JP2015525809A5 - - Google Patents

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Publication number
JP2015525809A5
JP2015525809A5 JP2015520252A JP2015520252A JP2015525809A5 JP 2015525809 A5 JP2015525809 A5 JP 2015525809A5 JP 2015520252 A JP2015520252 A JP 2015520252A JP 2015520252 A JP2015520252 A JP 2015520252A JP 2015525809 A5 JP2015525809 A5 JP 2015525809A5
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JP
Japan
Prior art keywords
curing agent
epoxy
epoxy curing
item
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015520252A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015525809A (ja
JP6130502B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/045623 external-priority patent/WO2014007963A1/en
Publication of JP2015525809A publication Critical patent/JP2015525809A/ja
Publication of JP2015525809A5 publication Critical patent/JP2015525809A5/ja
Application granted granted Critical
Publication of JP6130502B2 publication Critical patent/JP6130502B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015520252A 2012-07-03 2013-06-13 構造化ハイブリッド接着剤物品の製造方法 Active JP6130502B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261667637P 2012-07-03 2012-07-03
US61/667,637 2012-07-03
PCT/US2013/045623 WO2014007963A1 (en) 2012-07-03 2013-06-13 Method of making structured hybrid adhesive articles

Publications (3)

Publication Number Publication Date
JP2015525809A JP2015525809A (ja) 2015-09-07
JP2015525809A5 true JP2015525809A5 (https=) 2016-08-04
JP6130502B2 JP6130502B2 (ja) 2017-05-17

Family

ID=48692684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015520252A Active JP6130502B2 (ja) 2012-07-03 2013-06-13 構造化ハイブリッド接着剤物品の製造方法

Country Status (9)

Country Link
US (2) US20150165670A1 (https=)
EP (1) EP2870190B1 (https=)
JP (1) JP6130502B2 (https=)
KR (1) KR20150036272A (https=)
CN (1) CN104619742B (https=)
BR (1) BR112015000114A2 (https=)
CA (1) CA2877863A1 (https=)
PL (1) PL2870190T3 (https=)
WO (1) WO2014007963A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9669426B2 (en) * 2013-05-14 2017-06-06 Boe Hyundai Lcd Inc. Heat conductive adhesive film, method for manufacturing the same and OLED panel
CN107406576B (zh) * 2015-02-27 2019-04-26 3M创新有限公司 包含增韧的固化剂的双组分粘合剂
KR102610546B1 (ko) 2018-09-20 2023-12-05 피피지 인더스트리즈 오하이오 인코포레이티드 티올-함유 조성물
US11725308B2 (en) 2019-08-19 2023-08-15 3M Innovative Properties Company Core-sheath filaments including crosslinkable and crosslinked adhesive compositions and methods of making the same
CN115244150B (zh) 2020-03-06 2024-12-17 3M创新有限公司 通过图案化表面引发的固化而可调节的复合psa/结构粘合剂粘结

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1460571A (en) 1973-11-16 1977-01-06 Ciba Geigy Ag Adhesive compositions
JPH0288684A (ja) * 1988-09-27 1990-03-28 Nitto Denko Corp 接着方法及びそれに使用する液状接着剤
EP0370445A3 (de) 1988-11-23 1990-07-04 Ciba-Geigy Ag Polytetrahydrofurandithiole und deren Verwendung
EP0475321B1 (en) 1990-09-11 1996-06-05 Hitachi Chemical Co., Ltd. Epoxy resin film and method of producing it
DE4126877C1 (en) 1991-08-14 1992-11-26 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds
CA2086770A1 (en) * 1992-01-10 1993-07-11 Jyi-Faa Hwang Epoxy interpenetrating polymer networks having internetwork bonds
US5942330A (en) * 1994-05-19 1999-08-24 Bostik, Incorporated Adhesive compositions and methods and articles of manufacture comprising same
CA2196024A1 (en) 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
JP4394281B2 (ja) 1998-01-16 2010-01-06 ロックタイト (アール アンド ディー) リミテッド 硬化性のエポキシ−ベースの組成物
JP2002118144A (ja) 2000-10-06 2002-04-19 Sony Chem Corp 接着剤及び電気装置
US7125510B2 (en) 2002-05-15 2006-10-24 Zhili Huang Microstructure fabrication and microsystem integration
JP4326190B2 (ja) 2002-07-10 2009-09-02 スリーエム イノベイティブ プロパティズ カンパニー 可とう性成形型及びその製造方法
ITTO20030530A1 (it) 2003-07-09 2005-01-10 Infm Istituto Naz Per La Fisi Ca Della Mater Reticolo olografico di diffrazione, procedimento per la
JP2007046003A (ja) * 2005-08-12 2007-02-22 Three M Innovative Properties Co 被着体の貼付方法
EP1806375B1 (en) 2006-01-05 2009-04-01 Cognis IP Management GmbH Process for obtaining aqueous compositions comprising curing epoxy agents
JP4827861B2 (ja) * 2008-01-18 2011-11-30 中国電力株式会社 流入量予測システム、流入量予測方法及びプログラム
JP5390599B2 (ja) 2008-05-22 2014-01-15 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂のアダクト及びその製造方法
JP5676444B2 (ja) * 2008-07-23 2015-02-25 スリーエム イノベイティブ プロパティズ カンパニー 二液型エポキシ系構造接着剤
US20120024477A1 (en) * 2009-02-06 2012-02-02 Kropp Michael A Room temperature curing epoxy adhesive
EP2223966B1 (en) 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
US20100227981A1 (en) 2009-03-04 2010-09-09 Air Products And Chemicals, Inc. Epoxide-based composition
CA2758797C (en) * 2009-04-17 2018-06-12 3M Innovative Properties Company Lightning protection sheet with patterned conductor
PT2650210T (pt) 2009-04-17 2018-05-10 3M Innovative Properties Co Lâmina de proteção contra raios com discriminador modelado
CN101665674B (zh) * 2009-09-30 2012-05-30 烟台德邦科技有限公司 一种单组分螺纹锁固环氧预涂胶及其制备方法
CN102834348B (zh) 2009-12-14 2016-05-25 锡克拜控股有限公司 具有高长径比的铸塑聚合物层
WO2012024354A1 (en) * 2010-08-20 2012-02-23 3M Innovative Properties Company Low temperature curable epoxy tape and method of making same
BR112013014592A2 (pt) 2010-12-29 2016-09-20 3M Innovative Properties Co adesivos híbridos estruturais
BR112014003754A2 (pt) * 2011-08-18 2017-03-07 Dow Global Technologies Llc composição de resina epóxil curável e processo

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