CN107005012B (zh) | 2014-12-10 | 2015-12-09 | 连接体的检查方法、连接体、导电性粒子及各向异性导电粘接剂 |
| TW104141229A TWI694473B (zh) | 2014-12-10 | 2015-12-09 | 連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014250384A JP6457255B2 (ja) | 2014-12-10 | 2014-12-10 | 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016115399A JP2016115399A (ja) | 2016-06-23 |
| JP2016115399A5 true JP2016115399A5 (enExample) | 2018-01-11 |
| JP6457255B2 JP6457255B2 (ja) | 2019-01-23 |
Family
ID=56107438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014250384A Active JP6457255B2 (ja) | 2014-12-10 | 2014-12-10 | 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6457255B2 (enExample) |
| KR (1) | KR101908876B1 (enExample) |
| CN (1) | CN107005012B (enExample) |
| TW (1) | TWI694473B (enExample) |
| WO (1) | WO2016093261A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6766558B2 (ja) * | 2016-09-29 | 2020-10-14 | セイコーエプソン株式会社 | ヘッドユニット |
| JP7777331B2 (ja) * | 2021-11-15 | 2025-11-28 | 株式会社ケムソル | 異方性導電フィルム並びにそれを用いた接合方法及び接合体 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3542611B2 (ja) * | 1991-07-26 | 2004-07-14 | 積水化学工業株式会社 | 導電性微粒子、電極接続構造体及びその製造方法 |
| CN1240527A (zh) * | 1996-10-15 | 2000-01-05 | 西门子公司 | 带接点区的芯片卡以及制造这种芯片卡的方法 |
| KR20010098662A (ko) * | 2000-04-17 | 2001-11-08 | 가마이 고로 | 터치식 액정 표시 장치 및 입력 검출 방법 |
| JP2005026577A (ja) | 2003-07-04 | 2005-01-27 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法 |
| JP2006054109A (ja) * | 2004-08-12 | 2006-02-23 | Seiko Instruments Inc | 異方性導電膜及びそれを用いた表示装置、並びに、表示装置の検査方法及び検査装置 |
| KR100720895B1 (ko) * | 2005-07-05 | 2007-05-22 | 제일모직주식회사 | 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물 |
| KR20070096572A (ko) * | 2006-03-27 | 2007-10-02 | 삼성전자주식회사 | 표시 장치 |
| CN102160125B (zh) * | 2008-09-19 | 2013-07-03 | 株式会社日本触媒 | 导电性微粒以及使用了该导电性微粒的各向异性导电材料 |
| JP5833809B2 (ja) * | 2010-02-01 | 2015-12-16 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体及び接続方法 |
| CN103080876A (zh) * | 2010-07-05 | 2013-05-01 | Dic株式会社 | 带透明导电层的基体及其制造方法、以及触控面板用透明导电膜层叠体、触控面板 |
| GB201212489D0 (en) * | 2012-07-13 | 2012-08-29 | Conpart As | Improvements in conductive adhesives |
| KR101477237B1 (ko) * | 2012-12-27 | 2014-12-29 | 제일모직 주식회사 | 레이저를 이용한 접속 방법 |
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2014
- 2014-12-10 JP JP2014250384A patent/JP6457255B2/ja active Active
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2015
- 2015-12-09 TW TW104141229A patent/TWI694473B/zh active
- 2015-12-09 WO PCT/JP2015/084478 patent/WO2016093261A1/ja not_active Ceased
- 2015-12-09 CN CN201580064653.9A patent/CN107005012B/zh active Active
- 2015-12-09 KR KR1020177014219A patent/KR101908876B1/ko active Active