JP2015532531A5 - - Google Patents
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- Publication number
- JP2015532531A5 JP2015532531A5 JP2015534593A JP2015534593A JP2015532531A5 JP 2015532531 A5 JP2015532531 A5 JP 2015532531A5 JP 2015534593 A JP2015534593 A JP 2015534593A JP 2015534593 A JP2015534593 A JP 2015534593A JP 2015532531 A5 JP2015532531 A5 JP 2015532531A5
- Authority
- JP
- Japan
- Prior art keywords
- management assembly
- substrate
- thermal management
- thermal
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 17
- 229910021389 graphene Inorganic materials 0.000 claims 15
- 239000000463 material Substances 0.000 claims 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 230000008878 coupling Effects 0.000 claims 6
- 238000010168 coupling process Methods 0.000 claims 6
- 238000005859 coupling reaction Methods 0.000 claims 6
- 229910002804 graphite Inorganic materials 0.000 claims 4
- 239000010439 graphite Substances 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 230000020169 heat generation Effects 0.000 claims 3
- 229910052742 iron Inorganic materials 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- 229910052718 tin Inorganic materials 0.000 claims 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910052790 beryllium Inorganic materials 0.000 claims 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 239000011733 molybdenum Substances 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261705362P | 2012-09-25 | 2012-09-25 | |
| US61/705,362 | 2012-09-25 | ||
| PCT/US2013/061335 WO2014052282A1 (en) | 2012-09-25 | 2013-09-24 | Thermal management assembly comprising bulk graphene material |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015532531A JP2015532531A (ja) | 2015-11-09 |
| JP2015532531A5 true JP2015532531A5 (enExample) | 2016-11-10 |
| JP6529433B2 JP6529433B2 (ja) | 2019-06-12 |
Family
ID=50388897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015534593A Active JP6529433B2 (ja) | 2012-09-25 | 2013-09-24 | バルクグラフェン材料を含む熱管理アセンブリ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11105567B2 (enExample) |
| EP (1) | EP2901826B1 (enExample) |
| JP (1) | JP6529433B2 (enExample) |
| CN (1) | CN104813751B (enExample) |
| WO (1) | WO2014052282A1 (enExample) |
Families Citing this family (50)
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|---|---|---|---|---|
| US9634214B2 (en) * | 2012-11-05 | 2017-04-25 | Ledengin, Inc. | Graphite-containing substrates for LED packages |
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| KR102374256B1 (ko) * | 2015-02-23 | 2022-03-15 | 삼성전기주식회사 | 회로기판 및 회로기판 제조방법 |
| EP3295081B1 (en) * | 2015-05-15 | 2020-07-08 | Momentive Performance Materials Inc. | Light emitting diode assembly using thermal pyrolytic graphite for thermal management |
| CN107686699B (zh) * | 2016-08-05 | 2021-07-16 | 中兴通讯股份有限公司 | 导热界面材料和导热界面材料制备方法 |
| US10139168B2 (en) * | 2016-09-26 | 2018-11-27 | International Business Machines Corporation | Cold plate with radial expanding channels for two-phase cooling |
| WO2018117232A1 (ja) * | 2016-12-22 | 2018-06-28 | 京セラ株式会社 | 電子素子搭載用基板、電子装置および電子モジュール |
| EP3352213B1 (en) * | 2017-01-23 | 2021-10-06 | ABB Power Grids Switzerland AG | Semiconductor power module comprising graphene |
| JP6754973B2 (ja) * | 2017-02-02 | 2020-09-16 | パナソニックＩｐマネジメント株式会社 | グラファイト放熱板 |
| KR102469901B1 (ko) * | 2017-04-07 | 2022-11-22 | 에스케이넥실리스 주식회사 | 동박이 적층된 그라파이트 방열 필름 |
| KR20190003186A (ko) * | 2017-06-30 | 2019-01-09 | 주식회사 솔루에타 | 고방열 박막 및 그 제조 방법 |
| US10455736B2 (en) | 2017-07-21 | 2019-10-22 | Raytheon Company | Reduced cost and schedule manufacturing of graphene paper based thermal straps/harnesses |
| WO2019098377A1 (ja) * | 2017-11-20 | 2019-05-23 | 富士通化成株式会社 | 複合伝熱部材、及び複合伝熱部材の製造方法 |
| EP3488999B1 (en) * | 2017-11-24 | 2023-03-08 | Airbus Operations, S.L. | Joining method for thermoplastic elements |
| US11476399B2 (en) * | 2017-11-29 | 2022-10-18 | Panasonic Intellectual Property Management Co., Ltd. | Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device |
| JP7108907B2 (ja) * | 2017-11-29 | 2022-07-29 | パナソニックＩｐマネジメント株式会社 | 接合材、該接合材を用いた半導体装置の製造方法、及び、半導体装置 |
| CN117096105A (zh) * | 2018-01-30 | 2023-11-21 | 京瓷株式会社 | 电子元件搭载用基板、电子装置以及电子模块 |
| DE102018102600A1 (de) * | 2018-02-06 | 2019-08-08 | Tdk Electronics Ag | Temperatursensor |
| US11152279B2 (en) * | 2018-03-26 | 2021-10-19 | Raytheon Company | Monolithic microwave integrated circuit (MMIC) cooling structure |
| US20190301814A1 (en) * | 2018-04-03 | 2019-10-03 | Nanotek Instruments, Inc. | Metallized graphene foam having high through-plane conductivity |
| EP3850662B1 (en) * | 2018-09-14 | 2023-05-17 | Raytheon Company | Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices |
| KR102600004B1 (ko) * | 2018-12-26 | 2023-11-08 | 삼성전자주식회사 | 반도체 패키지 |
| CN110004442A (zh) * | 2018-12-27 | 2019-07-12 | 岑对凤 | 一种超导复合板及其制造方法 |
| CN113308658B (zh) * | 2019-01-30 | 2022-12-27 | 浙江华达新型材料股份有限公司 | 表面带双镀涂层的钢板 |
| CN110602871B (zh) * | 2019-09-16 | 2021-10-01 | 沪士电子股份有限公司 | 一种石墨烯导热pcb及其制备方法 |
| WO2021090759A1 (ja) * | 2019-11-05 | 2021-05-14 | 三菱マテリアル株式会社 | グラフェン含有炭素質部材／セラミックス接合体、および、銅／グラフェン含有炭素質部材／セラミックス接合体 |
| JP7533124B2 (ja) * | 2019-11-05 | 2024-08-14 | 三菱マテリアル株式会社 | グラフェン含有炭素質部材／セラミックス接合体、および、銅／グラフェン含有炭素質部材／セラミックス接合体 |
| WO2021106904A1 (ja) * | 2019-11-25 | 2021-06-03 | 三菱マテリアル株式会社 | グラフェン接合体 |
| JP7563124B2 (ja) * | 2019-11-25 | 2024-10-08 | 三菱マテリアル株式会社 | グラフェン接合体 |
| CN115004361A (zh) * | 2020-01-24 | 2022-09-02 | 三菱综合材料株式会社 | 铜-石墨烯接合体及其制造方法以及铜-石墨烯接合结构 |
| JP6947318B2 (ja) * | 2020-01-24 | 2021-10-13 | 三菱マテリアル株式会社 | 銅／グラフェン接合体とその製造方法、および銅／グラフェン接合構造 |
| US11032947B1 (en) * | 2020-02-17 | 2021-06-08 | Raytheon Company | Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones |
| CN112543580B (zh) * | 2020-11-17 | 2022-04-15 | 河北北方学院 | 一种高导热石墨烯-金属铜复合层散热器的生产工艺 |
| CN112693636A (zh) * | 2020-12-28 | 2021-04-23 | 上海卫星工程研究所 | 一种星用轻量化热控装置及其制作方法 |
| TWI833063B (zh) * | 2021-01-27 | 2024-02-21 | 大陸商河南烯力新材料科技有限公司 | 導熱結構與電子裝置 |
| US12163228B2 (en) | 2021-05-18 | 2024-12-10 | Mellanox Technologies, Ltd. | CVD system with substrate carrier and associated mechanisms for moving substrate therethrough |
| US12221695B2 (en) | 2021-05-18 | 2025-02-11 | Mellanox Technologies, Ltd. | CVD system with flange assembly for facilitating uniform and laminar flow |
| US12004308B2 (en) * | 2021-05-18 | 2024-06-04 | Mellanox Technologies, Ltd. | Process for laminating graphene-coated printed circuit boards |
| US12289839B2 (en) | 2021-05-18 | 2025-04-29 | Mellanox Technologies, Ltd. | Process for localized repair of graphene-coated lamination stacks and printed circuit boards |
| US11963309B2 (en) | 2021-05-18 | 2024-04-16 | Mellanox Technologies, Ltd. | Process for laminating conductive-lubricant coated metals for printed circuit boards |
| JP2023006510A (ja) | 2021-06-30 | 2023-01-18 | 日亜化学工業株式会社 | 発光モジュール、車両用灯具、及び、放熱部材 |
| CN116940053A (zh) * | 2022-04-08 | 2023-10-24 | 西安聚变材料科技有限公司 | 一种高导方向和横纵导热率可自定义的碳系封装热管理组件及其制作方法 |
| TWI880098B (zh) * | 2022-07-01 | 2025-04-11 | 長庚大學 | 一種具有石墨烯與銅的散熱結構及其形成的方法 |
| US11849536B1 (en) | 2022-10-12 | 2023-12-19 | Lunar Energy, Inc. | Gantry for thermal management |
| US11997812B2 (en) | 2022-10-12 | 2024-05-28 | Lunar Energy, Inc. | Cover for sealing a power module |
| US11889662B1 (en) * | 2022-10-12 | 2024-01-30 | Lunar Energy, Inc. | Thermal interface sandwich |
| CN118354563A (zh) * | 2023-01-13 | 2024-07-16 | 华为技术有限公司 | 石墨烯板材、制备方法、散热模组及电子设备 |
| CN115799974B (zh) * | 2023-02-07 | 2023-05-26 | 度亘激光技术（苏州）有限公司 | 一种导热结构及其制备方法、间接导热结构 |
| TW202518627A (zh) * | 2023-06-23 | 2025-05-01 | 美商摩曼帝夫特性石英材料公司 | 用於與熱管理整合的熱整平器坯料及熱整平器的成型方法 |
| WO2025008052A1 (en) * | 2023-07-04 | 2025-01-09 | Huawei Technologies Co., Ltd. | Heat transfer device for an electronic device |
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-
2013
- 2013-09-24 WO PCT/US2013/061335 patent/WO2014052282A1/en not_active Ceased
- 2013-09-24 EP EP13840941.2A patent/EP2901826B1/en active Active
- 2013-09-24 CN CN201380061372.9A patent/CN104813751B/zh active Active
- 2013-09-24 US US14/431,123 patent/US11105567B2/en active Active
- 2013-09-24 JP JP2015534593A patent/JP6529433B2/ja active Active
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