JP2016026332A5 - - Google Patents
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- JP2016026332A5 JP2016026332A5 JP2015219296A JP2015219296A JP2016026332A5 JP 2016026332 A5 JP2016026332 A5 JP 2016026332A5 JP 2015219296 A JP2015219296 A JP 2015219296A JP 2015219296 A JP2015219296 A JP 2015219296A JP 2016026332 A5 JP2016026332 A5 JP 2016026332A5
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Applications Claiming Priority (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22925600P | 2000-08-30 | 2000-08-30 | |
| US60/229,256 | 2000-08-30 | ||
| US30176301P | 2001-06-27 | 2001-06-27 | |
| US30159101P | 2001-06-27 | 2001-06-27 | |
| US30148401P | 2001-06-27 | 2001-06-27 | |
| US30161301P | 2001-06-27 | 2001-06-27 | |
| US60/301,591 | 2001-06-27 | ||
| US60/301,763 | 2001-06-27 | ||
| US09/894,987 US7068833B1 (en) | 2000-08-30 | 2001-06-27 | Overlay marks, methods of overlay mark design and methods of overlay measurements |
| US60/301,613 | 2001-06-27 | ||
| US60/301,484 | 2001-06-27 | ||
| US09/894,987 | 2001-06-27 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014098674A Division JP5945294B2 (ja) | 2000-08-30 | 2014-05-12 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016228018A Division JP2017062492A (ja) | 2000-08-30 | 2016-11-24 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016026332A JP2016026332A (ja) | 2016-02-12 |
| JP2016026332A5 true JP2016026332A5 (enExample) | 2017-12-07 |
| JP6313272B2 JP6313272B2 (ja) | 2018-04-18 |
Family
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Family Applications (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002524212A Expired - Lifetime JP5180419B2 (ja) | 2000-08-30 | 2001-08-28 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2012009434A Expired - Lifetime JP5663504B2 (ja) | 2000-08-30 | 2012-01-19 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2014098674A Expired - Lifetime JP5945294B2 (ja) | 2000-08-30 | 2014-05-12 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2015219288A Withdrawn JP2016026331A (ja) | 2000-08-30 | 2015-11-09 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2015219296A Expired - Lifetime JP6313272B2 (ja) | 2000-08-30 | 2015-11-09 | 重ね合わせマーク、および半導体デバイス |
| JP2016228018A Pending JP2017062492A (ja) | 2000-08-30 | 2016-11-24 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2016227754A Pending JP2017040941A (ja) | 2000-08-30 | 2016-11-24 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2020040921A Pending JP2020112807A (ja) | 2000-08-30 | 2020-03-10 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
Family Applications Before (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002524212A Expired - Lifetime JP5180419B2 (ja) | 2000-08-30 | 2001-08-28 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2012009434A Expired - Lifetime JP5663504B2 (ja) | 2000-08-30 | 2012-01-19 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2014098674A Expired - Lifetime JP5945294B2 (ja) | 2000-08-30 | 2014-05-12 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2015219288A Withdrawn JP2016026331A (ja) | 2000-08-30 | 2015-11-09 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016228018A Pending JP2017062492A (ja) | 2000-08-30 | 2016-11-24 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2016227754A Pending JP2017040941A (ja) | 2000-08-30 | 2016-11-24 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
| JP2020040921A Pending JP2020112807A (ja) | 2000-08-30 | 2020-03-10 | 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1314198B1 (enExample) |
| JP (8) | JP5180419B2 (enExample) |
| WO (1) | WO2002019415A1 (enExample) |
Families Citing this family (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7541201B2 (en) | 2000-08-30 | 2009-06-02 | Kla-Tencor Technologies Corporation | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
| EP1314198B1 (en) * | 2000-08-30 | 2017-03-08 | KLA-Tencor Corporation | Overlay marks, methods of overlay mark design and methods of overlay measurements |
| US7317531B2 (en) * | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| TWI251722B (en) | 2002-09-20 | 2006-03-21 | Asml Netherlands Bv | Device inspection |
| EP1570232B1 (en) * | 2002-12-05 | 2016-11-02 | KLA-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| KR20060009249A (ko) * | 2003-04-08 | 2006-01-31 | 에이오티아이 오퍼레이팅 컴퍼니 인코포레이티드 | 오버레이 측정 마크 |
| US20070222088A1 (en) * | 2003-04-08 | 2007-09-27 | Aoti Operating Company, Inc, | Overlay Metrology Mark |
| SG108975A1 (en) * | 2003-07-11 | 2005-02-28 | Asml Netherlands Bv | Marker structure for alignment or overlay to correct pattern induced displacement, mask pattern for defining such a marker structure and lithographic projection apparatus using such a mask pattern |
| US6937337B2 (en) | 2003-11-19 | 2005-08-30 | International Business Machines Corporation | Overlay target and measurement method using reference and sub-grids |
| JP4734261B2 (ja) * | 2004-02-18 | 2011-07-27 | ケーエルエー−テンカー コーポレイション | 連続変化するオフセットマークと、オーバレイ決定方法 |
| US7065737B2 (en) * | 2004-03-01 | 2006-06-20 | Advanced Micro Devices, Inc | Multi-layer overlay measurement and correction technique for IC manufacturing |
| US7678516B2 (en) | 2004-07-22 | 2010-03-16 | Kla-Tencor Technologies Corp. | Test structures and methods for monitoring or controlling a semiconductor fabrication process |
| DE102005007280B4 (de) * | 2005-02-17 | 2009-06-10 | Qimonda Ag | Verfahren zum Bestimmen einer kritischen Dimension einer lateral strukturierten Schicht |
| JP4520429B2 (ja) | 2005-06-01 | 2010-08-04 | エーエスエムエル ネザーランズ ビー．ブイ． | 位置合わせ装置への２次元フォトニック結晶の応用 |
| US7737566B2 (en) | 2005-06-01 | 2010-06-15 | Asml Netherlands B.V. | Alignment devices and methods for providing phase depth control |
| KR100612410B1 (ko) | 2005-08-01 | 2006-08-16 | 나노메트릭스코리아 주식회사 | 오버레이 키, 이를 이용한 오버레이 측정방법 및 측정장치 |
| US7751047B2 (en) * | 2005-08-02 | 2010-07-06 | Asml Netherlands B.V. | Alignment and alignment marks |
| US7439001B2 (en) | 2005-08-18 | 2008-10-21 | International Business Machines Corporation | Focus blur measurement and control method |
| US7687925B2 (en) | 2005-09-07 | 2010-03-30 | Infineon Technologies Ag | Alignment marks for polarized light lithography and method for use thereof |
| US7474401B2 (en) | 2005-09-13 | 2009-01-06 | International Business Machines Corporation | Multi-layer alignment and overlay target and measurement method |
| DE102005046973B4 (de) * | 2005-09-30 | 2014-01-30 | Globalfoundries Inc. | Struktur und Verfahren zum gleichzeitigen Bestimmen einer Überlagerungsgenauigkeit und eines Musteranordnungsfehlers |
| US7863763B2 (en) | 2005-11-22 | 2011-01-04 | Asml Netherlands B.V. | Binary sinusoidal sub-wavelength gratings as alignment marks |
| US7898662B2 (en) | 2006-06-20 | 2011-03-01 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| US7455939B2 (en) | 2006-07-31 | 2008-11-25 | International Business Machines Corporation | Method of improving grating test pattern for lithography monitoring and controlling |
| US7545520B2 (en) * | 2006-11-15 | 2009-06-09 | Asml Netherlands B.V. | System and method for CD determination using an alignment sensor of a lithographic apparatus |
| US7473502B1 (en) | 2007-08-03 | 2009-01-06 | International Business Machines Corporation | Imaging tool calibration artifact and method |
| US7879515B2 (en) | 2008-01-21 | 2011-02-01 | International Business Machines Corporation | Method to control semiconductor device overlay using post etch image metrology |
| NL1036476A1 (nl) | 2008-02-01 | 2009-08-04 | Asml Netherlands Bv | Alignment mark and a method of aligning a substrate comprising such an alignment mark. |
| TW201003449A (en) * | 2008-06-10 | 2010-01-16 | Applied Materials Israel Ltd | Method and system for evaluating an object that has a repetitive pattern |
| US9097989B2 (en) | 2009-01-27 | 2015-08-04 | International Business Machines Corporation | Target and method for mask-to-wafer CD, pattern placement and overlay measurement and control |
| CN102483582B (zh) * | 2009-08-24 | 2016-01-20 | Asml荷兰有限公司 | 量测方法和设备、光刻设备、光刻处理单元和包括量测目标的衬底 |
| US8804137B2 (en) * | 2009-08-31 | 2014-08-12 | Kla-Tencor Corporation | Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capability |
| US8329360B2 (en) * | 2009-12-04 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus of providing overlay |
| US9927718B2 (en) | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
| US10890436B2 (en) | 2011-07-19 | 2021-01-12 | Kla Corporation | Overlay targets with orthogonal underlayer dummyfill |
| US11455737B2 (en) | 2012-12-06 | 2022-09-27 | The Boeing Company | Multiple-scale digital image correlation pattern and measurement |
| JP6326916B2 (ja) * | 2013-04-23 | 2018-05-23 | 大日本印刷株式会社 | インプリント用モールドおよびインプリント方法 |
| JP6361238B2 (ja) * | 2013-04-23 | 2018-07-25 | 大日本印刷株式会社 | インプリント用モールドおよびインプリント方法 |
| JP6602755B2 (ja) * | 2013-06-27 | 2019-11-06 | ケーエルエー コーポレイション | 計測標的の偏光測定及び対応する標的設計 |
| KR101906293B1 (ko) * | 2014-02-21 | 2018-10-10 | 에이에스엠엘 네델란즈 비.브이. | 타겟 배열 및 연계된 타겟의 최적화 |
| KR102154561B1 (ko) * | 2014-04-01 | 2020-09-10 | 다이니폰 인사츠 가부시키가이샤 | 임프린트용 몰드 및 임프린트 방법 |
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| JP2016180783A (ja) * | 2015-03-23 | 2016-10-13 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法、パターンの重ね合わせ検査方法 |
| IL256196B (en) | 2015-06-17 | 2022-07-01 | Asml Netherlands Bv | Recipe selection based on inter-recipe consistency |
| US10062543B2 (en) | 2015-06-23 | 2018-08-28 | Kla-Tencor Corp. | Determining multi-patterning step overlay error |
| KR101564312B1 (ko) * | 2015-07-07 | 2015-10-29 | (주)오로스 테크놀로지 | 오버레이 마크 및 이를 이용한 오버레이 계측방법 및 반도체 디바이스 제조방법 |
| US9530199B1 (en) * | 2015-07-13 | 2016-12-27 | Applied Materials Israel Ltd | Technique for measuring overlay between layers of a multilayer structure |
| CN112925177B (zh) * | 2016-01-11 | 2022-09-06 | 科磊股份有限公司 | 热点及工艺窗监测 |
| US10615084B2 (en) | 2016-03-01 | 2020-04-07 | Asml Netherlands B.V. | Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values |
| US10451412B2 (en) | 2016-04-22 | 2019-10-22 | Kla-Tencor Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| IL262114B2 (en) * | 2016-04-22 | 2023-04-01 | Asml Netherlands Bv | Determining the stack difference and correcting with the help of the stack difference |
| FR3051591B1 (fr) * | 2016-05-17 | 2020-06-19 | Horiba Jobin Yvon Sas | Dispositif et procede de micro-localisation pour instrument imageur et appareil de mesure |
| KR101665569B1 (ko) | 2016-05-19 | 2016-10-12 | (주)오로스 테크놀로지 | 오버레이 마크 및 이를 이용한 오버레이 계측방법 및 반도체 디바이스 제조방법 |
| WO2018087207A1 (en) * | 2016-11-10 | 2018-05-17 | Asml Netherlands B.V. | Design and correction using stack difference |
| US11156928B2 (en) | 2017-05-24 | 2021-10-26 | Asml Holding N.V. | Alignment mark for two-dimensional alignment in an alignment system |
| EP3422102A1 (en) * | 2017-06-26 | 2019-01-02 | ASML Netherlands B.V. | Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method |
| US10474040B2 (en) * | 2017-12-07 | 2019-11-12 | Kla-Tencor Corporation | Systems and methods for device-correlated overlay metrology |
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| CN111542784B (zh) * | 2018-01-12 | 2025-05-06 | 科磊股份有限公司 | 具有倾斜周期性结构的计量目标及方法 |
| CN110034098B (zh) * | 2018-01-12 | 2020-11-27 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| US10446367B2 (en) * | 2018-03-07 | 2019-10-15 | Kla-Tencor Corporation | Scan strategies to minimize charging effects and radiation damage of charged particle beam metrology system |
| CN112789557A (zh) * | 2018-10-30 | 2021-05-11 | 科磊股份有限公司 | 不对称像差的估计 |
| JP7317131B2 (ja) * | 2019-02-15 | 2023-07-28 | ケーエルエー コーポレイション | 結合された光および電子ビーム技術を使用する位置ずれ測定 |
| US11073768B2 (en) * | 2019-06-26 | 2021-07-27 | Kla Corporation | Metrology target for scanning metrology |
| US11809090B2 (en) * | 2020-01-30 | 2023-11-07 | Kla Corporation | Composite overlay metrology target |
| US11686576B2 (en) * | 2020-06-04 | 2023-06-27 | Kla Corporation | Metrology target for one-dimensional measurement of periodic misregistration |
| CN112015061A (zh) * | 2020-08-27 | 2020-12-01 | 上海华力集成电路制造有限公司 | 一种套刻精度量测标记及其使用方法 |
| US12485604B2 (en) | 2021-01-07 | 2025-12-02 | Tohoku University | Positioning method, method for manufacturing layered body, positioning device, layered body manufacturing device, and layered body |
| JP2022117091A (ja) | 2021-01-29 | 2022-08-10 | キヤノン株式会社 | 計測装置、リソグラフィ装置及び物品の製造方法 |
| KR102617622B1 (ko) | 2021-04-26 | 2023-12-27 | (주)오로스 테크놀로지 | 오버레이 마크 및 이를 이용한 오버레이 계측방법 및 반도체 디바이스 제조방법 |
| KR102675464B1 (ko) | 2021-06-17 | 2024-06-14 | (주) 오로스테크놀로지 | 변위 벡터를 이용한 오버레이 측정 방법 |
| KR102750914B1 (ko) * | 2021-06-30 | 2025-01-09 | (주) 오로스테크놀로지 | 오버레이 마크 및 이를 이용한 오버레이 계측방법 및 반도체 디바이스 제조방법 |
| KR102440758B1 (ko) * | 2021-08-17 | 2022-09-06 | (주)오로스 테크놀로지 | 오버레이 마크 및 이를 이용한 오버레이 측정방법 및 반도체 소자의 제조방법 |
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| FR3128779B1 (fr) * | 2021-11-02 | 2024-03-01 | Commissariat Energie Atomique | Structure de metrologie |
| CN117546100B (zh) * | 2021-12-17 | 2025-05-02 | 科磊股份有限公司 | 用于改进目标置放准确度的叠加目标设计 |
| US12242202B2 (en) | 2022-01-04 | 2025-03-04 | Nanya Technology Corporation | Method for overlay error correction |
| US20230213872A1 (en) * | 2022-01-04 | 2023-07-06 | Nanya Technology Corporation | Mark for overlay measurement |
| WO2023136845A1 (en) * | 2022-01-13 | 2023-07-20 | Kla Corporation | Calibrated measurement of overlay error using small targets |
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| CN115145127B (zh) * | 2022-09-05 | 2022-11-25 | 上海传芯半导体有限公司 | 套刻精度的检测结构及其制备方法、套刻精度的检测方法 |
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| CN115729056A (zh) * | 2022-11-28 | 2023-03-03 | 合肥御微半导体技术有限公司 | 一种三维套刻标记和套刻误差测量设备测校方法 |
| KR102844370B1 (ko) | 2022-12-07 | 2025-08-08 | (주) 오로스테크놀로지 | 업샘플링을 이용한 오버레이 측정 방법 및 장치와, 이를 이용한 반도체 소자의 제조 방법 |
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| KR102580204B1 (ko) | 2023-03-02 | 2023-09-19 | (주)오로스 테크놀로지 | 1차원 오버레이 오차 측정을 위한 오버레이 마크, 이를 이용한 광학 수차 평가 방법, 이를 이용한 오버레이 마크 품질 평가 방법, 오버레이 측정 장치, 오버레이 측정 방법 및 반도체 소자의 제조방법 |
| KR20240150973A (ko) | 2023-04-10 | 2024-10-17 | (주) 오로스테크놀로지 | 광 결정 층을 구비하는 오버레이 마크, 이를 이용한 오버레이 측정 방법, 측정 장치 및 반도체 소자의 제조방법, 광 결정 층을 최적화하는 방법 |
| KR20240151522A (ko) | 2023-04-11 | 2024-10-18 | (주) 오로스테크놀로지 | 하이브리드 오버레이 마크, 이를 이용한 오버레이 측정 방법, 측정 장치 및 반도체 소자의 제조방법 |
| KR102750946B1 (ko) | 2023-04-19 | 2025-01-09 | (주) 오로스테크놀로지 | 이미지 획득 장치, 이미지 획득 방법 및 이미지 획득 장치 제어 프로그램 |
| KR102742571B1 (ko) | 2023-06-26 | 2024-12-16 | (주) 오로스테크놀로지 | 필터 조립체 및 이를 구비한 오버레이 측정 장치 |
| KR102864630B1 (ko) | 2023-06-26 | 2025-09-26 | (주) 오로스테크놀로지 | 오버레이 마크 이미지의 콘트라스트 향상을 위한 오버레이 측정 장치 및 오버레이 마크 이미지의 콘트라스트 향상을 위한 멀티 투과 축 편광요소의 최적화 방법 |
| KR102875280B1 (ko) | 2023-07-03 | 2025-10-23 | (주) 오로스테크놀로지 | 오버레이 마크 및 이를 이용한 오버레이 측정 장치, 오버레이 측정 방법 및 반도체 소자의 제조방법 |
| KR102673102B1 (ko) * | 2023-08-18 | 2024-06-07 | (주) 오로스테크놀로지 | 신호 형태 인덱스를 이용한 오버레이 마크 이미지 품질 측정 방법 및 장치와, 이를 이용한 오버레이 측정 장치의 측정 옵션들을 최적화하는 방법 |
| KR102750976B1 (ko) | 2023-09-25 | 2025-01-09 | (주) 오로스테크놀로지 | 오버레이 측정 장치, 툴-유도 시프트 측정을 위한 오버레이 측정 장치의 초점 제어 방법 및 툴-유도 시프트 측정을 위한 오버레이 측정 장치의 초점 제어 프로그램 |
| KR20250094141A (ko) | 2023-12-18 | 2025-06-25 | (주) 오로스테크놀로지 | 참조 패턴을 구비하는 오버레이 마크, 이를 이용한 오버레이 측정 방법, 측정 장치 및 반도체 소자의 제조방법 |
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- 2001-08-28 WO PCT/US2001/041932 patent/WO2002019415A1/en not_active Ceased
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