JP2016025161A - 放熱装置 - Google Patents
放熱装置 Download PDFInfo
- Publication number
- JP2016025161A JP2016025161A JP2014147210A JP2014147210A JP2016025161A JP 2016025161 A JP2016025161 A JP 2016025161A JP 2014147210 A JP2014147210 A JP 2014147210A JP 2014147210 A JP2014147210 A JP 2014147210A JP 2016025161 A JP2016025161 A JP 2016025161A
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- JP
- Japan
- Prior art keywords
- support
- heat dissipation
- semiconductor device
- switching element
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000017525 heat dissipation Effects 0.000 claims description 54
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 22
- 230000005855 radiation Effects 0.000 abstract description 10
- 239000002184 metal Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000014509 gene expression Effects 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014147210A JP2016025161A (ja) | 2014-07-17 | 2014-07-17 | 放熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014147210A JP2016025161A (ja) | 2014-07-17 | 2014-07-17 | 放熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016025161A true JP2016025161A (ja) | 2016-02-08 |
JP2016025161A5 JP2016025161A5 (enrdf_load_stackoverflow) | 2017-12-07 |
Family
ID=55271702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014147210A Pending JP2016025161A (ja) | 2014-07-17 | 2014-07-17 | 放熱装置 |
Country Status (1)
Country | Link |
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JP (1) | JP2016025161A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106385182A (zh) * | 2016-10-25 | 2017-02-08 | 华远电气股份有限公司 | 一种单管igbt用固定压块、组合及功率变频器 |
WO2021029105A1 (ja) * | 2019-08-09 | 2021-02-18 | Kyb株式会社 | 固定金具および電子部品ユニット |
CN113366931A (zh) * | 2018-12-11 | 2021-09-07 | 法雷奥电机设备公司 | 电压转换器和制造电压转换器的方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952636U (ja) * | 1982-09-29 | 1984-04-06 | 三菱電機株式会社 | 半導体素子の保持装置 |
JPH09283674A (ja) * | 1996-04-09 | 1997-10-31 | Yaskawa Electric Corp | 発熱素子の固定構造 |
JPH10189843A (ja) * | 1996-12-25 | 1998-07-21 | Ricoh Co Ltd | 電子部品押え金具 |
JP2006049466A (ja) * | 2004-08-03 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 電子部品の取付構造 |
JP2011192809A (ja) * | 2010-03-15 | 2011-09-29 | Omron Corp | パワーコンディショナー装置およびこの装置に使用するモジュール基板構造 |
JP2014016026A (ja) * | 2012-06-13 | 2014-01-30 | Toyota Industries Corp | 板ばねおよび放熱装置 |
-
2014
- 2014-07-17 JP JP2014147210A patent/JP2016025161A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952636U (ja) * | 1982-09-29 | 1984-04-06 | 三菱電機株式会社 | 半導体素子の保持装置 |
JPH09283674A (ja) * | 1996-04-09 | 1997-10-31 | Yaskawa Electric Corp | 発熱素子の固定構造 |
JPH10189843A (ja) * | 1996-12-25 | 1998-07-21 | Ricoh Co Ltd | 電子部品押え金具 |
JP2006049466A (ja) * | 2004-08-03 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 電子部品の取付構造 |
JP2011192809A (ja) * | 2010-03-15 | 2011-09-29 | Omron Corp | パワーコンディショナー装置およびこの装置に使用するモジュール基板構造 |
JP2014016026A (ja) * | 2012-06-13 | 2014-01-30 | Toyota Industries Corp | 板ばねおよび放熱装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106385182A (zh) * | 2016-10-25 | 2017-02-08 | 华远电气股份有限公司 | 一种单管igbt用固定压块、组合及功率变频器 |
CN113366931A (zh) * | 2018-12-11 | 2021-09-07 | 法雷奥电机设备公司 | 电压转换器和制造电压转换器的方法 |
WO2021029105A1 (ja) * | 2019-08-09 | 2021-02-18 | Kyb株式会社 | 固定金具および電子部品ユニット |
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