JP2015528388A - 供給した堆積物を校正する方法及び装置 - Google Patents

供給した堆積物を校正する方法及び装置 Download PDF

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Publication number
JP2015528388A
JP2015528388A JP2015530009A JP2015530009A JP2015528388A JP 2015528388 A JP2015528388 A JP 2015528388A JP 2015530009 A JP2015530009 A JP 2015530009A JP 2015530009 A JP2015530009 A JP 2015530009A JP 2015528388 A JP2015528388 A JP 2015528388A
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Japan
Prior art keywords
dispenser
line width
average line
adjusting
supplied
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Pending
Application number
JP2015530009A
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English (en)
Japanese (ja)
Other versions
JP2015528388A5 (enExample
Inventor
ジョエル ブルーム ジョナサン
ジョエル ブルーム ジョナサン
カベティ サティシュ
カベティ サティシュ
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
イリノイ トゥール ワークス インコーポレイティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イリノイ トゥール ワークス インコーポレイティド, イリノイ トゥール ワークス インコーポレイティド filed Critical イリノイ トゥール ワークス インコーポレイティド
Publication of JP2015528388A publication Critical patent/JP2015528388A/ja
Publication of JP2015528388A5 publication Critical patent/JP2015528388A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2015530009A 2012-08-30 2013-08-28 供給した堆積物を校正する方法及び装置 Pending JP2015528388A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/598,719 US20140060144A1 (en) 2012-08-30 2012-08-30 Method and apparatus for calibrating dispensed deposits
US13/598,719 2012-08-30
PCT/US2013/057152 WO2014036185A1 (en) 2012-08-30 2013-08-28 Method and apparatus for calibrating dispensed deposits

Publications (2)

Publication Number Publication Date
JP2015528388A true JP2015528388A (ja) 2015-09-28
JP2015528388A5 JP2015528388A5 (enExample) 2016-10-20

Family

ID=49209530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015530009A Pending JP2015528388A (ja) 2012-08-30 2013-08-28 供給した堆積物を校正する方法及び装置

Country Status (8)

Country Link
US (1) US20140060144A1 (enExample)
EP (1) EP2891391A1 (enExample)
JP (1) JP2015528388A (enExample)
KR (1) KR20150052043A (enExample)
CN (1) CN104620685A (enExample)
PH (1) PH12015500029A1 (enExample)
TW (1) TW201410333A (enExample)
WO (1) WO2014036185A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019520205A (ja) * 2016-06-20 2019-07-18 ノードソン コーポレーションＮｏｒｄｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ 基材に液体コーティングを塗布する方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3700680A1 (en) 2017-10-27 2020-09-02 Nordson Corporation Systems and methods for closed loop fluid velocity control for jetting
US11246249B2 (en) 2020-04-15 2022-02-08 Illinois Tool Works Inc. Tilt and rotate dispenser having strain wave gear system
US11805634B2 (en) * 2021-08-03 2023-10-31 Illinois Tool Works Inc. Tilt and rotate dispenser having motion control
US11904337B2 (en) 2021-08-03 2024-02-20 Illinois Tool Works Inc. Tilt and rotate dispenser having material flow rate control
US12468285B2 (en) 2023-03-08 2025-11-11 Illinois Tool Works Inc. Intersect command vision locating system and method
US12226795B2 (en) 2023-04-14 2025-02-18 Illinois Tool Works Inc. Dispense volume adjustment based on gap width of located features

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173102A (ja) * 1987-01-13 1988-07-16 Hitachi Ltd 加工品質管理方法及び装置
US20030209560A1 (en) * 2002-05-10 2003-11-13 Asm Assembly Automation Ltd Dispensation of controlled quantities of material onto a substrate
JP2011212526A (ja) * 2010-03-31 2011-10-27 Nec Corp 塗布圧力制御装置、方法及びプログラム並びにこれを用いた塗布装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769551A (en) * 1986-06-27 1988-09-06 Nippon Kogaku K.K. Pattern detecting apparatus utilizing energy beam
US5819983A (en) 1995-11-22 1998-10-13 Camelot Sysems, Inc. Liquid dispensing system with sealing augering screw and method for dispensing
US6173864B1 (en) * 1999-04-23 2001-01-16 Nordson Corporation Viscous material dispensing system and method with feedback control
JP2002040342A (ja) * 2000-07-24 2002-02-06 Ricoh Co Ltd 光走査装置・光走査方法および画像形成装置
US7264323B2 (en) * 2002-11-22 2007-09-04 Codonics, Inc. Achieving laser-quality medical hardcopy output from thermal print devices
JP3887337B2 (ja) * 2003-03-25 2007-02-28 株式会社東芝 配線部材およびその製造方法
US7980197B2 (en) 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US8059915B2 (en) * 2006-11-20 2011-11-15 Videosurf, Inc. Apparatus for and method of robust motion estimation using line averages
US7524015B2 (en) * 2006-12-20 2009-04-28 Palo Alto Research Center Incorporated Method of printing smooth micro-scale features
TWI323189B (en) * 2006-12-29 2010-04-11 Ind Tech Res Inst Real-time dispenser fault detection and classification method
JP5204451B2 (ja) * 2007-09-28 2013-06-05 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法
JP2010067674A (ja) * 2008-09-09 2010-03-25 Toray Ind Inc 金属積層基板の製造方法及びそれにより得られる金属積層基板
US9221984B2 (en) * 2010-07-16 2015-12-29 E I Du Pont De Nemours And Company Cross-linked pigment dispersion based on polyurethane dispersants
US8458626B1 (en) * 2012-01-20 2013-06-04 International Business Machines Corporation Method for calibrating an SRAF printing model
US9057642B2 (en) * 2012-12-03 2015-06-16 Illinois Tool Works Inc. Method and apparatus for calibrating a dispenser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173102A (ja) * 1987-01-13 1988-07-16 Hitachi Ltd 加工品質管理方法及び装置
US20030209560A1 (en) * 2002-05-10 2003-11-13 Asm Assembly Automation Ltd Dispensation of controlled quantities of material onto a substrate
JP2011212526A (ja) * 2010-03-31 2011-10-27 Nec Corp 塗布圧力制御装置、方法及びプログラム並びにこれを用いた塗布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019520205A (ja) * 2016-06-20 2019-07-18 ノードソン コーポレーションＮｏｒｄｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ 基材に液体コーティングを塗布する方法

Also Published As

Publication number Publication date
EP2891391A1 (en) 2015-07-08
TW201410333A (zh) 2014-03-16
CN104620685A (zh) 2015-05-13
US20140060144A1 (en) 2014-03-06
WO2014036185A1 (en) 2014-03-06
PH12015500029A1 (en) 2015-02-23
KR20150052043A (ko) 2015-05-13

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