JP2016012713A - 樹脂フィルム、半導体装置および半導体装置の製造方法 - Google Patents

樹脂フィルム、半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP2016012713A
JP2016012713A JP2015004623A JP2015004623A JP2016012713A JP 2016012713 A JP2016012713 A JP 2016012713A JP 2015004623 A JP2015004623 A JP 2015004623A JP 2015004623 A JP2015004623 A JP 2015004623A JP 2016012713 A JP2016012713 A JP 2016012713A
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Japan
Prior art keywords
resin film
film layer
resin
resin layer
semiconductor device
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Pending
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JP2015004623A
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English (en)
Japanese (ja)
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JP2016012713A5 (https=
Inventor
眞行 美野
Masayuki Mino
眞行 美野
河野　務
Tsutomu Kono
務 河野
蔵渕　和彦
Kazuhiko Kurabuchi
和彦 蔵渕
宏治 濱口
Koji Hamaguchi
宏治 濱口
正也 鳥羽
Masaya Toba
正也 鳥羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
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Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2015004623A priority Critical patent/JP2016012713A/ja
Publication of JP2016012713A publication Critical patent/JP2016012713A/ja
Publication of JP2016012713A5 publication Critical patent/JP2016012713A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates

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  • Laminated Bodies (AREA)
  • Sealing Material Composition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2015004623A 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法 Pending JP2016012713A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015004623A JP2016012713A (ja) 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014116766 2014-06-05
JP2014116766 2014-06-05
JP2015004623A JP2016012713A (ja) 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2016012713A true JP2016012713A (ja) 2016-01-21
JP2016012713A5 JP2016012713A5 (https=) 2017-04-13

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JP2015004623A Pending JP2016012713A (ja) 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2016012713A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017117842A (ja) * 2015-12-21 2017-06-29 京セラ株式会社 電子部品及び電子部品の製造方法
WO2018181761A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 封止フィルム、電子部品装置の製造方法及び電子部品装置
JP2020068237A (ja) * 2018-10-22 2020-04-30 新光電気工業株式会社 配線基板
CN111370337A (zh) * 2020-03-18 2020-07-03 深圳杰微芯片科技有限公司 降低封装翘曲方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823005A (ja) * 1993-09-14 1996-01-23 Toshiba Corp 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2011187877A (ja) * 2010-03-11 2011-09-22 Panasonic Corp 半導体装置及びその製造方法
JP2014056924A (ja) * 2012-09-12 2014-03-27 Hitachi Chemical Co Ltd 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれらにより得られる半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823005A (ja) * 1993-09-14 1996-01-23 Toshiba Corp 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2011187877A (ja) * 2010-03-11 2011-09-22 Panasonic Corp 半導体装置及びその製造方法
JP2014056924A (ja) * 2012-09-12 2014-03-27 Hitachi Chemical Co Ltd 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれらにより得られる半導体装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017117842A (ja) * 2015-12-21 2017-06-29 京セラ株式会社 電子部品及び電子部品の製造方法
WO2018181761A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 封止フィルム、電子部品装置の製造方法及び電子部品装置
CN110462818A (zh) * 2017-03-31 2019-11-15 日立化成株式会社 密封膜、电子部件装置的制造方法及电子部件装置
KR20190132401A (ko) * 2017-03-31 2019-11-27 히타치가세이가부시끼가이샤 봉지 필름, 전자 부품 장치의 제조 방법 및 전자 부품 장치
JPWO2018181761A1 (ja) * 2017-03-31 2020-02-20 日立化成株式会社 封止フィルム、電子部品装置の製造方法及び電子部品装置
JP7115469B2 (ja) 2017-03-31 2022-08-09 昭和電工マテリアルズ株式会社 封止フィルム、電子部品装置の製造方法及び電子部品装置
KR102440947B1 (ko) * 2017-03-31 2022-09-05 쇼와덴코머티리얼즈가부시끼가이샤 봉지 필름, 전자 부품 장치의 제조 방법 및 전자 부품 장치
CN110462818B (zh) * 2017-03-31 2023-12-26 株式会社力森诺科 密封膜、电子部件装置的制造方法及电子部件装置
JP2020068237A (ja) * 2018-10-22 2020-04-30 新光電気工業株式会社 配線基板
JP7211757B2 (ja) 2018-10-22 2023-01-24 新光電気工業株式会社 配線基板
CN111370337A (zh) * 2020-03-18 2020-07-03 深圳杰微芯片科技有限公司 降低封装翘曲方法

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