JP2015535881A - 透明導電膜およびその製造方法{transparentconductivefilmandmethodforpreparingthesame} - Google Patents
透明導電膜およびその製造方法{transparentconductivefilmandmethodforpreparingthesame} Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 46
- 239000000126 substance Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000010408 film Substances 0.000 claims description 48
- 239000002019 doping agent Substances 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 20
- 229910052733 gallium Inorganic materials 0.000 claims description 14
- 229910052738 indium Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052765 Lutetium Inorganic materials 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052727 yttrium Inorganic materials 0.000 claims description 5
- 229910052691 Erbium Inorganic materials 0.000 claims description 4
- 229910052775 Thulium Inorganic materials 0.000 claims description 4
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 239000000463 material Substances 0.000 description 17
- 239000013078 crystal Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229910006404 SnO 2 Inorganic materials 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005693 optoelectronics Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000000306 component Substances 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000003775 Density Functional Theory Methods 0.000 description 2
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003574 free electron Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- -1 Zn (II) Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical group [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- C01G15/00—Compounds of gallium, indium or thallium
- C01G15/006—Compounds containing, besides gallium, indium, or thallium, two or more other elements, with the exception of oxygen or hydrogen
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Abstract
Description
本出願は透明導電膜およびその製造方法に関する。
下記化学式1で表され、結晶質構造を有する化合物を含む透明導電膜を提供する。
[化学式1]
[(RpXq)O3]m(AO)n
前記化学式1において、
RはSc、Fe、Cu、Ga、Y、In、Er、Tm、YbまたはLuであり、
XはIn、Ga、AlまたはFeであり、
AはMg、Mn、CoまたはZnであり、
mは1〜4であり、
nは1〜7であり、
pおよびqは原子含量比として、各々独立して0超過1以下である。
基板上に、前記化学式1で表され、結晶質構造を有する化合物を形成するステップを含む透明導電膜の製造方法を提供する。
前記透明導電膜を含む電子素子を提供する。
前記透明導電膜を含む薄膜トランジスタを提供する。
本出願は、LCD、PDPのようなフラットパネル型ディスプレイ産業は勿論のこと、次世代フレキシブルデバイス、透明AMOLED、OLED照明、太陽電池などに適用することができる。
[(RpXq)O3]m(AO)n
前記化学式1において、
RはSc、Fe、Cu、Ga、Y、In、Er、Tm、YbまたはLuであり、
XはIn、Ga、AlまたはFeであり、
AはMg、Mn、CoまたはZnであり、
mは1〜4であり、
nは1〜7であり、
pおよびqは原子含量比として、各々独立して0超過1以下である。
前記化学式1において、RおよびXは互いに異なる物質を含むことが好ましい。
結晶構造:トリゴナル(Trigonal) R3m
格子定数:a=3.4185Å、c=25.463Å
結晶構造:ヘキサゴナル(Hexagonal) P63/mmc
格子定数:a=3.3406Å、c=32.51Å
結晶構造:トリゴナル(Trigonal) R3m
格子定数:a=3.3291Å、c=56.56Å
結晶構造:ヘキサゴナル(Hexagonal) P63/mmc
格子定数:a=3.3220Å、c=42.91Å
InAlO3(ZnO)4またはInGaO3(ZnO)4を含む導電膜を50nmの厚さに製造した。DC/RFマグネトロンスパッタリング蒸着機を取り付けたロールツーロール(Roll−to−Roll)プロセスを適用した。チャンバーシステムの真空度は平常時に10−5torrを維持した。In2O3、Al2O3、ZnO、Ga2O3スパッタターゲット(1,600×125mm2、〜3.5KW power適用)が各々蒸着機に付着しており、プラスチック基材(eg.幅1,050mmのPET、PC)から70〜75mm離隔している。O2気体をさらに注入し、蒸着時に不足した酸素源を供給した。これを通じて定性比を備えたInAlO3(ZnO)4とInGaO3(ZnO)4透明導電膜を得た。
Claims (20)
- 下記化学式1で表され、結晶質構造を有する化合物を含む透明導電膜:
[化学式1]
[(RpXq)O3]m(AO)n
前記化学式1において、
RはSc、Fe、Cu、Ga、Y、In、Er、Tm、YbまたはLuであり、
XはIn、Ga、AlまたはFeであり、
AはMg、Mn、CoまたはZnであり、
mは1〜4であり、
nは1〜7であり、
pおよびqは原子含量比として、各々独立して0超過1以下である。 - 前記化学式1のXは、Al、GaまたはFeである請求項1に記載の透明導電膜。
- 前記化学式1のRは、InまたはLuである請求項1または請求項2に記載の透明導電膜。
- 前記化学式1で表される化合物はInAlO3(ZnO)n、InGaO3(ZnO)nまたはLuFeO3(ZnO)nであり、nは1〜7である請求項1から請求項3のいずれか一項に記載の透明導電膜。
- 前記化学式1で表される化合物は、n−型ドーパントがさらにドーピングされた化合物である請求項1から請求項4のいずれか一項に記載の透明導電膜。
- 前記n−型ドーパントは、Sn、GeおよびMoからなる群から選択される1種以上を含む請求項5に記載の透明導電膜。
- 前記化学式1で表される化合物は、p−型ドーパントがさらにドーピングされた化合物である請求項1から請求項6のいずれか一項に記載の透明導電膜。
- 前記p−型ドーパントは、窒素原子である請求項7に記載の透明導電膜。
- 基板上に、下記化学式1で表され、結晶質構造を有する化合物を形成するステップを含む透明導電膜の製造方法:
[化学式1]
[(RpXq)O3]m(AO)n
前記化学式1において、
RはSc、Fe、Cu、Ga、Y、In、Er、Tm、YbまたはLuであり、
XはIn、Ga、AlまたはFeであり、
AはMg、Mn、CoまたはZnであり、
mは1〜4であり、
nは1〜7であり、
pおよびqは原子含量比として、各々独立して0超過1以下である。 - 前記化学式1で表される化合物を形成するステップは、DC/RFマグネトロンスパッタリング法または分子ビームエピタキシー法(molecular beam epitaxy)を利用する請求項9に記載の透明導電膜の製造方法。
- 前記化学式1で表される化合物はInAlO3(ZnO)n、InGaO3(ZnO)nまたはLuFeO3(ZnO)nであり、nは1〜7である請求項9または請求項10に記載の透明導電膜の製造方法。
- 前記化学式1で表される化合物は、n−型ドーパントがさらにドーピングされた化合物である請求項9から請求項11のいずれか一項に記載の透明導電膜の製造方法。
- 前記化学式1で表される化合物は、p−型ドーパントがさらにドーピングされた化合物である請求項9から請求項12のいずれか一項に記載の透明導電膜の製造方法。
- 請求項1から請求項8のいずれか一項に記載の透明導電膜を含む電子素子。
- 請求項1から請求項8のいずれか一項に記載の透明導電膜を含む薄膜トランジスタ。
- 前記薄膜トランジスタは、基板上にゲート電極、ゲート絶縁層、活性層、ソース電極およびドレイン電極を含み、
前記ゲート電極、前記ゲート絶縁層、前記活性層、前記ソース電極および前記ドレイン電極は、前記化学式1で表される化合物を含むか、または、前記化学式1で表される化合物にn−型ドーパントまたはp−型ドーパントがさらにドーピングされた化合物を含む請求項15に記載の薄膜トランジスタ。 - 前記ゲート電極は、InAlSnO3(ZnO)4を含む請求項16に記載の薄膜トランジスタ。
- 前記ゲート絶縁層は、InGaO3(ZnO)4を含む請求項16または請求項17に記載の薄膜トランジスタ。
- 前記活性層は第1活性層および第2活性層を含み、
前記第1活性層はInGaO3(ZnO)4:Nを含み、
前記第2活性層はInAlO3(ZnO)4:Nを含む請求項16から請求項18のいずれか一項に記載の薄膜トランジスタ。 - 前記ソース電極および前記ドレイン電極は、InAlSnO3(ZnO)4を含む請求項16から請求項19のいずれか一項に記載の薄膜トランジスタ。
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