JP2016072516A - Wiring board and manufacturing method of the same, and mounting board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board and a mounting board, which can prevent kinks from occurring on a flexible board when curvature is caused in the flexible board where light emitting components are mounted.SOLUTION: A wiring board 40 where light emitting components 61 are mounted comprise: a flexible resin board 21 including a first surface 21a and a second surface 21b located on the side opposite to the first surface; and a plurality of electrode parts for mounting which are arranged on the first surface 21a side of the resin board 21 in a first direction d1 and on which light emitting components 61 are mounted. The resin board 21 has a linear or broken line-like slit part 31 which extends in the first direction d1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wiring board on which a light emitting component is mounted and a method for manufacturing the same. The present invention also relates to a mounting board on which a light emitting component is mounted and a method for manufacturing the same.

  It has been proposed to configure a light emitting device such as a lighting device using a light emitting component including a light emitting element that functions as a point light source, such as a light emitting diode. For example, in Patent Document 1, a light-emitting device is configured by preparing a wiring board on which terminals and wiring for driving a light-emitting component are formed and mounting the light-emitting component on the wiring board.

JP 2006-147999 A

  In recent years, instead of a rigid substrate such as a glass epoxy substrate, a wiring substrate having a flexible resin substrate, a so-called flexible substrate, has been used. The flexible substrate has various advantages such as being lightweight and capable of supporting a three-dimensional shape such as a cylindrical shape or a mountain shape. For example, a cylindrical or mountain-shaped lighting device is created by laminating a flexible substrate on which a large number of light-emitting components including light-emitting diode elements are mounted on a support member formed in a cylindrical shape or a mountain shape. Can be considered.

  A general flexible substrate has a resin substrate made of a flexible resin material such as polyethylene terephthalate, and a metal mounting electrode portion formed on the surface of the resin substrate. A light emitting component such as a light emitting diode is mounted on the mounting electrode portion via a bonding layer such as solder.

  By the way, the light emitting component and the bonding layer generally do not have flexibility. That is, it cannot bend. For this reason, in the flexible substrate on which the light emitting component is mounted, in the region around the light emitting component, the end portion on the light emitting component side is firmly held in a planar shape by the bonding layer, and is difficult to bend.

  Therefore, when laminating a flexible substrate on which a light emitting component is mounted on a support member formed into a curved surface, the area around the light emitting component cannot be sufficiently bent along the curved shape of the support member, When viewed from the perspective, the curvature is small only in the area around the light emitting component, and bump-like irregularities are generated, that is, the flexible substrate may be bent. In this case, not only is aesthetics impaired, but a gap is formed between the support member having high heat dissipation and the flexible substrate, so that the heat dissipation of the flexible substrate is lowered and the light emitting component may be damaged by heat.

  In addition, when the area around the light-emitting component is bent forcefully by applying an external force so as to follow the curved shape of the support member, the bonding layer may be peeled off from the mounting electrode part or the bonding layer may be broken. There is a problem that a severe disconnection occurs.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a wiring board and a mounting capable of suppressing occurrence of twisting in the flexible board when the flexible board on which the light emitting component is mounted is curved. An object is to provide a substrate.

The wiring board according to the present invention comprises:
A wiring board on which light emitting components are mounted,
A resin substrate including a first surface and a second surface located on the opposite side of the first surface, and having flexibility;
A plurality of mounting electrode portions arranged in the first direction on the first surface side of the resin substrate and on which the light emitting component is mounted,
The resin substrate has a linear or broken slit portion extending in the first direction.
In the wiring board according to the present invention, a linear or broken second slit portion may be further formed in the resin substrate in parallel with the slit portion.
In the wiring board according to the present invention, the plurality of mounting electrode portions may be disposed between the slit portion and the second slit portion.
In the wiring board according to the present invention, the resin substrate may be formed with a linear or broken third slit portion extending in a direction intersecting the first direction.
The mounting board according to the present invention is:
A wiring board having any of the features described above;
A light emitting component mounted on the plurality of mounting electrode portions of the wiring board.
A method for manufacturing a wiring board according to the present invention includes:
A method of manufacturing a wiring board on which a light emitting component is mounted,
Forming a plurality of mounting electrode portions on the first surface side of the resin substrate having flexibility, arranged in a first direction, on which the light emitting component is mounted;
Forming a linear or broken slit portion extending in the first direction on the resin substrate.
The method for manufacturing a wiring board according to the present invention may further include a step of forming a linear or broken second slit portion in the resin substrate in parallel with the slit portion.
In the method for manufacturing a wiring board according to the present invention, in the step of forming the second slit portion, the second slit portion may be formed on the side opposite to the slit portion with respect to the plurality of mounting electrode portions. Good.
The method for manufacturing a wiring board according to the present invention may further include a step of forming, on the resin substrate, a third slit portion having a linear or broken line shape extending in a direction intersecting the first direction.
A method for manufacturing a mounting board according to the present invention includes:
A method of manufacturing a mounting board on which a light emitting component is mounted,
Preparing a wiring board having any of the above-described features;
Mounting a light emitting component on the plurality of mounting electrode portions of the wiring board.

  ADVANTAGE OF THE INVENTION According to this invention, when curving the flexible substrate with which the light emitting component was mounted, it can suppress that a flexible substrate produces a twist.

FIG. 1 is a plan view showing a mounting board according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line AA of the mounting substrate of FIG. FIG. 3 is a cross-sectional view taken along the line BB of the mounting substrate of FIG. FIG. 4 is a view showing a laminate for producing a wiring board. FIG. 5 is a cross-sectional view showing a mounting electrode portion and wiring obtained by patterning the conductive layer of the laminate shown in FIG. FIG. 6 is a cross-sectional view showing a wiring board. FIG. 7 is a diagram illustrating a method of manufacturing a mounting board by mounting light emitting components. FIG. 8 is a cross-sectional view showing a state in which the mounting substrate is stacked on a support member formed in a curved shape. FIG. 9 is a plan view showing a modified example of the mounting board according to the embodiment of the present invention. FIG. 10 is a cross-sectional view of the mounting board of FIG. 9 along the line CC.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones. Further, in this specification, the terms “substrate” and “sheet” are not distinguished from each other based only on the difference in designation. For example, the “substrate” is a concept including a member that can be called a sheet or a film. Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel” and “orthogonal”, length and angle values, and the like are bound to a strict meaning. Therefore, it should be interpreted including the extent to which similar functions can be expected.

  First, the mounting substrate 60 obtained by mounting the light emitting component 61 on the wiring substrate 40 will be described with reference to FIGS. As will be described later, the mounting board 60 including the light emitting component 61 can be combined with a support member such as a base or a housing to constitute a lighting device. FIG. 1 is a plan view showing a case where the mounting board 60 is viewed from the side where the light emitting component 61 is mounted. 2 is a cross-sectional view taken along line AA of the mounting board 60 of FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB of the mounting board of FIG.

(Mounting board)
As shown in FIG. 1, the mounting substrate 60 has flexibility, a wiring substrate 40 that functions as a so-called flexible substrate, and a plurality of light emitting components mounted on a mounting electrode portion 41 (to be described later) of the wiring substrate 40. 61. As long as a light emitting element that can function as a point light source is provided, the configuration of the light emitting component 61 is not particularly limited. For example, a light-emitting diode can be used as the light-emitting element, and a surface-mounted component including a light-emitting diode housed in a surface-mounted package can be used as the light-emitting component 61.

  In addition, as will be described later, the mounting substrate 60 is manufactured by processing a long laminate supplied in a rolled state to produce the wiring substrate 40, and the light emitting component 61 is mounted on the wiring substrate 40. The wiring board 40 is obtained by cutting and before or after mounting the light emitting component 61. In FIG. 1, the longitudinal direction of the laminate and the wiring board 40 is represented by a symbol D1, and the direction orthogonal to the longitudinal direction D1 is represented by a symbol D2. The direction D2 corresponds to a direction in which the wiring board 40 is cut. The “long direction” is a direction in which the long laminate and the wiring board 40 extend. In the following description, the longitudinal direction D1 may be referred to as a first direction D1, and the direction D2 orthogonal to the first direction D1 may be referred to as a second direction D2.

  As shown in FIG. 1, the wiring board 40 may include an extraction electrode portion 43 that is electrically connected to the light emitting component 61 via a wiring 42 described later. As shown in FIG. 1, the extraction electrode portion 43 may be formed on the same surface as the surface on which the light emitting component 61 is mounted, among the surfaces of the wiring substrate 40, or although not shown, the light emitting component 61. May be formed on the surface opposite to the surface on which is mounted.

(Wiring board)
Next, with reference mainly to FIGS. 2 and 3, the configuration of the mounting substrate 60, particularly the configuration of the wiring substrate 40 of the mounting substrate 60 will be described in detail.

  The wiring board 40 includes a flexible resin substrate 21 and a plurality of mounting electrode portions 41 arranged on the resin substrate 21 in the first direction D1 and on which the light emitting component 61 is mounted. The mounting electrode portion 41 is a portion for mounting the light emitting component 61 and is also referred to as a pad or a land. In the following description, the surface of the resin substrate 21 on the side where the mounting electrode portion 41 is provided is referred to as a first surface 21a, and the surface on the opposite side of the first surface 21a is referred to as a second surface 21b. In the illustrated example, the wiring 42 is provided on the first surface 21 a side of the resin substrate 21 so as to electrically connect the mounting electrode portion 41 and the extraction electrode portion 43.

  2 and 3 show examples in which the wiring 42 is provided only on the first surface 21a side of the resin substrate 21, but the present invention is not limited to this. For example, when the extraction electrode portion 43 is provided on the side opposite to the side on which the light emitting component 61 is mounted as described above, that is, on the second surface 21b side of the resin substrate 21, the wiring 42 is formed on the resin substrate. 21 may be provided on the second surface 21b side. In this case, the mounting electrode portion 41 and the wiring 42 are electrically connected through, for example, a through hole formed in the resin substrate 21.

  In the present embodiment, “flexibility” refers to the degree that a fold does not occur in the wiring board 40 when the wiring board 40 is wound into a roll shape having a diameter of 30 cm in an environment of room temperature, for example, 25 ° C. Means flexibility. A “fold” is a deformation that appears on the wiring board 40 in a direction that intersects the winding direction of the wiring board 40, and even if the wiring board 40 is wound in the opposite direction so as to restore the deformation to the original state. Means deformation that does not return.

(Resin substrate)
The resin substrate 21 is a flexible substrate made of an insulating resin material. The material constituting the resin substrate 21 and the thickness of the resin substrate 21 are appropriately determined according to characteristics such as flexibility and strength required for the wiring substrate 40. For example, the resin substrate 21 may include a polyester resin such as polyethylene terephthalate or polyethylene naphthalate, an epoxy resin, or a polyimide resin. Moreover, the thickness of the resin substrate 21 is set within a range of 10 μm to 300 μm, for example.

  The resin substrate 21 is configured to reflect the light that is radiated from the light emitting component 61 and then reflected by a diffusion plate (not shown) and returned to the mounting substrate 60 so as to be directed toward the diffusion plate again. It is preferable. For example, it is preferable that a white pigment, bubbles, or the like is dispersed in the base resin of the resin substrate 21. As a result, the light that has returned to the mounting substrate 60 can be directed again toward the diffusion plate and emitted to the outside of the illumination device. For this reason, the utilization efficiency of the light in an illuminating device can be improved.

  A method for manufacturing the resin substrate 21 having such a reflection characteristic is not particularly limited, and a known method can be appropriately used. For example, a pellet that is a raw material for the resin material serving as a base and a white pigment are mixed and melted, the mixed material is molded by extrusion molding or the like, and fired as necessary. Thereby, the resin substrate 21 in which the white pigment is dispersed can be obtained. As the white pigment, white ceramic materials such as titanium oxide, calcium oxide, aluminum oxide, and zinc oxide can be used.

  Preferably, the resin substrate 21 is configured such that the total light reflectance in the light wavelength range of 380 nm to 780 nm is in the range of 60% to 99%. Here, the “total light reflectance” is the sum of regular reflectance and diffuse reflectance. The total light reflectance can be obtained in accordance with the total light reflectance measurement method of JIS K7375. Specifically, the total light reflectivity is 10 nm at a light wavelength of 380 nm to 780 nm using a spectrophotometer and an integrating sphere test stand when the light is incident on the resin substrate 21 at an angle. It can be determined by measuring at intervals and calculating their average value. The total light reflectance is obtained as a relative value with the reflectance of a standard white plate containing barium sulfate as 100%.

(Mounting electrode, wiring, and extraction electrode)
As a material constituting the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43, a conductive material is used, and for example, a metal material such as copper or silver is used. In consideration of enhancing the reflection characteristics of the wiring board 40, silver is preferably used.

  The materials constituting the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43 may be the same or different. For example, the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43 may be formed simultaneously and continuously by patterning the same conductive layer 22, as will be described later. As long as the wiring substrate 40 and the mounting substrate 60 have flexibility in a desired direction, the dimensions such as the thickness and width of the mounting electrode portion 41, the wiring 42, and the extraction electrode portion 43 are not particularly limited.

  The wiring 42 is configured to extend linearly along a predetermined direction. Here, “linear” means a form in which the dimension in the length direction is relatively larger than the dimension in the width direction, for example, 10 times or more.

  As shown in FIG. 2, in the present embodiment, the light emitting component 61 is mounted on the wiring board 40 so that the plurality of light emitting components 61 are arranged along the first direction D1 of the resin substrate 21. The plurality of light emitting components 61 arranged along the one direction D <b> 1 are electrically connected in series via the wiring 42.

(Bonding layer)
2 and 3, reference numeral 62 denotes the light emitting component 61 and the mounting electrode portion 41 for joining the light emitting component 61 to the mounting electrode portion 41 and electrically connecting the light emitting component 61 to the mounting electrode portion 41. The bonding layer interposed between the two is shown. Examples of the material constituting the bonding layer 62 include cream solder applied on the mounting electrode portion 41 in a reflow process. Cream solder includes a binder material such as flux, and metal powder that is dispersed in the binder material and melts during the reflow process. 2 and 3, the example in which the bonding layer 62 is clearly interposed between the light emitting component 61 and the mounting electrode portion 41 is shown, but the present invention is not limited to this. The shape and arrangement of the bonding layer 62 are not particularly limited as long as the light emitting component 61 can be coupled to the mounting electrode portion 41 to electrically connect the light emitting component 61 to the mounting electrode portion 41.

  By the way, in the state where the light emitting component 61 is mounted on the mounting electrode portion 41, the bonding layer 62 is a lump of metal that is once melted and then cooled and solidified, and generally has no flexibility. . That is, it cannot bend. Therefore, in the region around the light-emitting component 61 in the resin substrate 21, the end portion on the light-emitting component 61 side is firmly held in a planar shape by the bonding layer 62 and is difficult to bend.

  Therefore, when the mounting substrate 60 on which the light emitting component 61 is mounted is stacked on the curved support member, the area around the light emitting component 61 in the mounting substrate 60 is sufficient along the curved shape of the support member. It is conceivable that, when viewed as a whole, the curvature is small only in the area around the light-emitting component 61, and irregularities such as bumps are generated, that is, the mounting substrate 60 is distorted. In this case, not only the appearance is impaired, but also the gap between the supporting member having high heat dissipation and the mounting substrate 60 causes a decrease in heat dissipation of the mounting substrate 60 and the light emitting component 61 is damaged by heat. Is also possible.

(Slit part)
Considering such problems, in the present embodiment, as shown in FIGS. 1 and 3, the resin substrate 21 is formed with a slit portion 31 extending in the first direction D <b> 1. In the example shown in FIG. 1, the slit portion 31 has a linear shape parallel to the first direction D1, but is not limited thereto, and the slit portion 31 has a broken line shape parallel to the first direction D1. May be. The slit portion 31 is preferably formed adjacent to the vicinity of the plurality of mounting electrode portions 41. For example, the interval between the slit portion 31 and the plurality of mounting electrode portions 41 is 5 mm or less. In the example shown in FIG. 3, the slit portion 31 is formed as a through-hole penetrating the resin substrate 21 in the thickness direction. However, the slit portion 31 is not open to the first surface 21 a side. However, it may be formed as a cut or groove that is closed on the second surface 21b side, or a cut or groove that is open on the second surface 21b side but closed on the first surface 21a side. It may be formed as. Alternatively, the slit portion 31 is formed as a pair of front and back cuts or grooves that are open between the first surface 21a side and the second surface 21b side but are closed between the first surface 21a and the second surface 21b. It may be formed.

  Since the slit part 31 is formed in the resin substrate 21, the thickness of the board | substrate in the slit part 31 is relatively thin, and the flexibility is improved. That is, it is easy to bend. In addition, when the slit part 31 consists of a through-hole, the thickness of the board | substrate in the slit part 31 is zero. Therefore, in the region around the light-emitting component 61 in the resin substrate 21, the effect that the flexibility is lowered by the bonding layer 62 is mitigated by the effect that the flexibility is enhanced by the slit portion 31, and as a result, the light emission Even in the area around the part 61, it is possible to bend flexibly. Thereby, it is possible to prevent the substrate from being twisted.

  As shown in FIGS. 1 and 3, it is preferable that a linear second slit portion 32 is further formed in the resin substrate 21 in parallel with the slit portion 31. In the example illustrated in FIG. 1, the second slit portion 32 has a linear shape parallel to the first direction D1, but is not limited thereto, and the second slit portion 32 is a broken line parallel to the first direction D1. You may have a shape. The second slit portion 32 is preferably formed adjacent to the vicinity of the plurality of mounting electrode portions 41. For example, the interval between the second slit portion 32 and the plurality of mounting electrode portions 41 is 5 mm or less. It is. In the example shown in FIG. 3, the resin substrate 21 is formed as a through-hole penetrating the resin substrate 21 in the thickness direction. However, the present invention is not limited to this, and the second slit portion 32 is not limited to the first surface 21 a. It may be formed as a cut or groove that is open on the side but closed on the second surface 21b side, and is open on the second surface 21b side but closed on the first surface 21a side. It may be formed as a cut or groove. Alternatively, the second slit portion 32 has a pair of front and back cuts that are open on both the first surface 21a side and the second surface 21b side but are closed between the first surface 21a and the second surface 21b. It may be formed as a groove.

  Since the plurality of slit portions 31 and 32 are formed in the resin substrate 21, the number of locations where the thickness is relatively thin increases in the resin substrate 21, so that flexibility is further enhanced. That is, it becomes easier to bend. Thereby, in the area | region around the light emitting component 61 among the resin substrates 21, the effect | action by which the flexibility is lowered | hung by the joining layer 62 can fully be relieve | moderated by the some slit parts 31 and 32, and light emission as a result. It becomes possible to bend more flexibly even in the region around the component 61. Thereby, it is possible to further prevent the substrate from being twisted.

  As shown in FIGS. 1 and 3, the plurality of mounting electrode portions 41 may be arranged between the slit portion 31 and the second slit portion 32. In this case, the flexibility on both sides in the second direction d2 with respect to the plurality of mounting electrode portions 41 is enhanced by the slit portion 31 and the second slit portion 32. Therefore, it is possible to bend flexibly on both sides in the second direction d2 in the region around the light emitting component 61, and it is possible to suppress the substrate from being twisted on both sides in the second direction d2 with respect to the light emitting component 61.

  Next, the operation and effect of the present embodiment having such a configuration will be described. Here, a method of manufacturing the above-described mounting substrate 60 by processing the long laminate and manufacturing the above-described wiring substrate 40 and mounting the light emitting component 61 on the wiring substrate 40 will be described.

(Method for manufacturing a wiring board)
First, the laminate 20 shown in FIG. 4 is prepared. The laminate 20 includes a long resin substrate 21 and a conductive layer 22 provided on the first surface 21 a of the resin substrate 21.

  Next, by patterning the conductive layer 22 of the multilayer body 20, the mounting electrode portion 41 and the wiring 42 are formed on the first surface 21 a side of the resin substrate 21 as shown in FIG. 5. At this time, the extraction electrode portion 43 may be formed simultaneously from the conductive layer 22.

  As a method of patterning the conductive layer 22, a method of etching the conductive layer 22 using a photosensitive layer provided on the conductive layer 22 in a pattern corresponding to the mounting electrode portion 41 or the wiring 42, or a mounting electrode portion 41. In addition, a known method such as a laser ablation method in which the conductive layer 22 is irradiated with a laser in a pattern corresponding to the wiring 42 can be appropriately used.

  Thereafter, as shown in FIG. 6, linear or broken slit portions 31 extending in the first direction D <b> 1 are formed in the resin substrate 21. Thereby, the flexibility of the resin substrate 21 is improved. As shown in FIG. 6, it is preferable to further form a linear or broken second slit portion 32 on the resin substrate 21 in parallel with the first slit portion 31. In this case, the flexibility of the resin substrate 21 is further enhanced. As shown in FIG. 6, the second slit portion 32 may be formed on the side opposite to the slit portion 31 with respect to the plurality of mounting electrode portions 41. In this case, the flexibility of the resin substrate 21 is enhanced on both sides in the second direction d2 with respect to the plurality of mounting electrode portions 41. In this way, a long wiring board 40 can be obtained as shown in FIG. Preferably, the step of forming the slit portion 31 and the step of forming the second slit portion 32 are performed while transporting the resin substrate 21 in the first direction D1. The slit portion 31 and the second slit portion 32 may be formed simultaneously or sequentially.

  As shown in FIG. 6, an adhesive layer 24 may be provided on the second surface 21 b side of the resin substrate 21. The adhesive layer 24 is for attaching the wiring board 40 and the mounting board 60 to a support member 81 described later. By providing the adhesive layer 24 in advance, the attachment process of the support member 81 can be facilitated. As shown in FIG. 6, a release sheet 25 for protecting the adhesive surface of the adhesive layer 24 may be provided on the adhesive layer 24. As a material constituting the adhesive layer 24, for example, acrylic, epoxy, urethane or the like can be used.

  Thereafter, the obtained long wiring board 40 is wound up into a roll shape.

(Manufacturing method of mounting substrate)
Next, a method for manufacturing the mounting board 60 using the mounting board manufacturing apparatus 50 will be described with reference to FIG.

  First, as shown in FIG. 7, the unwinding part 51 holding the elongate wiring board 40 wound by roll shape is prepared. Next, the wiring board 40 is unwound from the unwinding portion 51.

  Next, as shown in FIG. 7, a bonding layer 62 is provided on the mounting electrode portion 41 of the wiring board 40. For example, cream solder for forming the bonding layer 62 is applied onto the mounting electrode part 41 using the application part 52. Thereafter, using the mounting portion 53, a mounting step of mounting the light emitting component 61 on the mounting electrode portion 41 provided with the bonding layer 62, a so-called reflow step is performed. Specifically, first, the light emitting component 61 is placed on the mounting electrode portion 41 provided with the bonding layer 62, and then the mounting electrode portion on which at least the light emitting component 61 of the wiring board 40 is placed. The portion 41 is heated to melt the bonding layer 62. As a result, the light emitting component 61 is joined to the mounting electrode portion 41.

  Next, the wiring board 40 on which the light emitting component 61 is mounted is cut in the second direction D2 orthogonal to the first direction D1 using the cutting unit 54. Thereby, the mounting substrate 60 on which the light emitting component 61 is mounted can be obtained.

(Manufacturing method of lighting device)
Thereafter, as shown in FIG. 8, a step of attaching the mounting substrate 60 on which the light emitting component 61 is mounted to the support member 81 may be performed. Thereby, the illuminating device 80 provided with the mounting board | substrate 60 and the supporting member 81 attached to the mounting board | substrate 60 by the 2nd surface 21b side of the resin substrate 21 can be obtained. The material constituting the support member 81 is appropriately determined so as to satisfy the heat dissipation and rigidity required for the lighting device 80. For example, the support member 81 can be configured using a metal material such as aluminum or stainless steel.

  The support member 81 may be formed in a curved surface shape. According to the present embodiment, since the slit portion 31 is formed in the resin substrate 21 and the flexibility is enhanced, the mounting member 60 on which the light emitting component 61 is mounted is formed in a curved shape. When laminating on the substrate, the area around the light emitting component 61 in the mounting substrate 60 is also along the curved surface shape of the support member 81, that is, the same as the curved surface shape of the support member 81, as in the other regions. With curvature, it can bend easily. As a result, the occurrence of twist on the mounting substrate 60 is suppressed. As a result, the aesthetics of the lighting device 80 are improved, and the contact area between the support member 81 having a high heat dissipation property and the mounting substrate 60 is increased, so that the heat dissipation property of the mounting substrate 60 is improved and the light emitting component 61 is heated. It can be prevented from being damaged. In addition, since the region around the light emitting component 61 in the mounting substrate 60 can be easily bent, it is not necessary to bend it forcefully by applying a strong external force, and the bonding layer 62 is peeled off from the mounting electrode portion 41 by a strong external force. Or cracking of the bonding layer 62 is suppressed.

  Further, according to the present embodiment, since the second slit portion 32 is formed in the resin substrate 21 in parallel with the slit portion 31 and the flexibility is further enhanced, the mounting substrate on which the light emitting component 61 is mounted. When laminating 60 on a curved support member 81, the area around the light emitting component 61 in the mounting substrate 60 has a curvature closer to the curved shape of the support member 81, as in other areas. Can be bent easily. Thereby, it is possible to further prevent the mounting substrate 60 from being twisted. As a result, the aesthetic appearance of the lighting device 80 is further improved, and the contact area between the support member 81 and the mounting substrate 60 is further increased. The heat dissipation of the mounting substrate 60 is further improved. Further, since the flexibility of the mounting substrate 60 is further enhanced, it is possible to cope with a support substrate having a relatively large curved surface curvature.

  Further, according to the present embodiment, since the plurality of mounting electrode portions 41 are disposed between the slit portion 31 and the second slit portion 32, the mounting substrate is provided on both sides of the light emitting component 61 in the second direction d2. The flexibility of 60 is enhanced. Thereby, when the mounting substrate 60 on which the light emitting component 61 is mounted is stacked on the support member 81 formed into a curved surface, the load applied to the bonding layer 62 from both sides in the second direction d2 of the light emitting component 61 is reduced. can do. Therefore, it is possible to effectively suppress the bonding layer 62 from being peeled off from the mounting electrode portion 41 or the bonding layer 62 from being cracked by the load applied to the bonding layer 62 from both sides in the second direction d2.

(Modification)
Note that various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted. In addition, when it is clear that the operational effects obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

  FIG. 9 is a plan view showing a modification of the mounting board 60 as viewed from the side where the light emitting component 61 is mounted. FIG. 10 is a cross-sectional view taken along the line CC of the mounting board 60 of FIG.

  In the example shown in FIGS. 9 and 10, the resin substrate 21 is further formed with a third slit portion 33 that is linear or broken line extending in the direction intersecting the first direction d1, for example, the second direction d2. In the illustrated example, the wiring 42 is provided on the first surface 21a side of the resin substrate 21, and the third slit portion 33 is open on the second surface 21b side, but is closed on the first surface 21a side. Is formed as a notch or groove. According to such an aspect, as shown in FIGS. 9 and 10, the third slit portion 33 can be formed between the mounting electrode portions 41 adjacent in the first direction d1. By forming the third slit portion 33 in the resin substrate 21, the resin substrate 21 can be easily bent even with respect to the curvature in the first direction d1, and the occurrence of twisting in the substrate can be further suppressed. .

  In addition, although some modified examples with respect to the above-described embodiment have been described, naturally, a plurality of modified examples can be applied in combination as appropriate.

20 Laminated body 21 Resin substrate 21a First surface 21b Second surface 22 Conductive layer 24 Adhesive layer 25 Release sheet 31 Slit portion 32 Second slit portion 33 Third slit portion 40 Wiring substrate 41 Mounting electrode portion 42 Wiring 43 Extraction electrode Unit 50 mounting substrate manufacturing device 51 unwinding unit 52 coating unit 53 mounting unit 54 cutting unit 60 mounting substrate 61 light emitting component 62 bonding layer 80 lighting device

Claims (10)

A wiring board on which light emitting components are mounted,
A resin substrate including a first surface and a second surface located on the opposite side of the first surface, and having flexibility;
A plurality of mounting electrode portions arranged in the first direction on the first surface side of the resin substrate and on which the light emitting component is mounted,
The wiring board, wherein a linear or broken slit portion extending in the first direction is formed in the resin substrate.   The wiring board according to claim 1, wherein a second slit portion having a linear shape or a broken line shape is further formed on the resin substrate in parallel with the slit portion.   The wiring board according to claim 2, wherein the plurality of mounting electrode portions are disposed between the slit portion and the second slit portion.   4. The wiring board according to claim 1, wherein a linear or broken third slit portion extending in a direction intersecting the first direction is formed in the resin substrate. 5. A mounting board on which light emitting components are mounted,
The wiring board according to any one of claims 1 to 4,
And a light emitting component mounted on the plurality of mounting electrode portions of the wiring board. A method of manufacturing a wiring board on which a light emitting component is mounted,
Forming a plurality of mounting electrode portions on the first surface side of the resin substrate having flexibility, arranged in a first direction, on which the light emitting component is mounted;
Forming a linear or broken slit portion extending in the first direction on the resin substrate.   The method for manufacturing a wiring board according to claim 6, further comprising a step of forming a second slit portion in a linear or broken line shape in parallel with the slit portion on the resin substrate.   The method of manufacturing a wiring board according to claim 7, wherein in the step of forming the second slit portion, the second slit portion is formed on the side opposite to the slit portion with respect to the plurality of mounting electrode portions. .   The wiring board according to any one of claims 6 to 8, further comprising a step of forming, in the resin substrate, a third slit portion having a linear shape or a broken line shape extending in a direction intersecting the first direction. Production method. A method of manufacturing a mounting board on which a light emitting component is mounted,
Preparing the wiring board according to any one of claims 1 to 4,
Mounting a light-emitting component on the plurality of mounting electrode portions of the wiring board.

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