JP2004103993A - Flexible board for setting led and light for vehicle using flexible board for setting led - Google Patents

Flexible board for setting led and light for vehicle using flexible board for setting led Download PDF

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Publication number
JP2004103993A
JP2004103993A JP2002266607A JP2002266607A JP2004103993A JP 2004103993 A JP2004103993 A JP 2004103993A JP 2002266607 A JP2002266607 A JP 2002266607A JP 2002266607 A JP2002266607 A JP 2002266607A JP 2004103993 A JP2004103993 A JP 2004103993A
Authority
JP
Japan
Prior art keywords
led
installation
flexible board
led chip
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002266607A
Other languages
Japanese (ja)
Inventor
Kiyohiro Akiyama
秋山 精宏
Original Assignee
Ichikoh Ind Ltd
市光工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ichikoh Ind Ltd, 市光工業株式会社 filed Critical Ichikoh Ind Ltd
Priority to JP2002266607A priority Critical patent/JP2004103993A/en
Publication of JP2004103993A publication Critical patent/JP2004103993A/en
Application status is Pending legal-status Critical

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Abstract

The present invention provides a flexible board for LED installation that prevents an LED chip from being difficult to light even when a flexible board is bent, and a vehicle lamp using the flexible board for LED installation.
An LED installation flexible substrate according to the present invention includes an LED chip 12a and an LED chip 12b, which are arranged in an arrangement section 11 for arranging a plurality of LED chips 12. A notch portion 15 for bending the array portion 11 while avoiding the installation location is formed between them.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a flexible board for LED installation for arranging LED chips and a vehicle lamp using the flexible board for LED installation.
[0002]
[Prior art]
Conventionally, a large number of lamps using an LED chip as a light source have been developed. For example, as shown in FIG. 5, many lamps are used as vehicle lamps 1 such as stop lamps and tail lamps installed at the rear of a vehicle.
[0003]
FIG. 6 is a perspective view showing the LED light source base 1a of the LED light source used in the vehicular lamp 1. The LED light source base 1a includes a flexible substrate 2 made of glass epoxy or the like, an LED chip 3 mounted on the flexible substrate 2, and a potting resin 4 for fixing the LED chip 3 to the substrate. The flexible substrate 2 has a rectangular shape, and can be easily bent (bent). The flexible substrate 2 can arrange and arrange the LED chips 3 in a line in the longitudinal direction at equal intervals. On the surface of the flexible substrate 2, a wiring pattern 5 for supplying power to the LED chips 3 is printed. I have.
[0004]
FIG. 7 is a side view of the LED light source base 1a at the position where the LED chip 3 is installed. The potting resin 4 is a transparent resin made of silicon or the like, has a substantially hemispherical shape, and is fixed to the flexible substrate 2 by being cured. The potting resin 4 has a role of protecting the LED chip by embedding and curing the LED chip installed on the flexible substrate 2 in a substantially hemispherical central portion.
[0005]
The LED light source base 1a configured in this manner can bend the flexible substrate 2 according to the shape of the installation position (installation surface) of the LED light source. Can be installed.
[0006]
[Problems to be solved by the invention]
However, since the potting resin 4 is fixed to the flexible substrate 2 in a hardened state, the portion where the potting resin 4 is provided is hardly bent even when the flexible substrate 2 is bent. For this reason, when bending the flexible substrate 2 as a whole, the bending stress is applied to the flexible substrate 2 while the potting resin 4 keeps fixing to the substrate in a hardened state. As shown in (2), there is a problem that a gap d is easily generated between the potting resin 4 and the flexible substrate 2, and the potting resin 4 may be peeled off, and the LED chip 3 may be difficult to light.
[0007]
The present invention has been made in view of the above problems, and in a flexible board for LED installation to which an LED chip is fixed by a potting resin, it is possible to prevent the LED chip from being difficult to light even when the flexible board is bent. It is an object to provide a flexible board for LED installation and a vehicle lamp using the flexible board for LED installation.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 is provided between an installation location of one LED chip and an installation location of another LED chip installed in an arrangement section for arranging a plurality of LED chips. A flexible substrate for LED installation, wherein a cutout portion for bending the array portion avoiding the installation location is formed.
[0009]
The invention according to claim 2 is characterized in that, at an end portion extending in the longitudinal direction of an arrangement portion for presenting a plurality of LED chips having a rectangular shape and arranged in the longitudinal direction, an installation location of one LED chip installed in the arrangement portion and another. A flexible board for LED installation in which a notch for bending the array portion is formed avoiding the installation location facing the installation location of the LED chip.
[0010]
The invention according to claim 3 is the flexible substrate for LED installation according to claim 1 or 2, wherein the flexible substrate is formed at a place where the flexible substrate is largely bent when the flexible substrate for LED installation is installed. The area of the notch is larger than the area of the notch formed at a location where the degree of bending is small.
[0011]
According to a fourth aspect of the present invention, in the flexible substrate for LED installation according to any one of the first to third aspects, the wiring pattern for supplying power to the LED chips is provided in the array portion. It is characterized by being provided so as to avoid the notch.
[0012]
According to a fifth aspect of the present invention, there is provided a vehicle lamp using the flexible board for LED installation according to any one of the first to fourth aspects.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the LED light source base of the vehicle lamp using the flexible board for LED installation according to the present invention will be described. FIG. 1 is a perspective view showing an LED light source base. The LED light source base 10 is used as a light source for a stop lamp for a vehicle, and includes a flexible substrate (a flexible substrate for LED installation) 11, an LED chip 12, and a potting resin 13.
[0014]
The flexible substrate 11 is a substrate (arrangement portion) for arranging LED chips, and is made of glass epoxy (a glass cloth impregnated with an epoxy resin). The flexible substrate 11 is not limited to the one formed of glass epoxy, but may be paper phenol, glass cloth epoxy, paper epoxy, composite (one composed of glass cloth and cellulose paper (or non-woven paper)), polyimide. Although a substrate formed of a film or the like may be used, a substrate formed of glass epoxy is superior in heat resistance and insulation resistance to a paper phenol substrate and the like, and has many properties such as hygroscopicity, dimensional change, torsion, and strength. Excellent in point.
[0015]
The flexible substrate 11 has a substantially rectangular shape, and a wiring pattern 14 for energizing the LED chip 12 is printed on the surface of the substrate. The LED chips 12 are arranged in a line on the flexible substrate 11 at equal intervals, and emit red light when energized through the wiring pattern 14. The potting resin 13 is a transparent resin made of epoxy, silicon, or the like. The LED chip is embedded in the resin and cured, and is fixed to the flexible substrate 11 in a substantially semi-rest shape. The potting resin 13 protects the LED chip by embedding and curing the LED chip.
[0016]
A notch 15 in which a part of the edge is cut is provided at an edge extending in the longitudinal direction of the flexible substrate 11 so as to be located between the adjacent LED chips 12 (for example, the LED chip 12a and the LED chip 12b). A plurality is provided along the edge 16 so as to form a pair with the edge of the other end at a position facing the portion.
[0017]
As described above, since a plurality of notches 15 forming a pair are provided at the edge edge, the flexible board 11 has a narrow board width between the adjacent LED chips 12 and is sandwiched between the pair of notches 15. The narrow neck portion 17 and the main body base 18 having a substrate width larger than the narrow neck portion 17 near the installation position of the LED chip 12, that is, near the fixing position of the potting resin 13, are alternately continuous.
[0018]
When the flexible substrate thus configured is installed on a vehicle body 19 having a curved surface protruding from the center of the LED light source base 10 as shown in FIG. 2, for example, the narrow neck portion 17 is larger than the main body base portion 18. Also, the neck portion 17 is more flexible (easy to bend) than the main body base portion 18 because of its low strength against bending. For this reason, by bending (bending) the narrow neck portion 17 of the flexible substrate 11 positively, the entire LED light source base 10 can be bent without bending the main body base 18 so much. It is possible to prevent the LED chip from easily peeling off, and it is possible to reduce the possibility that the LED chip becomes difficult to light.
[0019]
The LED light source base 10 using the LED installation flexible substrate 11 according to the present invention has been described above, but the LED installation flexible substrate 11 according to the present invention is not limited to the above-described substrate. For example, as shown in FIG. 3, when the LED light source base 10 ′ is installed on a predetermined installation surface, the width of the cutout portion 15 a ′ formed at a location where the LED installation flexible substrate 11 ′ is largely bent is reduced. By making the narrow neck portion 17a longer in the longitudinal direction of the substrate as wide (L1), the narrow neck portion 17a is easily bent, and the width of the cutout portion 15b 'formed at a portion that can be bent only small is narrowed (L2: L2). By setting the length of the narrow neck portion 17b in the longitudinal direction shorter than the narrow neck portion 17a as <L1), the narrow neck portion 17b may be harder to bend than the narrow neck portion 17a. As described above, by changing the size of the width of the notch 15 and the area of the notch 15 in accordance with the shape of the installation surface of the LED light source base 10, the bendability of the narrow neck 17 is adjusted. be able to.
[0020]
Further, for example, as in an LED light source base 10 ″ shown in FIG. 4, a notch 15 ′ may be provided in the middle of the adjacent LED chips 12. Also in the case where the notch 15 ′ is provided in this manner, the flexible substrate 11 ″ near the notch 15 ′ is more easily bent than the portion to which the potting resin 13 is fixed. It is possible to reduce the possibility that the LED chip is hardly peeled off and the LED chip is hardly lit.
[0021]
Furthermore, in the embodiment of the present invention, the LED light source base 10 in which the LED chips 12 are arranged in one line is shown, but the LED chips 12 are not necessarily limited to those in which the LED chips 12 are arranged in one line. The LED chips 12 may be arranged in a plurality of rows. In addition, the flexible substrate 11 is not limited to a substantially rectangular shape, and the shape can be changed according to the installation position of the LED light source base 10, the shape of the installation surface, and the like. When the flexible substrate 11 has a shape other than a rectangular shape or when the LED chips 12 are arranged in a plurality of rows, the notch 15 is formed by considering the direction in which the flexible substrate 11 is bent. It is possible to achieve the effect described above.
[0022]
【The invention's effect】
As described above, since the flexible board for LED installation according to the present invention and the vehicular lamp using the flexible board for LED installation have the above-described configuration, even when the flexible board is bent, the potting resin becomes difficult to peel off, It is possible to reduce the possibility that the chip becomes difficult to light.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an LED light source base using a flexible substrate for LED installation according to the present invention.
FIG. 2 is a cross-sectional view showing a state where the LED light source base shown in FIG. 1 is installed on a curved surface.
FIG. 3 is a perspective view showing an LED light source base in which cutouts having different widths are formed.
FIG. 4 is a perspective view showing an LED light source base in which a cutout portion is formed in an intermediate portion between adjacent LED chips.
FIG. 5 is a perspective view showing a vehicular lamp installed at a rear portion of the vehicle.
FIG. 6 is a perspective view showing an LED light source base formed using a conventionally used flexible substrate.
FIG. 7 is a side view showing a portion where the potting resin of the LED light source base shown in FIG. 6 is fixed.
FIG. 8 is a side view showing a state where the potting resin has peeled off from the flexible substrate when the LED light source base shown in FIG. 6 is bent.
[Explanation of symbols]
1 vehicle lamps 1a, 10, 10 ', 10 "LED light source base 2, 11, 11', 11" flexible board (flexible board for LED installation, array section)
3, 12, 12a, 12b LED chip 4, 13 Potting resin 5, 14 Wiring pattern 15, 15 ', 15a, 15b, 15a', 15b 'Notch 17, 17, 17a, 17b Neck 18 Body base

Claims (5)

  1. Between the installation location of one LED chip and the installation location of another LED chip installed in the arraying section for arranging a plurality of LED chips, to flex the arraying section avoiding the installation location A flexible board for LED installation, wherein a notch is formed.
  2. At the longitudinally extending edge of the arrangement part in which a plurality of LED chips are arranged in the longitudinal direction and exhibit a rectangular shape, the location of one LED chip and the location of another LED chip installed in the arrangement part are arranged. A flexible board for LED installation, wherein a cutout portion is formed to bend the arrangement portion so as to avoid the installation location facing the space.
  3. The area of the notch formed in a place where the flexible board is largely bent when the flexible board for LED installation is installed is larger than the area of the notch formed in a place where the degree of bending is small. The flexible substrate for LED installation according to claim 1, wherein the substrate is large.
  4. 4. The arrangement part according to claim 1, wherein a wiring pattern for supplying power to the LED chip is provided so as to avoid the notch. The flexible substrate for LED installation according to the above.
  5. A vehicular lamp using the flexible board for LED installation according to any one of claims 1 to 4.
JP2002266607A 2002-09-12 2002-09-12 Flexible board for setting led and light for vehicle using flexible board for setting led Pending JP2004103993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002266607A JP2004103993A (en) 2002-09-12 2002-09-12 Flexible board for setting led and light for vehicle using flexible board for setting led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002266607A JP2004103993A (en) 2002-09-12 2002-09-12 Flexible board for setting led and light for vehicle using flexible board for setting led

Publications (1)

Publication Number Publication Date
JP2004103993A true JP2004103993A (en) 2004-04-02

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Country Status (1)

Country Link
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487477A (en) * 1990-07-31 1992-03-19 Fuji Photo Film Co Ltd Picture data input range indication device
DE102005050254A1 (en) * 2005-10-20 2007-04-26 Dieter Leber Multi-arrangement flexible lighting device, has light units each formed as island of unit surface area sufficient for holding electrical connections and cooling devices
WO2008047484A1 (en) 2006-10-20 2008-04-24 Contents Co., Ltd. Flexible luminescent material
JP2008108861A (en) * 2006-10-25 2008-05-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Light emitting diode package where flexible pcb is directly linked with light source
JP2008293692A (en) * 2007-05-22 2008-12-04 Du Pont Toray Co Ltd Led illumination device, and lighting fixture for vehicle using the device
WO2010146919A1 (en) * 2009-06-15 2010-12-23 シャープ株式会社 Light source unit, illumination device, display device, television receiver, and method for manufacturing a substrate for a light source unit
WO2011086760A1 (en) 2010-01-12 2011-07-21 シャープ株式会社 Led substrate, backlight unit, and liquid crystal display
JP2012521016A (en) * 2009-03-17 2012-09-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED strip for small path identification characters
US8576355B2 (en) 2010-01-07 2013-11-05 Sharp Kabushiki Kaisha Led substrate, backlight unit, and liquid crystal display device
WO2014013665A1 (en) * 2012-07-19 2014-01-23 シャープ株式会社 Line light-emitting device and manufacturing method for same
WO2014038169A1 (en) * 2012-09-06 2014-03-13 シャープ株式会社 Light-emitting element substrate and method for producing same
US8717515B2 (en) 2010-01-14 2014-05-06 Sharp Kabushiki Kaisha LED substrate, backlight unit, and liquid crystal display device
JP2014090161A (en) * 2012-10-03 2014-05-15 Nichia Chem Ind Ltd Light-emitting device
WO2014155347A1 (en) * 2013-03-29 2014-10-02 Koninklijke Philips N.V. Printed circuit board for a light emitting diode module
US8916903B2 (en) 2012-07-09 2014-12-23 Nichia Corporation Light emitting device
JP2015029120A (en) * 2006-03-03 2015-02-12 株式会社半導体エネルギー研究所 Light-emitting device
US9279571B2 (en) 2012-11-16 2016-03-08 Nichia Corporation Light emitting device
WO2016063473A1 (en) * 2014-10-20 2016-04-28 日清紡ホールディングス株式会社 Led array and production method therefor
JP2016072516A (en) * 2014-09-30 2016-05-09 大日本印刷株式会社 Wiring board and manufacturing method of the same, and mounting board and manufacturing method of the same
JP2016171199A (en) * 2015-03-12 2016-09-23 イビデン株式会社 Light emission element mount board
JP2018142720A (en) * 2005-10-28 2018-09-13 株式会社テラスホールディングス Flexible light emission body

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487477A (en) * 1990-07-31 1992-03-19 Fuji Photo Film Co Ltd Picture data input range indication device
DE102005050254A1 (en) * 2005-10-20 2007-04-26 Dieter Leber Multi-arrangement flexible lighting device, has light units each formed as island of unit surface area sufficient for holding electrical connections and cooling devices
DE102005050254B4 (en) * 2005-10-20 2010-02-11 Dieter Leber Method for producing a flexible lighting device as a multiple arrangement
JP2018142720A (en) * 2005-10-28 2018-09-13 株式会社テラスホールディングス Flexible light emission body
US9793150B2 (en) 2006-03-03 2017-10-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9436036B2 (en) 2006-03-03 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2016026407A (en) * 2006-03-03 2016-02-12 株式会社半導体エネルギー研究所 Light-emitting device
JP2015029120A (en) * 2006-03-03 2015-02-12 株式会社半導体エネルギー研究所 Light-emitting device
US10229940B2 (en) 2006-03-03 2019-03-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2008047484A1 (en) 2006-10-20 2008-04-24 Contents Co., Ltd. Flexible luminescent material
JP2008108861A (en) * 2006-10-25 2008-05-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Light emitting diode package where flexible pcb is directly linked with light source
JP2008293692A (en) * 2007-05-22 2008-12-04 Du Pont Toray Co Ltd Led illumination device, and lighting fixture for vehicle using the device
JP2012521016A (en) * 2009-03-17 2012-09-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED strip for small path identification characters
CN102449379A (en) * 2009-06-15 2012-05-09 夏普株式会社 Light source unit, illumination device, display device, television receiver, and method for manufacturing a substrate for a light source unit
WO2010146919A1 (en) * 2009-06-15 2010-12-23 シャープ株式会社 Light source unit, illumination device, display device, television receiver, and method for manufacturing a substrate for a light source unit
US8941796B2 (en) 2009-06-15 2015-01-27 Sharp Kabushiki Kaisha Light source unit, lighting device, display device, television receiver, and method of manufacturing board for light source unit
US8576355B2 (en) 2010-01-07 2013-11-05 Sharp Kabushiki Kaisha Led substrate, backlight unit, and liquid crystal display device
WO2011086760A1 (en) 2010-01-12 2011-07-21 シャープ株式会社 Led substrate, backlight unit, and liquid crystal display
US8717515B2 (en) 2010-01-14 2014-05-06 Sharp Kabushiki Kaisha LED substrate, backlight unit, and liquid crystal display device
US8916903B2 (en) 2012-07-09 2014-12-23 Nichia Corporation Light emitting device
US9209364B2 (en) 2012-07-09 2015-12-08 Nichia Corporation Light emitting device
RU2638585C2 (en) * 2012-07-09 2017-12-14 Нитиа Корпорейшн Light-emitting device
US9799807B2 (en) 2012-07-09 2017-10-24 Nichia Corporation Light emitting device
US9590152B2 (en) 2012-07-09 2017-03-07 Nichia Corporation Light emitting device
US9557020B2 (en) 2012-07-19 2017-01-31 Sharp Kabushiki Kaisha Columnar light emitting device and manufacturing method of the same
WO2014013665A1 (en) * 2012-07-19 2014-01-23 シャープ株式会社 Line light-emitting device and manufacturing method for same
CN104488097A (en) * 2012-07-19 2015-04-01 夏普株式会社 Line light-emitting device and manufacturing method for same
JPWO2014013665A1 (en) * 2012-07-19 2016-06-30 シャープ株式会社 Column light emitting device and method for manufacturing the same
WO2014038169A1 (en) * 2012-09-06 2014-03-13 シャープ株式会社 Light-emitting element substrate and method for producing same
JP2014090161A (en) * 2012-10-03 2014-05-15 Nichia Chem Ind Ltd Light-emitting device
US9279571B2 (en) 2012-11-16 2016-03-08 Nichia Corporation Light emitting device
WO2014155347A1 (en) * 2013-03-29 2014-10-02 Koninklijke Philips N.V. Printed circuit board for a light emitting diode module
JP2016072516A (en) * 2014-09-30 2016-05-09 大日本印刷株式会社 Wiring board and manufacturing method of the same, and mounting board and manufacturing method of the same
WO2016063473A1 (en) * 2014-10-20 2016-04-28 日清紡ホールディングス株式会社 Led array and production method therefor
JP2016171199A (en) * 2015-03-12 2016-09-23 イビデン株式会社 Light emission element mount board

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