JP2016049566A5 - - Google Patents

Download PDF

Info

Publication number
JP2016049566A5
JP2016049566A5 JP2015154944A JP2015154944A JP2016049566A5 JP 2016049566 A5 JP2016049566 A5 JP 2016049566A5 JP 2015154944 A JP2015154944 A JP 2015154944A JP 2015154944 A JP2015154944 A JP 2015154944A JP 2016049566 A5 JP2016049566 A5 JP 2016049566A5
Authority
JP
Japan
Prior art keywords
solder mask
ink composition
group
viscosity
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015154944A
Other languages
English (en)
Japanese (ja)
Other versions
JP6424148B2 (ja
JP2016049566A (ja
Filing date
Publication date
Priority claimed from US14/471,967 external-priority patent/US9606430B2/en
Application filed filed Critical
Publication of JP2016049566A publication Critical patent/JP2016049566A/ja
Publication of JP2016049566A5 publication Critical patent/JP2016049566A5/ja
Application granted granted Critical
Publication of JP6424148B2 publication Critical patent/JP6424148B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015154944A 2014-08-28 2015-08-05 ソルダーマスクインク組成物をエアロゾル印刷する方法 Expired - Fee Related JP6424148B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/471,967 2014-08-28
US14/471,967 US9606430B2 (en) 2014-08-28 2014-08-28 Method of aerosol printing a solder mask ink composition

Publications (3)

Publication Number Publication Date
JP2016049566A JP2016049566A (ja) 2016-04-11
JP2016049566A5 true JP2016049566A5 (cg-RX-API-DMAC10.html) 2018-08-30
JP6424148B2 JP6424148B2 (ja) 2018-11-14

Family

ID=54011537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015154944A Expired - Fee Related JP6424148B2 (ja) 2014-08-28 2015-08-05 ソルダーマスクインク組成物をエアロゾル印刷する方法

Country Status (4)

Country Link
US (2) US9606430B2 (cg-RX-API-DMAC10.html)
EP (1) EP2996447B1 (cg-RX-API-DMAC10.html)
JP (1) JP6424148B2 (cg-RX-API-DMAC10.html)
CA (1) CA2901007C (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2969592C (en) 2014-12-05 2023-02-14 University Of Florida Research Foundation, Inc. 3d printing using phase changing materials as support
WO2016130953A1 (en) 2015-02-13 2016-08-18 University Of Florida Research Foundation, Inc. High speed 3d printing system for wound and tissue replacement
TWI600125B (zh) * 2015-05-01 2017-09-21 精材科技股份有限公司 晶片封裝體及其製造方法
EP3294869A4 (en) 2015-05-08 2019-03-06 University of Florida Research Foundation, Inc. GROWTH MEDIA FOR THREE-DIMENSIONAL CELL CULTURE
US20180226377A1 (en) * 2015-08-27 2018-08-09 Intel IP Corporation Robust intermetallic compound layer interface for package in package embedding
WO2017040981A1 (en) 2015-09-03 2017-03-09 University Of Florida Research Foundation, Inc. Valve incorporating temporary phase change material
WO2017096263A1 (en) 2015-12-04 2017-06-08 University Of Florida Research Foundation, Incorporated Crosslinkable or functionalizable polymers for 3d printing of soft materials
US11124644B2 (en) * 2016-09-01 2021-09-21 University Of Florida Research Foundation, Inc. Organic microgel system for 3D printing of silicone structures
DE102017121726A1 (de) * 2017-09-19 2019-03-21 FELA GmbH Leiterplatte mit Lötstoppschicht und Verfahren zur mindestens abschnittsweisen Beschichtung einer Leiterplatte mit einer Lötstoppschicht
US12128612B2 (en) * 2018-08-27 2024-10-29 Hewlett-Packard Development Company, L.P. Binder agent
US20200102468A1 (en) * 2018-10-02 2020-04-02 Xerox Corporation Dielectric ink composition
CN118109082A (zh) * 2024-03-12 2024-05-31 深圳市墨库新材料集团股份有限公司 一种阻焊喷墨墨水及其应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019188A (en) * 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
JPS5975955A (ja) 1982-10-22 1984-04-28 Kansai Paint Co Ltd 自己熱硬化性塗料用樹脂組成物
WO1985003460A1 (en) * 1984-02-13 1985-08-15 Schmitt Jerome J Iii Method and apparatus for the gas jet deposition of conducting and dielectric thin solid films and products produced thereby
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
IL94474A (en) * 1989-06-09 1993-07-08 Morton Int Inc Photoimageable compositions
US5229252A (en) * 1989-06-09 1993-07-20 Morton International, Inc. Photoimageable compositions
US6207346B1 (en) * 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP2000347402A (ja) * 1999-06-02 2000-12-15 Toagosei Co Ltd レジスト組成物
JP2001013679A (ja) * 1999-04-30 2001-01-19 Toagosei Co Ltd レジスト組成物
US6458509B1 (en) 1999-04-30 2002-10-01 Toagosei Co., Ltd. Resist compositions
JP2002338612A (ja) 2001-05-11 2002-11-27 Toyobo Co Ltd 光硬化性組成物およびその硬化方法
GB0221893D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
US7439285B2 (en) * 2004-01-23 2008-10-21 Printar Ltd. Liquid thermosetting ink
WO2007026366A1 (en) * 2005-08-31 2007-03-08 Printar Ltd. Uv curable hybridcuring ink jet ink composition and solder mask using the same
US7964032B2 (en) 2006-10-17 2011-06-21 Momentive Performance Materials Inc. Fluorine-free trisiloxane surfactant compositions for use in coatings and printing ink compositions
KR20080069354A (ko) * 2007-01-23 2008-07-28 타무라 카켄 코포레이션 레지스트 잉크, 프린트 배선판 및 레지스트 잉크의 제조방법
JP5526033B2 (ja) * 2007-11-14 2014-06-18 ザ ユニバーシティ オブ クィーンズランド 微粒子製造装置および微粒子製造方法
JP5295669B2 (ja) * 2008-07-14 2013-09-18 新光電気工業株式会社 配線基板の製造方法
JP5569216B2 (ja) * 2010-07-27 2014-08-13 Ｊｎｃ株式会社 熱硬化性組成物およびその用途
US9796864B2 (en) 2014-08-28 2017-10-24 Xerox Corporation Solder mask ink composition

Similar Documents

Publication Publication Date Title
JP6424148B2 (ja) ソルダーマスクインク組成物をエアロゾル印刷する方法
JP5511799B2 (ja) ウエハーダイシング用保護膜組成物
CN108603066A (zh) 喷墨用油墨组及喷墨记录方法
KR20160087347A (ko) 에어로졸 제트식 인쇄용 솔더 마스크 조성물
BR112013020343B1 (pt) tinta para jato de tinta à base de solvente
JP5310957B2 (ja) インクジェット記録用導電性水性インク
WO2021132446A1 (ja) 金属微粒子含有インク
WO2012039372A1 (ja) インクジェット用硬化性組成物及び電子部品の製造方法
TWI462977B (zh) 印刷組成物及使用其之印刷方法
JP7013622B2 (ja) 導電性インクジェット印刷インク組成物
JP2012138349A (ja) 導電パターン形成方法
EP3317357A1 (en) Aqueous radiation curable ink composition
KR102196867B1 (ko) 솔더 마스크 잉크 조성물
JP2021095492A5 (cg-RX-API-DMAC10.html)
TW201641622A (zh) 噴印墨水成分、墨水塗佈方法及經塗佈物件
CN104170021B (zh) 导电性组合物及由其形成有导电膜的电路基板
JP2010180263A (ja) カーボンナノチューブインク組成物及びカーボンナノチューブ膜の製造方法
JP2009155424A (ja) ２液型インクジェットヘッド洗浄液およびインクジェットヘッドの洗浄方法
JP2009224381A (ja) 配線基板の製造方法および配線基板の製造装置
JP4586964B2 (ja) 鋼板印字用ペイント及び鋼板印字方法
JP3916046B2 (ja) インクジェットヘッド用インク組成物及びそのインク組成物で印刷された被印刷体
KR102428051B1 (ko) 고밀도 도체를 갖는 pcb 제품을 제조하기 위한 방법 및 장치
JP2025542328A (ja) 銀ナノ粒子に基づくインク
JP6759601B2 (ja) 静電吐出式インクジェット装置用インク
KR101032880B1 (ko) 래커 제거제의 조성물