JP2016023999A - 半導体検査装置および半導体検査装置の制御方法 - Google Patents

半導体検査装置および半導体検査装置の制御方法 Download PDF

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Publication number
JP2016023999A
JP2016023999A JP2014147313A JP2014147313A JP2016023999A JP 2016023999 A JP2016023999 A JP 2016023999A JP 2014147313 A JP2014147313 A JP 2014147313A JP 2014147313 A JP2014147313 A JP 2014147313A JP 2016023999 A JP2016023999 A JP 2016023999A
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JP
Japan
Prior art keywords
signal
inspection
detector
level voltage
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014147313A
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English (en)
Japanese (ja)
Inventor
今川　健吾
Kengo Imagawa
健吾 今川
幕内　雅巳
Masami Makuuchi
雅巳 幕内
今井　栄治
Eiji Imai
栄治 今井
茂原　廉永
Yasunaga Mobara
廉永 茂原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2014147313A priority Critical patent/JP2016023999A/ja
Priority to PCT/JP2015/067108 priority patent/WO2016009763A1/fr
Publication of JP2016023999A publication Critical patent/JP2016023999A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2014147313A 2014-07-18 2014-07-18 半導体検査装置および半導体検査装置の制御方法 Pending JP2016023999A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014147313A JP2016023999A (ja) 2014-07-18 2014-07-18 半導体検査装置および半導体検査装置の制御方法
PCT/JP2015/067108 WO2016009763A1 (fr) 2014-07-18 2015-06-15 Dispositif d'inspection de semi-conducteurs et procédé de commande de dispositif d'inspection de semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014147313A JP2016023999A (ja) 2014-07-18 2014-07-18 半導体検査装置および半導体検査装置の制御方法

Publications (1)

Publication Number Publication Date
JP2016023999A true JP2016023999A (ja) 2016-02-08

Family

ID=55078264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014147313A Pending JP2016023999A (ja) 2014-07-18 2014-07-18 半導体検査装置および半導体検査装置の制御方法

Country Status (2)

Country Link
JP (1) JP2016023999A (fr)
WO (1) WO2016009763A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180126071A (ko) 2016-07-04 2018-11-26 가부시키가이샤 히다치 하이테크놀로지즈 검사 장치 및 검사 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109314937B (zh) * 2016-05-18 2021-11-30 瑞典爱立信有限公司 在网络节点中发送控制信息的方法，以及在无线设备中接收控制信息的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08152314A (ja) * 1994-11-29 1996-06-11 Hitachi Ltd 電子部品の検査装置
JP2003153084A (ja) * 2001-11-08 2003-05-23 Sony Corp 固体撮像素子の制御装置および制御方法
JP2007205828A (ja) * 2006-02-01 2007-08-16 Advanced Mask Inspection Technology Kk 光学画像取得装置、パターン検査装置、光学画像取得方法、及び、パターン検査方法
JP2010048587A (ja) * 2008-08-20 2010-03-04 Hitachi High-Technologies Corp パターン欠陥検査装置および方法
JP2012137350A (ja) * 2010-12-27 2012-07-19 Hitachi High-Technologies Corp 欠陥検査方法および欠陥検査装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180126071A (ko) 2016-07-04 2018-11-26 가부시키가이샤 히다치 하이테크놀로지즈 검사 장치 및 검사 방법
US10458924B2 (en) 2016-07-04 2019-10-29 Hitachi High-Technologies Corporation Inspection apparatus and inspection method

Also Published As

Publication number Publication date
WO2016009763A1 (fr) 2016-01-21

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