TW201410333A - 用於校準配給的沉積之方法及裝置 - Google Patents

用於校準配給的沉積之方法及裝置 Download PDF

Info

Publication number
TW201410333A
TW201410333A TW102130867A TW102130867A TW201410333A TW 201410333 A TW201410333 A TW 201410333A TW 102130867 A TW102130867 A TW 102130867A TW 102130867 A TW102130867 A TW 102130867A TW 201410333 A TW201410333 A TW 201410333A
Authority
TW
Taiwan
Prior art keywords
line width
baseline
dispenser
controller
average line
Prior art date
Application number
TW102130867A
Other languages
English (en)
Chinese (zh)
Inventor
Jonathan Joel Bloom
Satish Kaveti
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Publication of TW201410333A publication Critical patent/TW201410333A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW102130867A 2012-08-30 2013-08-28 用於校準配給的沉積之方法及裝置 TW201410333A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/598,719 US20140060144A1 (en) 2012-08-30 2012-08-30 Method and apparatus for calibrating dispensed deposits

Publications (1)

Publication Number Publication Date
TW201410333A true TW201410333A (zh) 2014-03-16

Family

ID=49209530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102130867A TW201410333A (zh) 2012-08-30 2013-08-28 用於校準配給的沉積之方法及裝置

Country Status (8)

Country Link
US (1) US20140060144A1 (enExample)
EP (1) EP2891391A1 (enExample)
JP (1) JP2015528388A (enExample)
KR (1) KR20150052043A (enExample)
CN (1) CN104620685A (enExample)
PH (1) PH12015500029A1 (enExample)
TW (1) TW201410333A (enExample)
WO (1) WO2014036185A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9789497B1 (en) * 2016-06-20 2017-10-17 Nordson Corporation Systems and methods for applying a liquid coating to a substrate
US11504736B2 (en) 2017-10-27 2022-11-22 Nordson Corporation Systems and methods for closed loop fluid velocity control for jetting
CN114585450A (zh) 2019-10-14 2022-06-03 3M创新有限公司 使用线性建模和优化的自动化液体粘合剂分配
US11246249B2 (en) 2020-04-15 2022-02-08 Illinois Tool Works Inc. Tilt and rotate dispenser having strain wave gear system
US11904337B2 (en) 2021-08-03 2024-02-20 Illinois Tool Works Inc. Tilt and rotate dispenser having material flow rate control
US11805634B2 (en) * 2021-08-03 2023-10-31 Illinois Tool Works Inc. Tilt and rotate dispenser having motion control
US12468285B2 (en) 2023-03-08 2025-11-11 Illinois Tool Works Inc. Intersect command vision locating system and method
US12226795B2 (en) 2023-04-14 2025-02-18 Illinois Tool Works Inc. Dispense volume adjustment based on gap width of located features

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769551A (en) * 1986-06-27 1988-09-06 Nippon Kogaku K.K. Pattern detecting apparatus utilizing energy beam
JP2716052B2 (ja) * 1987-01-13 1998-02-18 株式会社日立製作所 加工方法及び装置並びに加工品質管理方法
US5819983A (en) 1995-11-22 1998-10-13 Camelot Sysems, Inc. Liquid dispensing system with sealing augering screw and method for dispensing
US6173864B1 (en) * 1999-04-23 2001-01-16 Nordson Corporation Viscous material dispensing system and method with feedback control
JP2002040342A (ja) * 2000-07-24 2002-02-06 Ricoh Co Ltd 光走査装置・光走査方法および画像形成装置
US6991825B2 (en) * 2002-05-10 2006-01-31 Asm Assembly Automation Ltd. Dispensation of controlled quantities of material onto a substrate
US7264323B2 (en) * 2002-11-22 2007-09-04 Codonics, Inc. Achieving laser-quality medical hardcopy output from thermal print devices
JP3887337B2 (ja) * 2003-03-25 2007-02-28 株式会社東芝 配線部材およびその製造方法
US7980197B2 (en) 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US8059915B2 (en) * 2006-11-20 2011-11-15 Videosurf, Inc. Apparatus for and method of robust motion estimation using line averages
US7524015B2 (en) * 2006-12-20 2009-04-28 Palo Alto Research Center Incorporated Method of printing smooth micro-scale features
TWI323189B (en) * 2006-12-29 2010-04-11 Ind Tech Res Inst Real-time dispenser fault detection and classification method
JP5204451B2 (ja) * 2007-09-28 2013-06-05 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法
JP2010067674A (ja) * 2008-09-09 2010-03-25 Toray Ind Inc 金属積層基板の製造方法及びそれにより得られる金属積層基板
JP5651981B2 (ja) * 2010-03-31 2015-01-14 日本電気株式会社 塗布圧力制御装置、方法及びプログラム並びにこれを用いた塗布装置
EP2593517B1 (en) * 2010-07-16 2017-04-05 E. I. du Pont de Nemours and Company Cross-linked pigment dispersion based on polyurethane dispersants
US8458626B1 (en) * 2012-01-20 2013-06-04 International Business Machines Corporation Method for calibrating an SRAF printing model
US9057642B2 (en) * 2012-12-03 2015-06-16 Illinois Tool Works Inc. Method and apparatus for calibrating a dispenser

Also Published As

Publication number Publication date
JP2015528388A (ja) 2015-09-28
CN104620685A (zh) 2015-05-13
WO2014036185A1 (en) 2014-03-06
PH12015500029A1 (en) 2015-02-23
KR20150052043A (ko) 2015-05-13
US20140060144A1 (en) 2014-03-06
EP2891391A1 (en) 2015-07-08

Similar Documents

Publication Publication Date Title
US20140060144A1 (en) Method and apparatus for calibrating dispensed deposits
CN104685974B (zh) 依据边缘检测而分配材料的方法
KR102195227B1 (ko) 디스펜서를 캘리브레이팅하는 방법 및 장치
US20140093638A1 (en) Method of dispensing material based on angular locate feature
US10926287B2 (en) Method of calibrating a dispenser
US11805634B2 (en) Tilt and rotate dispenser having motion control
CN118044347A (zh) 具有材料流率控制的倾斜和旋转分配器
CN109513574A (zh) 一种点胶机的点胶方法
KR20260002917A (ko) 위치 특정된 피처의 간극 폭에 기초한 분배 용적 조절