JP2016051797A - Laminate, method of manufacturing wiring board using laminate, wiring board, and method of manufacturing mounting board including wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a long laminate for manufacturing a wiring board on which electronic components are mounted.SOLUTION: A laminate includes an insulating layer, a first metal layer provided on the first side of the insulating layer, a second metal layer provided on the second side of the insulating layer, and a protective layer covering the outer surface and a pair of sides of the second metal layer. A pair of sides of the insulating layer are located on the outside of a pair of second metal layer. The protective layer spreads from a position on the outer surface of the second metal layer to a position on the second surface of the insulating layer located between a pair of sides of the insulating layer and a pair of sides of the second metal layer, so as to cover the pair of sides of the second metal layer.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a long laminate for producing a wiring board on which electronic components are mounted. The present invention also relates to a method for manufacturing a wiring board using a laminate, a wiring board, and a method for manufacturing a mounting board including the wiring board.

  Conventionally, rigid substrates with low flexibility have been mainly used as substrates on which electronic components are mounted. For example, Patent Document 1 discloses a rigid substrate including an aluminum plate and a wiring configured by a copper foil provided on the aluminum plate via an insulating layer such as a prepreg. The aluminum plate can fulfill the function of enhancing rigidity and heat dissipation in the rigid substrate.

JP 59-148393 A

  A rigid substrate having an aluminum plate as described above is generally manufactured as follows. First, a laminate including an aluminum plate and a copper foil provided on the entire area of the aluminum plate via an insulating layer is prepared. Next, wiring etc. are comprised by etching copper foil using the etching liquid which can melt | dissolve copper. In this case, a resist layer having a pattern corresponding to the wiring or the like is provided on the copper foil prior to the etching step. Further, a protective layer such as a resist layer for preventing the outer surface of the aluminum plate from coming into contact with the etching solution is also provided on the outer surface of the aluminum plate. Further, a protective tape for preventing the etching solution from coming into contact with the end surface of the aluminum plate is also attached to the end surface of the aluminum plate. Thereby, when etching a copper foil, it can suppress that an aluminum plate melt | dissolves in etching liquid, and it can prevent that etching liquid deteriorates by the melt | dissolved aluminum by this.

  By the way, in recent years, instead of a rigid substrate such as a glass epoxy substrate, a flexible substrate having flexibility tends to be used. The flexible substrate has various advantages such as being lightweight and capable of supporting a three-dimensional shape such as a cylindrical shape or a mountain shape.

  When an electronic component that generates a large amount of heat is mounted on a flexible substrate, it is important to ensure heat dissipation of the flexible substrate. For example, in the flexible substrate as well, as in the case of the above-mentioned rigid substrate, it is conceivable to provide a second metal layer for improving heat dissipation separately from the first metal layer constituting the wiring. On the other hand, when producing a flexible substrate, the process of forming a wiring by etching the first metal layer is generally performed on a long laminate that is conveyed by roll-to-roll. For this reason, it is difficult to employ a method of attaching a protective tape to the end surface as in the case of the above-mentioned rigid substrate as a method of protecting the end surface of the second metal layer from the etching solution.

  The present invention has been made in consideration of such points, and a laminated body capable of suppressing the second metal layer from being dissolved in an etching solution for etching the first metal layer. The purpose is to provide. Another object of the present invention is to provide a method for manufacturing a wiring board using a laminate, a wiring board, and a method for manufacturing a mounting board including the wiring board.

  The present invention is a long laminate for producing a wiring board on which electronic components are mounted, the first surface, a second surface located on the opposite side of the first surface, and the first A first metal layer provided on the first surface side of the insulating layer; and an insulating layer having a pair of side portions extending along a longitudinal direction of the stacked body between the surface and the second surface And a second metal layer provided on the second surface side of the insulating layer, wherein the second metal layer has an inner surface facing the second surface of the insulating layer, and an opposite side of the inner surface. And a pair of side portions extending along the longitudinal direction of the laminate between the inner surface and the outer surface, the laminate including the outer surface of the second metal layer and And a protective layer covering the pair of side portions, wherein the pair of side portions of the insulating layer is located outside the pair of side portions of the second metal layer. The protective layer covers the pair of side portions of the insulating layer and the pair of second metal layers from a position on the outer surface of the second metal layer so as to cover the pair of side portions of the second metal layer. The laminated body extends to a position on the second surface of the insulating layer located between a pair of side portions.

  In the laminate according to the present invention, the insulating layer may include an adhesive that bonds the first metal layer and the second metal layer. Alternatively, the insulating layer includes a resin layer, a first adhesive layer provided between the resin layer and the first metal layer, and a first layer provided between the resin layer and the second metal layer. 2 adhesive layers.

  In the laminate according to the present invention, the first metal layer may include copper, and the second metal layer may include at least one of copper, aluminum, silver, or iron.

The present invention is a method for manufacturing a wiring board on which an electronic component is mounted, the wiring board comprising: a mounting electrode portion on which the electronic component is mounted; and a wiring connected to the mounting electrode portion. The method for manufacturing the wiring board includes a step of preparing the laminate described above, and a pattern corresponding to the mounting electrode portion and the wiring on the outer surface of the first metal layer of the laminate. A step of forming a resist layer, an etching step of etching the first metal layer using an etchant,
Removing the resist layer, and obtaining the wiring board including the mounting electrode portion including the first metal layer and the wiring.

  In the method for manufacturing a wiring board according to the present invention, the first metal layer includes copper, the second metal layer includes at least one of copper, aluminum, silver, and iron, and the etching solution is chloride. It may contain at least one of ferric and cupric chloride.

  The method for manufacturing a wiring board according to the present invention may further include a slitting step for removing a portion of the insulating layer located outside the pair of side portions of the insulating layer after the etching step. Good. The method for manufacturing a wiring board according to the present invention may further include a step of removing the protective layer after the etching step. In the method for manufacturing a wiring board according to the present invention, after the etching step, a reflective layer that reflects light is provided in a region on the first surface side of the insulating layer that does not overlap the mounting electrode portion. You may further provide the process.

  The present invention is a wiring board on which an electronic component is mounted, and includes a first surface, a second surface positioned on the opposite side of the first surface, and a first surface between the first surface and the second surface. An insulating layer having a pair of side portions extending along one direction; a mounting electrode portion provided on the first surface side of the insulating layer on which the electronic component is mounted; and the first of the insulating layer. A wiring provided on one surface side and connected to the mounting electrode portion; and a metal layer provided on the second surface side of the insulating layer, wherein the metal layer includes the first layer of the insulating layer. An inner surface facing two surfaces, an outer surface located on the opposite side of the inner surface, and a pair of side portions extending along the first direction between the inner surface and the outer surface, and the insulating layer The pair of side portions is a wiring board positioned outside the pair of side portions of the metal layer.

  The wiring board according to the present invention further includes a protective layer that covers the outer surface of the metal layer and the pair of side portions, and the protective layer covers the pair of side portions of the second metal layer. Extending from a position on the outer surface to a position on the second surface of the insulating layer located between the pair of side portions of the insulating layer and the pair of side portions of the metal layer. Good.

In the wiring board according to the present invention, the mounting electrode portion and the wiring include copper,
The metal layer may include at least one of copper, aluminum, silver, or iron.

  The wiring board according to the present invention may further include a reflective layer that is provided in a region that does not overlap the mounting electrode portion in the region on the first surface side of the insulating layer and reflects light.

  The wiring board according to the present invention may have a long shape extending along the first direction.

  The present invention is a method for manufacturing a mounting board on which electronic components are mounted, the step of preparing the wiring board described above, the mounting step of mounting the electronic component on the mounting electrode portion of the wiring board, A method for manufacturing a mounting board.

  In the mounting board manufacturing method according to the present invention, the electronic component may include a light emitting diode element.

  The method for manufacturing a mounting board according to the present invention may further include a step of attaching the wiring board on which the electronic component is mounted to a support member on the second metal layer side. In this case, the support member has a higher thermal conductivity than the insulating layer.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a 2nd metal layer melt | dissolves in the etching liquid for etching a 1st metal layer.

FIG. 1 is a plan view showing a mounting board according to an embodiment of the present invention. FIG. 2 is a longitudinal sectional view of the mounting substrate of FIG. 1 as viewed from the II-II direction. FIG. 3 is a view showing a method of manufacturing an intermediate product of a laminate for producing a wiring board on which light emitting components are mounted. FIG. 4 is a longitudinal sectional view showing an intermediate product obtained by the manufacturing method shown in FIG. FIG. 5 is a view showing a method of manufacturing a laminate for producing a wiring board on which light emitting components are mounted. FIG. 6 is a longitudinal sectional view showing a laminate obtained by the manufacturing method shown in FIG. FIG. 7 is a diagram illustrating a method of manufacturing a wiring board on which light emitting components are mounted. FIG. 8 is a longitudinal sectional view showing a case where the laminate is cut along the line VIII in FIG. 7. FIG. 9 is a longitudinal sectional view showing a case where the laminate is cut along the line IX in FIG. 7. FIG. 10 is a longitudinal sectional view showing a case where the laminate is cut along the line X in FIG. 11 is a longitudinal sectional view showing a wiring board obtained by the manufacturing method shown in FIG. FIG. 12 is a longitudinal sectional view showing the wiring board after the slit process is performed. FIG. 13 is a longitudinal sectional view showing a wiring board provided with a reflective layer. FIG. 14 is a view showing a method of manufacturing a mounting board by mounting light emitting components. FIG. 15 is a cross-sectional view illustrating an example of a lighting device including a mounting substrate. FIG. 16 is a longitudinal sectional view showing a mounting board according to a modification of the embodiment of the present invention. FIG. 17 is a longitudinal sectional view showing a laminated body according to a modification of the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones. Further, in the present specification, the terms “plate” and “sheet” are not distinguished from each other only based on the difference in names. For example, the “sheet” is a concept including a member that can be called a plate or a film. Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel” and “orthogonal”, length and angle values, and the like are bound to a strict meaning. Therefore, it should be interpreted including the extent to which similar functions can be expected.

  First, a mounting board obtained by mounting electronic components on a wiring board will be described with reference to FIGS. Here, the case where the electronic component mounted on the mounting substrate 60 is a light emitting component 61 including a light emitting element will be described. As will be described later, the mounting substrate 60 including the light emitting component 61 can be combined with an illumination cover configured as a diffusion plate and a support member such as a base or a housing to constitute an illumination device.

As shown in FIG. 1, the mounting substrate 60 includes a wiring substrate 40 that is flexible and functions as a so-called flexible substrate, and a plurality of light-emitting components 61 mounted on the wiring substrate 40. Yes. As long as a light emitting element that can function as a point light source is provided, the configuration of the light emitting component 61 is not particularly limited. For example, a light-emitting diode can be used as the light-emitting element, and a surface-mounted component including a light-emitting diode housed in a surface-mounted package can be used as the light-emitting component 61.

  As will be described later, the mounting substrate 60 is manufactured by processing a long laminate supplied in a roll shape to produce the wiring substrate 40, and the light emitting component 61 is mounted on the wiring substrate 40. In addition, it is obtained by cutting the wiring board 40 before or after mounting the light emitting component 61. In FIG. 1, the longitudinal direction of the laminate and the wiring board 40 is represented by a symbol D1, and the direction orthogonal to the longitudinal direction D1 is represented by a symbol D2. The direction D2 corresponds to a direction in which the wiring board 40 is cut. The “long direction” is a direction in which the long laminate and the wiring board 40 extend. In the following description, the longitudinal direction D1 may be referred to as a first direction D1, and the direction D2 orthogonal to the first direction D1 may be referred to as a second direction D2.

  As shown in FIG. 1, the wiring board 40 may include an extraction electrode portion 43 that is electrically connected to the light emitting component 61 via a wiring 42 described later. As shown in FIG. 1, the extraction electrode portion 43 may be formed on the same surface as the surface on which the light emitting component 61 is mounted, among the surfaces of the wiring substrate 40, or although not shown, the light emitting component 61. May be formed on the surface opposite to the surface on which is mounted.

  As shown in FIGS. 1 and 2, even if a reflective layer 44 that reflects light is provided in a region of the wiring board 40 that does not overlap the light emitting component 61, the mounting electrode portion 41, and the extraction electrode portion 43. Good. By providing such a reflective layer 44, the light that has been radiated from the light emitting component 61 and then reflected by a later-described diffusing plate or the like and returned to the mounting substrate 60 is reflected by the reflective layer 44, and the outside of the lighting device Can be emitted. Thereby, the utilization efficiency of the light in an illuminating device can be improved.

Referring to the wiring board and then 2, construction of the mounting substrate 60 will be described in detail, especially in the wiring board 40 of the mounting substrate 60 configuration. The wiring substrate 40 includes an insulating layer 23 having a first surface 23c and a second surface 23d located on the opposite side of the first surface 23c, and a mounting electrode portion 41 provided on the first surface 23c side of the insulating layer 23. And a wiring 42 provided on the first surface 23c side of the insulating layer 23 and connected to the mounting electrode portion 41, and a metal layer 22 provided on the second surface 23d side of the insulating layer 23. As shown in FIG. 2, the mounting electrode portion 41 is a portion on which the light emitting component 61 is mounted, and is also referred to as a pad or a land. The above-described wiring 42 is configured to electrically connect the mounting electrode portion 41 and the extraction electrode portion 43. In the following description, the metal layer 22 provided on the second surface 23 d side of the insulating layer 23 is also referred to as a second metal layer 22.

  In the present embodiment, “flexibility” refers to the degree that a fold does not occur in the wiring board 40 when the wiring board 40 is wound into a roll shape having a diameter of 30 cm in an environment of room temperature, for example, 25 ° C. Means flexibility. A “fold” is a deformation that appears on the wiring board 40 in a direction that intersects the winding direction of the wiring board 40, and even if the wiring board 40 is wound in the opposite direction so as to restore the deformation to the original state. Means deformation that does not return. In addition, as long as the wiring board 40 has flexibility as a whole, the degree of flexibility in each of the insulating layer 23, the second metal layer 22, the mounting electrode portion 41, and the wiring 42 is not particularly limited.

(Insulating layer)
The insulating layer 23 is a flexible layer made of an insulating resin material. The material constituting the insulating layer 23 and the thickness of the insulating layer 23 are appropriately determined according to characteristics such as flexibility and withstand voltage required for the wiring board 40. In the present embodiment, as will be described later, the insulating layer 23 is an adhesive that bonds the second metal layer 22 and the first metal layer 21 described later constituting the mounting electrode portion 41 and the wiring 42. An example including an agent will be described. In this case, the thickness of the insulating layer 23 is in the range of 1 μm to 200 μm, for example. As the adhesive constituting the insulating layer 23, for example, an epoxy resin, a silicone resin, or the like can be used.

(Second metal layer)
The second metal layer 22 is a layer provided to ensure heat dissipation in the wiring board 40. For example, the second metal layer 22 is configured to have a higher thermal conductivity than the insulating layer 23. When the wiring board 40 includes the second metal layer 22 as described above, the thermal conductivity in the surface direction of the wiring board 40 can be improved. Thereby, the temperature distribution of the stacked body 20 on the second metal layer 22 side can be made more uniform. Accordingly, when the wiring board 40 is attached to the support member 81 on the second metal layer 22 side as described later, the efficiency of heat conduction from the wiring board 40 to the support member 81 can be improved.

  As long as the wiring board 40 can have appropriate flexibility and heat dissipation, the material constituting the second metal layer 22 is not particularly limited. For example, the second metal layer 22 may include at least one of copper, aluminum, silver, or iron. In order to further improve the heat dissipation, an alumite-treated aluminum foil may be used as the second metal layer 22. The thickness of the second metal layer 22 is, for example, in the range of 10 μm to 200 μm.

(Mounting electrode, wiring, and extraction electrode)
As a material constituting the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43, a conductive material is used, and for example, a metal material such as copper or silver is used. The materials constituting the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43 may be the same or different. For example, the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43 may be formed simultaneously and continuously by patterning the same material. In the present embodiment, as will be described later, an example in which the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43 are obtained by patterning the first metal layer 21 containing copper will be described. The thickness of the mounting electrode part 41, the wiring 42, and the extraction electrode part 43, that is, the thickness of the first metal layer 21 is in the range of 1 μm to 100 μm, for example.

In FIG. 2, the surface of the second metal layer 22 that faces the second surface 23d of the insulating layer 23 is represented by reference numeral 22c, and the surface that is located on the opposite side of the surface 22c is represented by reference numeral 22d. In the following description, the surface 22c may be referred to as an inner surface 22c, and the surface 22d may be referred to as an outer surface 22d. In FIG. 2, a pair of side portions of the second metal layer 22 extending along the first direction D1 between the inner surface 22c and the outer surface 22d is represented by reference numeral 22e. A pair of side portions of the insulating layer 23 extending along the first direction D1 is represented by reference numeral 23e. In the wiring substrate 40 constituting the mounting substrate 60 shown in FIG. 2, the position of the pair of side portions 22e of the second metal layer 22 and the position of the pair of side portions 23e of the insulating layer 23 are the same in the second direction D2. I'm doing it.
(Middle layer)
In FIG. 2, reference numeral 62 denotes a gap between the light emitting component 61 and the mounting electrode portion 41 in order to couple the light emitting component 61 to the mounting electrode portion 41 and electrically connect the light emitting component 61 to the mounting electrode portion 41. Represents an intermediate layer interposed between the two. Examples of the material constituting the intermediate layer 62 include cream solder applied on the mounting electrode portion 41 in a reflow process. Cream solder includes a binder material such as flux, and metal powder that is dispersed in the binder material and melts during the reflow process. Although FIG. 2 shows an example in which the intermediate layer 62 is clearly interposed between the light emitting component 61 and the mounting electrode portion 41, the present invention is not limited to this. The shape and arrangement of the intermediate layer 62 are not particularly limited as long as the light emitting component 61 can be coupled to the mounting electrode portion 41 to electrically connect the light emitting component 61 to the mounting electrode portion 41.

  Next, the operation and effect of the present embodiment having such a configuration will be described. Here, a method of manufacturing the above-described mounting substrate 60 by processing the long laminate and manufacturing the above-described wiring substrate 40 and mounting the light emitting component 61 on the wiring substrate 40 will be described.

(Laminate manufacturing method)
First, a method for manufacturing the laminate 20 for manufacturing the wiring substrate 40 will be described with reference to FIGS. 3 to 6. 3 and 5 are views showing a laminate manufacturing apparatus 10 for manufacturing the laminate 20.

  First, as shown in FIG. 3, a first unwinding portion 11 that holds a long first metal sheet 21 a wound in a roll shape and a long second metal sheet 22 a wound in a roll shape. A second unwinding part 12 to be held is prepared. Next, the first metal sheet 21 a is unwound from the first unwinding part 11, and the second metal sheet 22 a is unwound from the second unwinding part 12. Further, an adhesive is applied on at least one of the first metal sheet 21a and the second metal sheet 22a. In FIG. 3, the example in which the adhesive agent 23a is apply | coated from the application part 13 is shown on the surface facing the 2nd metal sheet 22a among the surfaces of the 1st metal sheet 21a. Then, the 1st metal sheet 21a and the 2nd metal sheet 22a are pasted up via adhesive 23a in lamination part 14. For example, the stacked unit 14 is configured as a stacked roll that presses the first metal sheet 21a toward the second metal sheet 22a. The laminated body obtained by laminating | stacking the 1st metal sheet 21a and the 2nd metal sheet 22a is also called the intermediate product 20a in the following description. The intermediate product 20a is wound up by the first winding unit 15 as shown in FIG.

  FIG. 4 is a longitudinal sectional view showing the intermediate product 20a. The intermediate product 20a includes the insulating layer 23 configured by the above-described adhesive 23a, the first metal layer 21 provided on the first surface 23c side of the insulating layer 23, and configured by the above-described first metal sheet 21a, A second metal layer 22 provided on the second surface 23d side of the insulating layer 23 and configured by the second metal sheet 22a described above. As shown in FIG. 4, the pair of side portions 23 e of the insulating layer 23 is located outside the pair of side portions 22 e of the second metal layer 22. That is, the width of the insulating layer 23 is larger than the width of the second metal layer 22 in the second direction D2. In FIG. 4, the distance between the side part 23e and the side part 22e in the second direction D2 is represented by a symbol ΔW. The distance ΔW is set so that a protective layer 24, which will be described later, can be securely adhered to the second surface 23d of the insulating layer 23, and is set within a range of 1 μm to 100 mm, for example. FIG. 4 shows an example in which the position of the pair of side portions 23e of the insulating layer 23 and the position of the pair of side portions 21e of the first metal layer 21 coincide with each other. Instead, the pair of side portions 21e of the first metal layer 21 may be located inside or outside of the pair of side portions 23e of the insulating layer 23.

  Next, as shown in FIG. 5, the 3rd unwinding part 16 holding the elongate protection sheet 24a wound by roll shape is prepared. Then, the protective sheet 24 a is unwound from the third unwinding portion 16, and the intermediate product 20 a once wound around the first winding portion 15 is unwound again. Thereafter, the intermediate product 20a and the protective sheet 24a are stacked in the stacking unit 18 so as to cover the second metal layer 22 of the intermediate product 20a. Thereby, the laminated body 20 can be obtained. The stacked body 20 may be wound up by the second winding unit 17.

  FIG. 6 is a longitudinal sectional view showing the mounting substrate 60. The laminate 20 covers the outer surface 22d and the pair of side portions 22e of the second metal layer 22 in addition to the first metal layer 21, the second metal layer 22, and the insulating layer 23 that constitute the intermediate product 20a described above. A protective layer 24 composed of the protective sheet 24a is further provided. As shown in FIG. 6, the protective layer 24 has a pair of sides of the insulating layer 23 from the position on the outer surface 22 d of the second metal layer 22 so as to reliably cover the side 22 e of the second metal layer 22. It extends to a position on the second surface 23 d of the insulating layer 23 located between the portion 23 e and the pair of side portions 22 e of the second metal layer 22. Thereby, when the 1st metal layer 21 is etched, it can suppress more reliably that a pair of side part 22e of the 2nd metal layer 22 will melt | dissolve.

  The material constituting the protective sheet 24a, that is, the protective layer 24 is selected so that the second metal layer 22 can be protected from an etching solution described later. For example, an insulating resin material such as polyethylene terephthalate can be used as the material constituting the protective layer 24. Moreover, you may use the dry film for forming a resist as the protection sheet 24a. The thickness of the protective layer 24 is in the range of 1 μm to 100 μm, for example.

  Although not shown, an adhesive layer or the like may be interposed on the surface of the protective layer 24 in order to make the protective layer 24 adhere to the second metal layer 22 and the insulating layer 23. 3 to 6, the intermediate product 20a including the first metal layer 21, the second metal layer 22, and the insulating layer 23 is once wound around the first winding unit 15, and then the intermediate product 20a The example which laminated | stacked the protection sheet 24a was shown. However, the present invention is not limited to this, and the intermediate product 20a and the protective sheet 24a may be laminated without winding up the obtained intermediate product 20a.

(Method for manufacturing a wiring board)
Next, with reference to FIG. 7 to FIG. 11, a method for manufacturing the wiring board 40 by processing the laminated body 20 will be described. FIG. 7 is a diagram showing a wiring board manufacturing apparatus 30 for manufacturing the wiring board 40. 8 to 11 are longitudinal sectional views showing the case where the laminate 20 and the wiring board 40 are cut along the lines VIII to XI in each step of the method of manufacturing the wiring board 40 shown in FIG. .

  First, the 1st unwinding part 31 holding the elongate laminated body 20 wound by roll shape is prepared. Moreover, the 2nd unwinding part 32 holding the elongate resist sheet 46a wound by roll shape is prepared. Next, the laminate 20 is unwound from the first unwinding portion 31, and the resist sheet 46 a is unwound from the second unwinding portion 32. Thereafter, as shown in FIG. 7, the stacked body 20 and the resist sheet 46 a are stacked in the stacked portion 33. As a result, as shown in FIG. 8, a resist layer 46 composed of a resist sheet 46 a can be provided on the outer surface 21 d of the first metal layer 21 of the stacked body 20.

  Next, using the resist processing portion 34, a resist layer 46 having a pattern corresponding to the mounting electrode portion 41 and the wiring 42 of the mounting substrate 60 described above is formed on the outer surface 21 d of the first metal layer 21 of the stacked body 20. A resist processing step to be formed is performed. For example, the resist layer 46 is processed by exposing and developing the resist layer 46 using the resist processing portion 34. When the extraction electrode portion 43 is formed simultaneously with the mounting electrode portion 41 and the wiring 42, a resist layer 46 having a pattern corresponding to the extraction electrode portion 43 is simultaneously formed on the outer surface 21d of the first metal layer 21. The

  Next, in the etching part 35, the process of etching the 1st metal layer 21 using an etching liquid is implemented. As a result, as shown in FIG. 10, the portion of the first metal layer 21 that is not covered with the resist layer 46 is removed. Thereafter, a step of removing the resist layer 46 remaining on the first metal layer 21 is performed in the resist removing unit 36. As a result, as shown in FIG. 11, it is possible to obtain a long wiring substrate 40 including the mounting electrode portion 41 including the first metal layer 21 and the wiring 42. The elongated wiring board 40 may be wound up by the winding unit 37. As an etching solution, for example, a solution containing at least one of ferric chloride and cupric chloride can be used.

  Here, according to the present embodiment, as described above, the insulating layer 23 of the stacked body 20 has the pair of side portions 23e positioned outside the pair of side portions 22e of the second metal layer 22. It is configured. Therefore, the protective layer 24 provided on the outer surface 22d side of the second metal layer 22 can firmly cover not only the outer surface 22d of the second metal layer 22 but also the pair of side portions 22e. Thereby, when the 1st metal layer 21 is etched using an etching liquid, it can suppress that the 2nd metal layer 22 melt | dissolves in an etching liquid. Thereby, it is possible to suppress the deterioration of the characteristics of the etching solution due to the dissolution of the second metal layer 22. This can lead to an increase in the lifetime of the etching solution and a reduction in the adhesion of impurities to the mounting electrode part 41 and the wiring 42 constituted by the first metal layer 21. Moreover, it can suppress that the 2nd metal layer 22 melt | dissolves and the shape change which the 2nd metal layer 22 does not intend arises.

  After performing the step of etching the first metal layer 21, a protective layer removing step of removing the protective layer 24 may be further performed. That is, the wiring substrate 40 finally obtained in the present embodiment may not include the protective layer 24. In this case, the wiring substrate 40 according to the present embodiment is characterized by the fact that the pair of side portions 23e of the insulating layer 23 is located outside the pair of side portions 22e of the second metal layer 22.

  In addition, after performing the step of etching the first metal layer 21, a slit step of cutting and removing portions of the insulating layer 23 located outside the pair of side portions 22e of the second metal layer 22 is further performed. May be. In this case, as shown in FIG. 12, in the wiring substrate 40, the positions of the pair of side portions 22 e of the second metal layer 22 coincide with the positions of the pair of side portions 23 e of the insulating layer 23.

  In addition, as shown in FIG. 13, after performing the step of etching the first metal layer 21, the light is reflected in the region on the first surface 23 c side of the insulating layer 23 that does not overlap with the mounting electrode portion 41. A reflective layer forming step for providing the reflective layer 44 may be further performed. As a method of providing the reflective layer 44, a coating liquid containing a white pigment, metal powder, or the like is applied to the insulating layer 23 using a metal mask in which an opening is formed at a position corresponding to a region where the reflective layer 44 is to be formed. A screen printing method or the like that is applied on the first surface 23c or the like can be used. FIG. 13 shows an example in which the reflective layer 44 is provided after the above slit process is performed, but the present invention is not limited to this, and the slit process is performed after the reflective layer 44 is provided. May be.

  In addition, arbitrary processes among the above-mentioned protective layer removal process, slit process, or reflective layer formation process may be implemented after the mounting process mentioned later which mounts the light emitting component 61 on the wiring board 40. FIG.

(Manufacturing method of mounting substrate)
Next, a method for manufacturing the mounting board 60 using the mounting board manufacturing apparatus 50 will be described with reference to FIG.

  First, as shown in FIG. 14, an unwinding unit 51 that holds a long wiring substrate 40 wound in a roll shape is prepared. Next, the wiring board 40 is unwound from the unwinding portion 51. Next, as shown in FIG. 14, cream solder for forming the intermediate layer 62 is applied onto the mounting electrode part 41 using the application part 52. Thereafter, as shown in FIG. 5, using the mounting portion 53, a mounting step of mounting the light emitting component 61 on the mounting electrode portion 41 provided with the intermediate layer 62 is performed. Next, the wiring board 40 on which the light emitting component 61 is mounted is cut in the second direction D2 orthogonal to the first direction D1 using the cutting unit 54. As a result, the mounting substrate 60 shown in FIG. 2 can be obtained.

(Manufacturing method of lighting device)
Then, you may implement the process of attaching the wiring board 40 in which the light emitting component 61 was mounted to the supporting member 81 by the 2nd metal layer 22 side. As a result, as shown in FIG. 15, it is possible to obtain an illumination device 80 that includes the mounting substrate 60 and the support member 81 attached to the mounting substrate 60 on the second metal layer 22 side. As shown in FIG. 15, the lighting device 80 further includes a diffusion plate 82 that is provided on the side of the mounting substrate 60 on which the light emitting component 61 is mounted and is spaced from the mounting substrate 60. Also good.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted. In addition, when it is clear that the operational effects obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

(Modified example of mounting board)
In the present embodiment described above, the wiring board 40 on which the light emitting component 61 is mounted does not include the protective layer 24 described above, and the position of the pair of side portions 23e of the insulating layer 23 and the second metal layer 22 are included. An example is shown in which the positions of the pair of side portions 22e coincide with each other. That is, an example is shown in which a protective layer removing step for removing the protective layer 24 and a slit step for removing unnecessary portions of the insulating layer 23 are performed before the mounting step for mounting the light emitting component 61 on the wiring board 40. However, the present invention is not limited to this, and a protective layer removing process and a slit process may be performed after the mounting process for mounting the light emitting component 61 on the wiring board 40. FIG. 16 shows a mounting substrate 60 that includes the light emitting component 61 and from which the protective layer 24 is not removed. In addition, in the mounting substrate 60 shown in FIG. 16, since the slit process has not been performed yet, the pair of side portions 23 e of the insulating layer 23 is positioned outside the pair of side portions 22 e of the second metal layer 22. .

(Modified example of laminate)
In the above-described embodiment, the example in which the insulating layer 23 is configured by the adhesive 23a for bonding the first metal sheet 21a and the second metal sheet 22a has been described. However, the present invention is not limited to this, and although not shown, when the first metal sheet 21a and the second metal sheet 22a are laminated, the insulating resin sheet is used as the first metal sheet 21a and the second metal sheet. The insulating layer 23 may be configured by interposing it between 22a. In this case, the insulating layer 23 of the laminate 20 has a resin layer 25 made of a resin sheet, as shown in FIG. As shown in FIG. 17, the insulating layer 23 is provided between the first adhesive layer 26 provided between the resin layer 25 and the first metal layer 21 or between the resin layer 25 and the second metal layer 22. The second adhesive layer 27 may be further included.

(Other variations)
In the above-described embodiment, the example in which the light emitting component 61 is mounted on the long wiring board 40 has been described. However, the present invention is not limited to this, and the light emitting component 61 may be mounted on the single-layer wiring board 40 after the wiring board 40 is cut.

  In addition, although some modified examples with respect to the above-described embodiment have been described, naturally, a plurality of modified examples can be applied in combination as appropriate.

DESCRIPTION OF SYMBOLS 10 Laminated body manufacturing apparatus 20 Laminated body 21 1st metal layer 21e side part 22 2nd metal layer 22e side part 23 Insulating layer 23e side part 24 Protective layer 30 Wiring board manufacturing apparatus 40 Wiring board 41 Mounting electrode part 42 Wiring 43 Taking out Electrode section 44 Reflective layer 46 Resist layer 50 Mounting board manufacturing apparatus 60 Mounting board 61 Light emitting component 80 Illumination apparatus

Claims (17)

A long laminate for producing a wiring board on which electronic components are mounted,
A first surface, a second surface located on the opposite side of the first surface, a pair of side portions extending along the longitudinal direction of the stacked body between the first surface and the second surface, An insulating layer having
A first metal layer provided on the first surface side of the insulating layer;
A second metal layer provided on the second surface side of the insulating layer,
The second metal layer includes an inner surface facing the second surface of the insulating layer, an outer surface located on the opposite side of the inner surface, and the longitudinal direction of the stacked body between the inner surface and the outer surface. And a pair of side portions extending
The laminate further includes a protective layer covering the outer surface of the second metal layer and the pair of side portions,
The pair of side portions of the insulating layer are located outside the pair of side portions of the second metal layer,
The protective layer covers the pair of side portions of the insulating layer and the pair of second metal layers from a position on the outer surface of the second metal layer so as to cover the pair of side portions of the second metal layer. A laminate that extends to a position on the second surface of the insulating layer located between a pair of side portions.   The laminate according to claim 1, wherein the insulating layer includes an adhesive that bonds the first metal layer and the second metal layer.   The insulating layer includes a resin layer, a first adhesive layer provided between the resin layer and the first metal layer, and a second adhesive provided between the resin layer and the second metal layer. The laminate according to claim 1, comprising: a layer. The first metal layer includes copper;
The laminate according to any one of claims 1 to 3, wherein the second metal layer includes at least one of copper, aluminum, silver, and iron. A method of manufacturing a wiring board on which electronic components are mounted,
The wiring board includes a mounting electrode part on which the electronic component is mounted, and a wiring connected to the mounting electrode part,
The method for manufacturing the wiring board includes:
Preparing the laminate according to claim 1;
Forming a resist layer having a pattern corresponding to the mounting electrode portion and the wiring on the outer surface of the first metal layer of the laminate;
An etching step of etching the first metal layer using an etchant;
Removing the resist layer, and obtaining the wiring board including the mounting electrode part including the first metal layer and the wiring, and a method for manufacturing the wiring board. The first metal layer includes copper;
The second metal layer includes at least one of copper, aluminum, silver, or iron,
The method for manufacturing a wiring board according to claim 5, wherein the etching solution contains at least one of ferric chloride and cupric chloride.   The wiring substrate manufacturing method according to claim 5, further comprising a slitting step of removing a portion of the insulating layer located outside the pair of side portions of the second metal layer after the etching step. Method.   The method for manufacturing a wiring board according to claim 5, further comprising a step of removing the protective layer after the etching step.   9. The method according to claim 5, further comprising a step of providing a reflective layer that reflects light in a region that does not overlap the mounting electrode portion in the region on the first surface side of the insulating layer after the etching step. The manufacturing method of the wiring board as described in any one of Claims. A wiring board on which electronic components are mounted,
An insulating layer having a first surface, a second surface located on the opposite side of the first surface, and a pair of side portions extending along the first direction between the first surface and the second surface When,
A mounting electrode portion provided on the first surface side of the insulating layer and on which the electronic component is mounted;
Wiring provided on the first surface side of the insulating layer and connected to the mounting electrode portion;
A metal layer provided on the second surface side of the insulating layer,
The metal layer includes an inner surface facing the second surface of the insulating layer, an outer surface positioned on the opposite side of the inner surface, and a pair of sides extending along the first direction between the inner surface and the outer surface. And
The wiring substrate, wherein the pair of side portions of the insulating layer are located outside the pair of side portions of the metal layer. A protective layer covering the outer surface of the metal layer and the pair of side portions;
The protective layer covers the pair of side portions of the insulating layer and the pair of side portions of the metal layer from a position on the outer surface of the metal layer so as to cover the pair of side portions of the second metal layer. The wiring board according to claim 9, wherein the wiring board extends to a position on the second surface of the insulating layer positioned between the two. The mounting electrode portion and the wiring include copper,
The wiring board according to claim 9 or 10, wherein the metal layer includes at least one of copper, aluminum, silver, or iron.   13. The device according to claim 10, further comprising a reflective layer that is provided in a region that does not overlap the mounting electrode portion in the region on the first surface side of the insulating layer and reflects light. Wiring board.   The wiring board according to claim 10, wherein the wiring board has a long shape extending along the first direction. A method of manufacturing a mounting board on which electronic components are mounted,
Preparing a wiring board according to claim 10;
A mounting step of mounting an electronic component on the mounting electrode portion of the wiring board.   The method of manufacturing a mounting board according to claim 15, wherein the electronic component includes a light emitting diode element. A step of attaching the wiring board on which the electronic component is mounted to a support member on the second metal layer side;
The mounting substrate manufacturing method according to claim 15, wherein the support member has a higher thermal conductivity than the insulating layer.

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