TW201410333A - 用於校準配給的沉積之方法及裝置 - Google Patents
用於校準配給的沉積之方法及裝置 Download PDFInfo
- Publication number
- TW201410333A TW201410333A TW102130867A TW102130867A TW201410333A TW 201410333 A TW201410333 A TW 201410333A TW 102130867 A TW102130867 A TW 102130867A TW 102130867 A TW102130867 A TW 102130867A TW 201410333 A TW201410333 A TW 201410333A
- Authority
- TW
- Taiwan
- Prior art keywords
- line width
- baseline
- dispenser
- controller
- average line
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 7
- 238000005259 measurement Methods 0.000 description 13
- 230000006870 function Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000011345 viscous material Substances 0.000 description 10
- 238000003384 imaging method Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007947 dispensing tablet Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012850 fabricated material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/598,719 US20140060144A1 (en) | 2012-08-30 | 2012-08-30 | Method and apparatus for calibrating dispensed deposits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201410333A true TW201410333A (zh) | 2014-03-16 |
Family
ID=49209530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102130867A TW201410333A (zh) | 2012-08-30 | 2013-08-28 | 用於校準配給的沉積之方法及裝置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140060144A1 (enExample) |
| EP (1) | EP2891391A1 (enExample) |
| JP (1) | JP2015528388A (enExample) |
| KR (1) | KR20150052043A (enExample) |
| CN (1) | CN104620685A (enExample) |
| PH (1) | PH12015500029A1 (enExample) |
| TW (1) | TW201410333A (enExample) |
| WO (1) | WO2014036185A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9789497B1 (en) * | 2016-06-20 | 2017-10-17 | Nordson Corporation | Systems and methods for applying a liquid coating to a substrate |
| WO2019084348A1 (en) * | 2017-10-27 | 2019-05-02 | Nordson Corporation | SYSTEMS AND METHODS FOR CONTROLLING THE SPEED OF A CLOSED LOOP LIQUID FOR EJECTION |
| US11246249B2 (en) | 2020-04-15 | 2022-02-08 | Illinois Tool Works Inc. | Tilt and rotate dispenser having strain wave gear system |
| US11805634B2 (en) * | 2021-08-03 | 2023-10-31 | Illinois Tool Works Inc. | Tilt and rotate dispenser having motion control |
| US11904337B2 (en) | 2021-08-03 | 2024-02-20 | Illinois Tool Works Inc. | Tilt and rotate dispenser having material flow rate control |
| US12468285B2 (en) | 2023-03-08 | 2025-11-11 | Illinois Tool Works Inc. | Intersect command vision locating system and method |
| US12226795B2 (en) | 2023-04-14 | 2025-02-18 | Illinois Tool Works Inc. | Dispense volume adjustment based on gap width of located features |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4769551A (en) * | 1986-06-27 | 1988-09-06 | Nippon Kogaku K.K. | Pattern detecting apparatus utilizing energy beam |
| JP2716052B2 (ja) * | 1987-01-13 | 1998-02-18 | 株式会社日立製作所 | 加工方法及び装置並びに加工品質管理方法 |
| US5819983A (en) | 1995-11-22 | 1998-10-13 | Camelot Sysems, Inc. | Liquid dispensing system with sealing augering screw and method for dispensing |
| US6173864B1 (en) * | 1999-04-23 | 2001-01-16 | Nordson Corporation | Viscous material dispensing system and method with feedback control |
| JP2002040342A (ja) * | 2000-07-24 | 2002-02-06 | Ricoh Co Ltd | 光走査装置・光走査方法および画像形成装置 |
| US6991825B2 (en) * | 2002-05-10 | 2006-01-31 | Asm Assembly Automation Ltd. | Dispensation of controlled quantities of material onto a substrate |
| US7264323B2 (en) * | 2002-11-22 | 2007-09-04 | Codonics, Inc. | Achieving laser-quality medical hardcopy output from thermal print devices |
| JP3887337B2 (ja) * | 2003-03-25 | 2007-02-28 | 株式会社東芝 | 配線部材およびその製造方法 |
| US7980197B2 (en) | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
| US8059915B2 (en) * | 2006-11-20 | 2011-11-15 | Videosurf, Inc. | Apparatus for and method of robust motion estimation using line averages |
| US7524015B2 (en) * | 2006-12-20 | 2009-04-28 | Palo Alto Research Center Incorporated | Method of printing smooth micro-scale features |
| TWI323189B (en) * | 2006-12-29 | 2010-04-11 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
| JP5204451B2 (ja) * | 2007-09-28 | 2013-06-05 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法 |
| JP2010067674A (ja) * | 2008-09-09 | 2010-03-25 | Toray Ind Inc | 金属積層基板の製造方法及びそれにより得られる金属積層基板 |
| JP5651981B2 (ja) * | 2010-03-31 | 2015-01-14 | 日本電気株式会社 | 塗布圧力制御装置、方法及びプログラム並びにこれを用いた塗布装置 |
| JP2013536274A (ja) * | 2010-07-16 | 2013-09-19 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ポリウレタン分散剤をベースとする被架橋顔料分散物 |
| US8458626B1 (en) * | 2012-01-20 | 2013-06-04 | International Business Machines Corporation | Method for calibrating an SRAF printing model |
| US9057642B2 (en) * | 2012-12-03 | 2015-06-16 | Illinois Tool Works Inc. | Method and apparatus for calibrating a dispenser |
-
2012
- 2012-08-30 US US13/598,719 patent/US20140060144A1/en not_active Abandoned
-
2013
- 2013-08-28 EP EP13763135.4A patent/EP2891391A1/en not_active Withdrawn
- 2013-08-28 JP JP2015530009A patent/JP2015528388A/ja active Pending
- 2013-08-28 KR KR1020157005201A patent/KR20150052043A/ko not_active Withdrawn
- 2013-08-28 CN CN201380041529.1A patent/CN104620685A/zh active Pending
- 2013-08-28 WO PCT/US2013/057152 patent/WO2014036185A1/en not_active Ceased
- 2013-08-28 TW TW102130867A patent/TW201410333A/zh unknown
-
2015
- 2015-01-06 PH PH12015500029A patent/PH12015500029A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150052043A (ko) | 2015-05-13 |
| PH12015500029A1 (en) | 2015-02-23 |
| EP2891391A1 (en) | 2015-07-08 |
| WO2014036185A1 (en) | 2014-03-06 |
| JP2015528388A (ja) | 2015-09-28 |
| US20140060144A1 (en) | 2014-03-06 |
| CN104620685A (zh) | 2015-05-13 |
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