JP2016103504A - エッチングシステム - Google Patents
エッチングシステム Download PDFInfo
- Publication number
- JP2016103504A JP2016103504A JP2014239619A JP2014239619A JP2016103504A JP 2016103504 A JP2016103504 A JP 2016103504A JP 2014239619 A JP2014239619 A JP 2014239619A JP 2014239619 A JP2014239619 A JP 2014239619A JP 2016103504 A JP2016103504 A JP 2016103504A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- filtration device
- etching solution
- circulation line
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 143
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000002002 slurry Substances 0.000 claims abstract description 20
- 239000012528 membrane Substances 0.000 claims abstract description 17
- 238000011085 pressure filtration Methods 0.000 claims description 24
- 238000005374 membrane filtration Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 15
- 238000007654 immersion Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 abstract description 46
- 239000007788 liquid Substances 0.000 abstract description 24
- 238000000926 separation method Methods 0.000 abstract description 7
- 239000010802 sludge Substances 0.000 description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000002440 industrial waste Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- -1 aluminum compound Chemical class 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011045 prefiltration Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Surface Treatment Of Glass (AREA)
- Weting (AREA)
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
14−エッチング装置
16−濾過処理部
18−MF濾過装置
20−フィルタープレス
22−汚泥収容槽
100−ガラス基板
142−エッチング処理部
144−エッチング液供給部
182−MF濾過タンク
184−マイクロフィルタ
186−散気管装置
188−スラリー収容槽
Claims (4)
- フラットパネルディスプレイ用ガラス基板に対してエッチング処理を実行するエッチングシステムであって、
少なくともエッチング液槽を備え、エッチング液槽に収容されたエッチング液をガラス基板に接触させることによりエッチング処理を行うように構成されたエッチング装置と、
前記エッチング液槽のエッチング液を外部に取り出すとともに、濾過して前記エッチング液槽に返送するように構成された循環ラインと、
前記循環ラインに配置され、導入されたエッチング液を濾過する浸漬膜を備えた膜式濾過装置と、
前記循環ラインにおける前記膜式濾過装置の後段に配置され、前記浸漬膜にて捕捉されたスラリーを受け入れて固液分離するように構成された加圧式濾過装置と、
を備えたエッチングシステム。 - 前記膜式濾過装置および前記加圧式濾過装置で濾過されたエッチング液が、それぞれ前記エッチング液槽に返送されることを特徴とする請求項1に記載のエッチングシステム。
- 前記加圧式濾過装置で濾過されたエッチング液が、前記循環ラインにおける前記膜式濾過装置の前段に返送されることを特徴とする請求項1に記載のエッチングシステム。
- 前記膜式濾過装置がMF膜濾過装置であり、前記加圧式濾過装置がフィルタープレスであることを特徴とする請求項1〜3のいずれか1項に記載のエッチングシステム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014239619A JP6300707B2 (ja) | 2014-11-27 | 2014-11-27 | エッチングシステム |
TW104139435A TWI661483B (zh) | 2014-11-27 | 2015-11-26 | Etching system |
PCT/JP2015/083143 WO2016084871A1 (ja) | 2014-11-27 | 2015-11-26 | エッチングシステム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014239619A JP6300707B2 (ja) | 2014-11-27 | 2014-11-27 | エッチングシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016103504A true JP2016103504A (ja) | 2016-06-02 |
JP6300707B2 JP6300707B2 (ja) | 2018-03-28 |
Family
ID=56074423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014239619A Active JP6300707B2 (ja) | 2014-11-27 | 2014-11-27 | エッチングシステム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6300707B2 (ja) |
TW (1) | TWI661483B (ja) |
WO (1) | WO2016084871A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107540233A (zh) * | 2017-09-07 | 2018-01-05 | 凯盛科技股份有限公司 | 一种顶喷式蚀刻系统的储酸循环装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005342574A (ja) * | 2004-06-01 | 2005-12-15 | Sanyo Electric Co Ltd | 処理装置およびそれを用いた被処理水の処理方法 |
JP2008127585A (ja) * | 2006-11-16 | 2008-06-05 | Kurita Water Ind Ltd | エッチング方法およびエッチング装置 |
JP2009016648A (ja) * | 2007-07-06 | 2009-01-22 | Dainippon Screen Mfg Co Ltd | ガラス基板処理装置 |
JP2013107380A (ja) * | 2011-10-28 | 2013-06-06 | Fujifilm Corp | 平版印刷版用支持体の製造方法及び製造装置 |
WO2014181552A1 (ja) * | 2013-05-10 | 2014-11-13 | パナソニック株式会社 | ガラス研磨液の再生方法とガラス研磨装置 |
-
2014
- 2014-11-27 JP JP2014239619A patent/JP6300707B2/ja active Active
-
2015
- 2015-11-26 TW TW104139435A patent/TWI661483B/zh active
- 2015-11-26 WO PCT/JP2015/083143 patent/WO2016084871A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005342574A (ja) * | 2004-06-01 | 2005-12-15 | Sanyo Electric Co Ltd | 処理装置およびそれを用いた被処理水の処理方法 |
JP2008127585A (ja) * | 2006-11-16 | 2008-06-05 | Kurita Water Ind Ltd | エッチング方法およびエッチング装置 |
JP2009016648A (ja) * | 2007-07-06 | 2009-01-22 | Dainippon Screen Mfg Co Ltd | ガラス基板処理装置 |
JP2013107380A (ja) * | 2011-10-28 | 2013-06-06 | Fujifilm Corp | 平版印刷版用支持体の製造方法及び製造装置 |
WO2014181552A1 (ja) * | 2013-05-10 | 2014-11-13 | パナソニック株式会社 | ガラス研磨液の再生方法とガラス研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6300707B2 (ja) | 2018-03-28 |
TWI661483B (zh) | 2019-06-01 |
TW201631651A (zh) | 2016-09-01 |
WO2016084871A1 (ja) | 2016-06-02 |
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