CN104620685A - 用于标定分配的沉积物的方法与设备 - Google Patents
用于标定分配的沉积物的方法与设备 Download PDFInfo
- Publication number
- CN104620685A CN104620685A CN201380041529.1A CN201380041529A CN104620685A CN 104620685 A CN104620685 A CN 104620685A CN 201380041529 A CN201380041529 A CN 201380041529A CN 104620685 A CN104620685 A CN 104620685A
- Authority
- CN
- China
- Prior art keywords
- live width
- line
- distributor
- adjustment
- average live
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000009826 distribution Methods 0.000 claims description 35
- 230000008859 change Effects 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 2
- 230000006870 function Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 239000011345 viscous material Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012850 fabricated material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/598,719 | 2012-08-30 | ||
| US13/598,719 US20140060144A1 (en) | 2012-08-30 | 2012-08-30 | Method and apparatus for calibrating dispensed deposits |
| PCT/US2013/057152 WO2014036185A1 (en) | 2012-08-30 | 2013-08-28 | Method and apparatus for calibrating dispensed deposits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104620685A true CN104620685A (zh) | 2015-05-13 |
Family
ID=49209530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380041529.1A Pending CN104620685A (zh) | 2012-08-30 | 2013-08-28 | 用于标定分配的沉积物的方法与设备 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140060144A1 (enExample) |
| EP (1) | EP2891391A1 (enExample) |
| JP (1) | JP2015528388A (enExample) |
| KR (1) | KR20150052043A (enExample) |
| CN (1) | CN104620685A (enExample) |
| PH (1) | PH12015500029A1 (enExample) |
| TW (1) | TW201410333A (enExample) |
| WO (1) | WO2014036185A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9789497B1 (en) * | 2016-06-20 | 2017-10-17 | Nordson Corporation | Systems and methods for applying a liquid coating to a substrate |
| EP3700680A1 (en) | 2017-10-27 | 2020-09-02 | Nordson Corporation | Systems and methods for closed loop fluid velocity control for jetting |
| US11246249B2 (en) | 2020-04-15 | 2022-02-08 | Illinois Tool Works Inc. | Tilt and rotate dispenser having strain wave gear system |
| US11805634B2 (en) * | 2021-08-03 | 2023-10-31 | Illinois Tool Works Inc. | Tilt and rotate dispenser having motion control |
| US11904337B2 (en) | 2021-08-03 | 2024-02-20 | Illinois Tool Works Inc. | Tilt and rotate dispenser having material flow rate control |
| US12468285B2 (en) | 2023-03-08 | 2025-11-11 | Illinois Tool Works Inc. | Intersect command vision locating system and method |
| US12226795B2 (en) | 2023-04-14 | 2025-02-18 | Illinois Tool Works Inc. | Dispense volume adjustment based on gap width of located features |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000065316A1 (en) * | 1999-04-23 | 2000-11-02 | Nordson Corporation | Viscous material dispensing system and method with feedback control |
| US20030209560A1 (en) * | 2002-05-10 | 2003-11-13 | Asm Assembly Automation Ltd | Dispensation of controlled quantities of material onto a substrate |
| US7329458B2 (en) * | 2003-03-25 | 2008-02-12 | Kabushiki Kaisha Toshiba | Wiring member and method of manufacturing the same |
| CN101204890A (zh) * | 2006-12-20 | 2008-06-25 | 帕洛阿尔托研究中心公司 | 印刷平滑微尺度特征的方法 |
| TW200827040A (en) * | 2006-12-29 | 2008-07-01 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4769551A (en) * | 1986-06-27 | 1988-09-06 | Nippon Kogaku K.K. | Pattern detecting apparatus utilizing energy beam |
| JP2716052B2 (ja) * | 1987-01-13 | 1998-02-18 | 株式会社日立製作所 | 加工方法及び装置並びに加工品質管理方法 |
| US5819983A (en) | 1995-11-22 | 1998-10-13 | Camelot Sysems, Inc. | Liquid dispensing system with sealing augering screw and method for dispensing |
| JP2002040342A (ja) * | 2000-07-24 | 2002-02-06 | Ricoh Co Ltd | 光走査装置・光走査方法および画像形成装置 |
| US7264323B2 (en) * | 2002-11-22 | 2007-09-04 | Codonics, Inc. | Achieving laser-quality medical hardcopy output from thermal print devices |
| US7980197B2 (en) | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
| US8059915B2 (en) * | 2006-11-20 | 2011-11-15 | Videosurf, Inc. | Apparatus for and method of robust motion estimation using line averages |
| JP5204451B2 (ja) * | 2007-09-28 | 2013-06-05 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法 |
| JP2010067674A (ja) * | 2008-09-09 | 2010-03-25 | Toray Ind Inc | 金属積層基板の製造方法及びそれにより得られる金属積層基板 |
| JP5651981B2 (ja) * | 2010-03-31 | 2015-01-14 | 日本電気株式会社 | 塗布圧力制御装置、方法及びプログラム並びにこれを用いた塗布装置 |
| WO2012009408A2 (en) * | 2010-07-16 | 2012-01-19 | E. I. Du Pont De Nemours And Company | Cross-linked pigment dispersion based on polyurethane dispersants |
| US8458626B1 (en) * | 2012-01-20 | 2013-06-04 | International Business Machines Corporation | Method for calibrating an SRAF printing model |
| US9057642B2 (en) * | 2012-12-03 | 2015-06-16 | Illinois Tool Works Inc. | Method and apparatus for calibrating a dispenser |
-
2012
- 2012-08-30 US US13/598,719 patent/US20140060144A1/en not_active Abandoned
-
2013
- 2013-08-28 WO PCT/US2013/057152 patent/WO2014036185A1/en not_active Ceased
- 2013-08-28 TW TW102130867A patent/TW201410333A/zh unknown
- 2013-08-28 EP EP13763135.4A patent/EP2891391A1/en not_active Withdrawn
- 2013-08-28 JP JP2015530009A patent/JP2015528388A/ja active Pending
- 2013-08-28 CN CN201380041529.1A patent/CN104620685A/zh active Pending
- 2013-08-28 KR KR1020157005201A patent/KR20150052043A/ko not_active Withdrawn
-
2015
- 2015-01-06 PH PH12015500029A patent/PH12015500029A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000065316A1 (en) * | 1999-04-23 | 2000-11-02 | Nordson Corporation | Viscous material dispensing system and method with feedback control |
| US20030209560A1 (en) * | 2002-05-10 | 2003-11-13 | Asm Assembly Automation Ltd | Dispensation of controlled quantities of material onto a substrate |
| US7329458B2 (en) * | 2003-03-25 | 2008-02-12 | Kabushiki Kaisha Toshiba | Wiring member and method of manufacturing the same |
| CN101204890A (zh) * | 2006-12-20 | 2008-06-25 | 帕洛阿尔托研究中心公司 | 印刷平滑微尺度特征的方法 |
| TW200827040A (en) * | 2006-12-29 | 2008-07-01 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2891391A1 (en) | 2015-07-08 |
| KR20150052043A (ko) | 2015-05-13 |
| PH12015500029A1 (en) | 2015-02-23 |
| US20140060144A1 (en) | 2014-03-06 |
| JP2015528388A (ja) | 2015-09-28 |
| WO2014036185A1 (en) | 2014-03-06 |
| TW201410333A (zh) | 2014-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104620685A (zh) | 用于标定分配的沉积物的方法与设备 | |
| TWI293260B (en) | Method of dispensing viscous material onto a substrate from a dispenser | |
| US6541063B1 (en) | Calibration of a dispensing system | |
| US9393586B2 (en) | Dispenser and method of dispensing and controlling with a flow meter | |
| CN103547378B (zh) | 用于标定分配的沉积物的方法与设备 | |
| KR102195227B1 (ko) | 디스펜서를 캘리브레이팅하는 방법 및 장치 | |
| JP6659732B2 (ja) | ディスペンサを較正する方法 | |
| CN104275277B (zh) | 粘性材料涂覆调校方法 | |
| KR20240041998A (ko) | 재료의 유량 제어가 이루어지는 틸팅 및 회전식 분배기 | |
| KR20240041997A (ko) | 동작 제어가 이루어지는 틸팅 및 회전식 분배기 | |
| CN116510973A (zh) | 一种常压灌胶机及控制系统 | |
| US12226795B2 (en) | Dispense volume adjustment based on gap width of located features |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150513 |
|
| WD01 | Invention patent application deemed withdrawn after publication |