JP2016108556A5 - - Google Patents

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Publication number
JP2016108556A5
JP2016108556A5 JP2015232286A JP2015232286A JP2016108556A5 JP 2016108556 A5 JP2016108556 A5 JP 2016108556A5 JP 2015232286 A JP2015232286 A JP 2015232286A JP 2015232286 A JP2015232286 A JP 2015232286A JP 2016108556 A5 JP2016108556 A5 JP 2016108556A5
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
acrylic particles
epoxy
polymethacrylate
Prior art date
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Application number
JP2015232286A
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English (en)
Japanese (ja)
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JP2016108556A (ja
JP6067828B2 (ja
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Publication of JP2016108556A publication Critical patent/JP2016108556A/ja
Publication of JP2016108556A5 publication Critical patent/JP2016108556A5/ja
Application granted granted Critical
Publication of JP6067828B2 publication Critical patent/JP6067828B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015232286A 2014-11-28 2015-11-27 粘着剤組成物及びそれを用いた粘着シート Active JP6067828B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014242550 2014-11-28
JP2014242550 2014-11-28

Publications (3)

Publication Number Publication Date
JP2016108556A JP2016108556A (ja) 2016-06-20
JP2016108556A5 true JP2016108556A5 (OSRAM) 2016-11-17
JP6067828B2 JP6067828B2 (ja) 2017-01-25

Family

ID=56074505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015232286A Active JP6067828B2 (ja) 2014-11-28 2015-11-27 粘着剤組成物及びそれを用いた粘着シート

Country Status (6)

Country Link
US (1) US10808152B2 (OSRAM)
EP (1) EP3225673B1 (OSRAM)
JP (1) JP6067828B2 (OSRAM)
KR (1) KR102472818B1 (OSRAM)
CN (1) CN107001898B (OSRAM)
WO (1) WO2016084960A1 (OSRAM)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5888349B2 (ja) * 2014-01-29 2016-03-22 大日本印刷株式会社 粘着剤組成物およびそれを用いた粘着シート
KR102472818B1 (ko) * 2014-11-28 2022-12-02 다이니폰 인사츠 가부시키가이샤 점착제 조성물, 및 그것을 사용한 점착 시트
CA3052051C (en) * 2017-02-07 2021-10-26 Ppg Industries Ohio, Inc. Low-temperature curing adhesive compositions
WO2019087116A2 (en) * 2017-11-01 2019-05-09 3M Innovative Properties Company Low combustibility adhesive composition with layered construction
CN109837032B (zh) * 2017-11-27 2024-02-13 中国科学院大连化学物理研究所 一种金属表面用高拉伸强度快速固化胶黏剂的结构及应用
MX2020008332A (es) 2018-02-09 2020-09-21 Ppg Ind Ohio Inc Composiciones de recubrimiento.
JP7138764B2 (ja) 2018-07-25 2022-09-16 エルジー・ケム・リミテッド 接着剤組成物
US12173194B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
KR102183704B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
CN112449650B (zh) 2018-07-25 2023-03-28 株式会社Lg化学 粘合剂组合物
EP3825377B1 (en) 2018-07-25 2022-11-02 LG Chem, Ltd. Adhesive composition
WO2020022798A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
WO2020022801A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
JP2020105268A (ja) * 2018-12-26 2020-07-09 スリーエム イノベイティブ プロパティズ カンパニー 帯電防止性積層体及び帯電防止性接着剤
JP2020105280A (ja) * 2018-12-26 2020-07-09 スリーエム イノベイティブ プロパティズ カンパニー 耐熱性積層体及び耐熱性接着剤
CN113710762B (zh) * 2019-02-26 2023-08-04 艾利丹尼森公司 具有高剪切和剥离性质的psa组合物
CN111668122B (zh) * 2019-03-08 2022-03-25 矽磐微电子(重庆)有限公司 半导体封装方法
US20220186083A1 (en) * 2019-03-28 2022-06-16 Nitto Denko Corporation Curable Adhesive Sheet and Production Method of Curable Adhesive Sheet
WO2020217955A1 (ja) * 2019-04-26 2020-10-29 三井化学東セロ株式会社 粘着性フィルムおよび電子装置の製造方法
EP4253039A4 (en) * 2020-11-27 2024-10-23 Toray Industries, Inc. PREPREG AND PREPREG PRODUCTION METHOD
CN119731283A (zh) 2022-09-05 2025-03-28 大日本印刷株式会社 粘接片、粘接剂组合物及结构体
KR102879361B1 (ko) * 2023-12-07 2025-10-31 주식회사 케이씨씨 접착제 조성물

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JPS5928591B2 (ja) * 1980-11-25 1984-07-13 大日本塗料株式会社 ジエツト印刷用インク
DE3674902D1 (de) * 1985-06-26 1990-11-15 Dow Chemical Co Mit rubber modifizierte epoxyzusammensetzungen.
EP0825222B1 (en) * 1996-02-21 2005-06-01 Toray Industries, Inc. Yarn preprared and fiber-reinforced composite material prepeared therefrom
JP2003082034A (ja) 2001-09-13 2003-03-19 Hitachi Chem Co Ltd アクリル樹脂、これを用いた接着剤及び接着フィルム
JP2004018803A (ja) * 2002-06-20 2004-01-22 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP5027509B2 (ja) * 2004-08-18 2012-09-19 株式会社カネカ 半導体封止剤用エポキシ樹脂組成物およびエポキシ樹脂成形材料
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JP5019363B2 (ja) * 2007-02-22 2012-09-05 信越化学工業株式会社 エポキシ樹脂接着剤組成物
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CN102057010A (zh) * 2008-04-11 2011-05-11 3M创新有限公司 单组分环氧基结构粘合剂
ES2662646T3 (es) * 2008-06-12 2018-04-09 Henkel IP & Holding GmbH Composiciones adhesivas epóxicas estructurales de dos partes, altamente reforzadas, de nueva generación
JP2011529118A (ja) * 2008-07-23 2011-12-01 スリーエム イノベイティブ プロパティズ カンパニー 二液型エポキシ系構造用接着剤
JP5332471B2 (ja) * 2008-10-02 2013-11-06 横浜ゴム株式会社 接着剤用エポキシ樹脂組成物
KR20120039753A (ko) * 2009-08-05 2012-04-25 아지노모토 가부시키가이샤 필름
JP5540814B2 (ja) 2010-03-26 2014-07-02 大日本印刷株式会社 粘接着シート
WO2012102201A1 (ja) * 2011-01-28 2012-08-02 東レ株式会社 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
JP2013006974A (ja) * 2011-06-24 2013-01-10 Dainippon Printing Co Ltd 接着剤組成物およびそれを用いた接着シート
CN103131374B (zh) * 2013-03-21 2015-02-11 黑龙江省科学院石油化学研究院 无机有机纳米粒子复合改性环氧树脂胶粘剂及其制备方法
KR102472818B1 (ko) * 2014-11-28 2022-12-02 다이니폰 인사츠 가부시키가이샤 점착제 조성물, 및 그것을 사용한 점착 시트

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