JP2016035957A5 - - Google Patents

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Publication number
JP2016035957A5
JP2016035957A5 JP2014157753A JP2014157753A JP2016035957A5 JP 2016035957 A5 JP2016035957 A5 JP 2016035957A5 JP 2014157753 A JP2014157753 A JP 2014157753A JP 2014157753 A JP2014157753 A JP 2014157753A JP 2016035957 A5 JP2016035957 A5 JP 2016035957A5
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JP
Japan
Prior art keywords
preferable
threshold
value
determination
threshold value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014157753A
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English (en)
Japanese (ja)
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JP2016035957A (ja
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Publication date
Application filed filed Critical
Priority to JP2014157753A priority Critical patent/JP2016035957A/ja
Priority claimed from JP2014157753A external-priority patent/JP2016035957A/ja
Priority to PCT/JP2015/066660 priority patent/WO2016017292A1/ja
Priority to KR1020177005706A priority patent/KR20170038050A/ko
Priority to CN201580040295.8A priority patent/CN106662613A/zh
Priority to SG11201700713QA priority patent/SG11201700713QA/en
Priority to US15/501,151 priority patent/US20170256324A1/en
Priority to TW104123874A priority patent/TWI660183B/zh
Publication of JP2016035957A publication Critical patent/JP2016035957A/ja
Publication of JP2016035957A5 publication Critical patent/JP2016035957A5/ja
Pending legal-status Critical Current

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JP2014157753A 2014-08-01 2014-08-01 デバイスの検査方法、プローブカード、インターポーザ及び検査装置 Pending JP2016035957A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014157753A JP2016035957A (ja) 2014-08-01 2014-08-01 デバイスの検査方法、プローブカード、インターポーザ及び検査装置
PCT/JP2015/066660 WO2016017292A1 (ja) 2014-08-01 2015-06-10 デバイスの検査方法、プローブカード、インターポーザ及び検査装置
KR1020177005706A KR20170038050A (ko) 2014-08-01 2015-06-10 디바이스의 검사 방법, 프로브 카드, 인터포저 및 검사 장치
CN201580040295.8A CN106662613A (zh) 2014-08-01 2015-06-10 器件的检查方法、探针卡、中继板以及检查装置
SG11201700713QA SG11201700713QA (en) 2014-08-01 2015-06-10 Device inspection method, probe card, interposer, and inspection apparatus
US15/501,151 US20170256324A1 (en) 2014-08-01 2015-06-10 Device inspection method, probe card, interposer, and inspection apparatus
TW104123874A TWI660183B (zh) 2014-08-01 2015-07-23 Component inspection method, probe card, interposer and inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014157753A JP2016035957A (ja) 2014-08-01 2014-08-01 デバイスの検査方法、プローブカード、インターポーザ及び検査装置

Publications (2)

Publication Number Publication Date
JP2016035957A JP2016035957A (ja) 2016-03-17
JP2016035957A5 true JP2016035957A5 (enExample) 2017-07-27

Family

ID=55217197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014157753A Pending JP2016035957A (ja) 2014-08-01 2014-08-01 デバイスの検査方法、プローブカード、インターポーザ及び検査装置

Country Status (7)

Country Link
US (1) US20170256324A1 (enExample)
JP (1) JP2016035957A (enExample)
KR (1) KR20170038050A (enExample)
CN (1) CN106662613A (enExample)
SG (1) SG11201700713QA (enExample)
TW (1) TWI660183B (enExample)
WO (1) WO2016017292A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6738236B2 (ja) * 2016-08-12 2020-08-12 東京エレクトロン株式会社 デバイス検査回路、デバイス検査装置及びプローブカード
US10333260B2 (en) * 2016-08-31 2019-06-25 Semiconductor Components Industries, Llc High contact resistance detection
JP2018194356A (ja) 2017-05-15 2018-12-06 東京エレクトロン株式会社 デバイスの検査方法
US10677815B2 (en) * 2018-06-08 2020-06-09 Teradyne, Inc. Test system having distributed resources
KR102577446B1 (ko) * 2019-02-12 2023-09-11 삼성전자주식회사 테스트 보드 및 이의 제조 방법, 테스트 보드를 이용한 소자 검사 장비, 및 테스트 보드를 이용한 반도체 장치의 제조 방법
US11899550B2 (en) * 2020-03-31 2024-02-13 Advantest Corporation Enhanced auxiliary memory mapped interface test systems and methods
KR102797672B1 (ko) 2020-05-28 2025-04-17 삼성전자주식회사 번 인 보드 테스트 장치 및 시스템
US11486926B1 (en) * 2020-12-04 2022-11-01 Xilinx, Inc. Wearout card use count
FR3130066B1 (fr) * 2021-12-07 2024-07-19 Hprobe Dispositif et procédé de test de mémoire
JP2023148529A (ja) * 2022-03-30 2023-10-13 東京エレクトロン株式会社 検査装置、および検査方法
KR20230155656A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 검사 방법 및 표시 장치의 검사 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743426B2 (ja) * 1989-12-20 1995-05-15 三菱電機株式会社 超音波障害物センサ
CA2174784C (en) * 1996-04-23 1999-07-13 George Guozhen Zhong Automatic multi-probe pwb tester
JPH11311661A (ja) * 1998-04-30 1999-11-09 Nec Corp 半導体装置試験システムおよび半導体装置試験方法
JP2000346910A (ja) * 1999-06-07 2000-12-15 Yamada Denon Kk Ｉｃの多数並列同時テスト用測定装置
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
DE10306620B4 (de) * 2003-02-18 2007-04-19 Infineon Technologies Ag Integrierte Testschaltung in einer integrierten Schaltung
JP3767829B1 (ja) * 2005-06-09 2006-04-19 エスティケイテクノロジー株式会社 半導体デバイスの検査装置
WO2008044391A1 (en) * 2006-10-05 2008-04-17 Advantest Corporation Testing device, testing method, and manufacturing method
JP5193975B2 (ja) * 2009-09-04 2013-05-08 富士通株式会社 半導体試験回路、半導体試験用冶具、半導体試験装置及び半導体試験方法

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