JP2015522502A - アンモニア性ヒドロキソ亜鉛化合物を含有する配合物 - Google Patents
アンモニア性ヒドロキソ亜鉛化合物を含有する配合物 Download PDFInfo
- Publication number
- JP2015522502A JP2015522502A JP2015506162A JP2015506162A JP2015522502A JP 2015522502 A JP2015522502 A JP 2015522502A JP 2015506162 A JP2015506162 A JP 2015506162A JP 2015506162 A JP2015506162 A JP 2015506162A JP 2015522502 A JP2015522502 A JP 2015522502A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- formulation
- hydroxozinc
- structural component
- zno
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 238000009472 formulation Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000011701 zinc Substances 0.000 claims description 21
- 239000002244 precipitate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 16
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 12
- 239000003446 ligand Substances 0.000 claims description 12
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 6
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 5
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229910002651 NO3 Inorganic materials 0.000 claims description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 150000002259 gallium compounds Chemical class 0.000 claims description 4
- 150000002472 indium compounds Chemical class 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 74
- 239000010410 layer Substances 0.000 description 41
- 239000011787 zinc oxide Substances 0.000 description 38
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 235000011114 ammonium hydroxide Nutrition 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 230000005669 field effect Effects 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000000654 additive Substances 0.000 description 8
- 125000004429 atom Chemical group 0.000 description 8
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 8
- 239000007791 liquid phase Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 5
- -1 ZnCl 2 Chemical class 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000005119 centrifugation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000004820 halides Chemical class 0.000 description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 description 4
- 150000004679 hydroxides Chemical class 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 229920000307 polymer substrate Polymers 0.000 description 3
- 239000012047 saturated solution Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 2
- 229940007718 zinc hydroxide Drugs 0.000 description 2
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 101100167062 Caenorhabditis elegans chch-3 gene Proteins 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000013011 aqueous formulation Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229920001002 functional polymer Polymers 0.000 description 1
- 229940044658 gallium nitrate Drugs 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical group OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- ZKGFCAMLARKROZ-UHFFFAOYSA-N oxozinc;hydrate Chemical compound O.[Zn]=O ZKGFCAMLARKROZ-UHFFFAOYSA-N 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical class [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01C—AMMONIA; CYANOGEN; COMPOUNDS THEREOF
- C01C1/00—Ammonia; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
- C01G9/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Thin Film Transistor (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
Description
I)ランダムな分布を有する、酸化スチレンをベースとするポリアルキレンオキシドまたは一般式(1)
R1O(SO)a(EO)b(PO)c(BO)dR2
〔式中、
R1=8〜13個の炭素原子を有する、直鎖状または分枝鎖状または脂環式の基、
R2=水素、それぞれ1〜8個のC原子を有するアシル基、アルキル基またはカルボン酸基、
SO=酸化スチレン、EO=酸化エチレン、PO=酸化プロピレン、BO=酸化ブチレンおよび
a=1〜5、
b=3〜50、
c=0〜3、
d=0〜3であり、その際にb≧a+c+dである〕のブロックコポリマーとして。
x=1または2、
n=2〜18、
m、o=2〜100、
k=2〜4、
R’’=Hまたは直鎖状もしくは分枝鎖状のアルキル基、これらの基は、任意に、さらなる官能基で置換されていてよく、および
R’=アルキル基、アルカリール基、アルケニル基またはスルホプロピル基である〕のリン酸エステル。
[R1O(SO)a(EO)b(CH2CHCH3O)c(BO)d]xP(=O)(OH)3-x (3)
〔式中、
R1=1〜22個の炭素原子を有する、直鎖状、分枝鎖状または脂環式の基、
SO=酸化スチレン、EO=酸化エチレン、BO=酸化ブチレンおよび
a=1〜2未満、
b=0〜100、
c=0〜10、
d=0〜3であり、その際にb≧a+c+dである〕のブロックコポリマーおよびその塩が使用される。
A)1つ以上のアミノ官能性ポリマーを
B)一般式(4)/(4a)
T−C(O)−[O−A−C(O)]x−OH (4)、T−O−[C(O)−A−O−]y−Z (4a)
の1つ以上のポリエステルおよび
c)一般式(5)/(5a)
T−C(O)−B−Z (5)、T−O−B−Z (5a)
の1つ以上のポリエーテル
と部分的または全体的に反応させることによって得られる化合物が使用されることができ、上記式中、
Tは、水素基および/または1〜24個の炭素原子を有する、任意に置換された、直鎖状または分枝鎖状のアリール基、アリールアルキル基、アルキル基またはアルケニル基であり、
Aは、直鎖状炭化水素基、分枝鎖状炭化水素基、環状炭化水素基および芳香族炭化水素基の群から選択された、少なくとも1個の二価基であり、
Zは、スルホン酸、硫酸、ホスホン酸、リン酸、カルボン酸、イソシアネート、エポキシド、殊にリン酸および(メタ)アクリル酸の群から選択された、少なくとも1個の基であり、
Bは、一般式(6)
−(ClH2lO)a−(CmH2mO)b−(CnH2nO)c−(SO)d− (6)
の基であり、
a、b、cは、互いに独立して、0〜100の値であり、但し、a+b+cからなる総和は、0以上、特に5〜35、殊に10〜20であり、但し、a+b+c+dからなる総和は、0超であり、
dは、0以上、特に1〜5であり、
l、m、nは、互いに独立して、2以上、特に2〜4であり、
x、yは、互いに独立して、2以上である。
R1は、1〜4個の炭素原子を有するアルキル基またはアリール基であるが、しかし、基R1の少なくとも80%は、メチル基であり、
R2は、分子内で同一かまたは異なり、かつ次の意味を有することができる:
a)
R3は、水素基またはアルキル基であり、
R4は、水素基、アルキル基またはカルボキシル基であり、
cは、1〜20の数であり、
dは、0〜50の数であり、
eは、0〜50の数であり、
或いは
b)−(CH2−)fOR5、この式中、
R5は、水素基、アルキル基、カルボキシル基、または任意に、エーテル基を含むジメチロールプロパン基であり、
fは、2〜20の数であり、
或いは
c)−(CH2−)g(OC2H4−)h(OC3H6−)i(OC4H8)j(OCH2CH(C6H5))kOR6
上記式中、
R6は、水素基、アルキル基またはカルボキシル基であり、
gは、2〜6の数であり、
hは、0〜20の数であり、
iは、1〜50の数であり、
jは、0〜10の数であり、
kは、0〜10であり、
または、
d)基R1に相当し、但し、平均的分子内で少なくとも1個の基R2は、(a)の意味を有し、その際にaは、1〜500、特に1〜200、殊に1〜50の数であり、およびbは、0〜10、特に5未満、殊に0の数である。
a)式(8a)、(8b)、(8c)および/または(8d)
R1=H、1〜5個のC原子を有する脂肪族炭化水素基、
p=1〜4、q=0〜6、t=0〜4、i=1〜6、l=1〜2、m=2〜18であり、
その際にH原子上の指数は、lとmとの積によって形成され、
n=0〜100、o=0〜100、SO=酸化スチレンであり、
その際に(SO)iおよび酸化アルキレン誘導体は、ランダムに、またはブロック状にポリエーテル中に分布されていてよいが、しかし、好ましくは、これらの基は、ブロック状に構成されかつ次の順序で:
−(SO)i−[(CmHlmO)n−(CmHlmO)o]−R2
存在し、
R2=H、1〜20個のC原子を有する脂肪族の、任意に分枝鎖状の炭化水素基、5〜8個のC原子を有する脂環式炭化水素基、任意に置換されているかまたはリン酸エステル誘導体、(特にモノエステル)、硫酸塩誘導体またはスルホネート誘導体であってよい、6〜14個のC原子を有するアリール基〕の少なくとも1つの構造式の基は、1〜80モル%であり、
b)式(9)
S=−H、−COOMa、−COOR3であり、
M=水素、一価または二価の金属カチオン、アンモニウムイオン、有機アミン基であり、
a=1であるか、またはMが二価金属カチオン1/2である場合には、
R3=1〜20個のC原子を有する、脂肪族の、任意に分枝鎖状の炭化水素基、5〜8個のC原子を有する脂環式炭化水素基、6〜14個のC原子を有するアリール基であり、
T=−U1−R4−または−U1−(CmHlmO)n−(CmHlmO)o−R2、
U1=−COO−、−CONH−、−CONR3−、−O−、−CH2O−であり、
R4=H、Ma、R3または−Q1−NQ2Q3であり、
この場合、
Q1は、2〜24個の炭素原子を有するアルキレン基であり、
Q2およびQ3-は、1〜12個の炭素原子を有する脂肪族アルキル基および/または脂環式アルキル基であり、任意に酸化して
−Q1−N(+)O(-)Q2Q3
とし、
および
m、n、l、o、R1およびR2は、上記の意味を有する〕の構造式の基は、1〜90モル%であり、
c)式(10)
T=−U1−(CmHlmO)n−(CmHlmO)o−R5であり、
R5=R4または
上記式中、U2=−OOC−、−NHOC−、−O−、−O−CH2−であり、
その際にm、n、l、o、S、R1、R2およびU1は、上記の意味を有する〕の構造式の基は、0〜10モル%である。
本発明による実施例1:
モル比66.5:28.5:5の亜鉛対ガリウム対インジウムの硝酸塩から、完全脱塩水を用いて全濃度0.5mol/lの溶液15mlを調合する。引続き、2.5mol/lのNaOH10mlを用いて沈殿を行なう。沈殿物を遠心分離(4500rpm、10分間)によって分離し、液相を廃棄する。この沈殿物を完全脱塩水中に分散させ、攪拌し、かつ再度、遠心分離し、引き続き液相を廃棄する。この工程をなお4回繰り返す。最後に、残留する沈殿物を28%のアンモニア水溶液中で少なくとも1時間攪拌し、飽和溶液を生じさせる。
モル比70:30の亜鉛対ガリウムの硝酸塩から、完全脱塩水を用いて全濃度0.5mol/lの溶液15mlを調合する。引続き、2.5mol/lのNaOH10mlを用いて沈殿を行なう。沈殿物を遠心分離(4500rpm、10分間)によって分離し、液相を廃棄する。この沈殿物を完全脱塩水中に分散させ、攪拌し、かつ再度、遠心分離し、引き続き液相を廃棄する。この工程をなお4回繰り返す。最後に、残留する沈殿物を28%のアンモニア水溶液中で少なくとも1時間攪拌し、飽和溶液を生じさせる。
亜鉛の硝酸塩から、完全脱塩水を用いて全濃度0.5mol/lの溶液15mlを調合する。引続き、2.5mol/lのNaOH10mlを用いて沈殿を行なう。沈殿物を遠心分離(4500rpm、10分間)によって分離し、液相を廃棄する。この沈殿物を完全脱塩水中に分散させ、攪拌し、かつ再度、遠心分離し、引き続き液相を廃棄する。この工程をなお4回繰り返す。最後に、残留する沈殿物を28%のアンモニア水溶液中で少なくとも1時間攪拌し、飽和溶液を生じさせる。
Claims (15)
- アンモニア性配合物であって、
a)少なくとも1つのヒドロキソ亜鉛化合物および
b)第3主族の元素の少なくとも1つの化合物を含む、前記アンモニア性配合物。 - 前記ヒドロキソ亜鉛化合物が、亜鉛であるただ一つの中心イオンを有することを特徴とする、請求項1記載の配合物。
- 前記ヒドロキソ亜鉛化合物が、ヒドロキソ配位子だけおよび任意にアンミン配位子を有することを特徴とする、請求項1または2記載の配合物。
- 前記ヒドロキソ亜鉛化合物が、Zn(OH)x(NH3)y (2-x)+〔式中、1≦x≦2および1≦y≦6である〕であることを特徴とする、請求項1から3までのいずれか1項に記載の配合物。
- 前記配合物が、少なくとも1つのヒドロキソ亜鉛化合物を、亜鉛イオンおよび第3主族の元素の原子/イオンの全体量に対して、50〜99.95モル%の割合で有することを特徴とする、請求項1から4までのいずれか1項に記載の配合物。
- 第3主族の元素の少なくとも1つの化合物がアルミニウム(Al)、ガリウム(Ga)またはインジウム(In)の化合物であることを特徴とする、請求項1から5までのいずれか1項に記載の配合物。
- 前記配合物が第3主族の元素の少なくとも2つの化合物を含むことを特徴とする、請求項1から6までのいずれか1項に記載の配合物。
- 前記配合物が少なくとも1つのガリウム化合物および少なくとも1つのインジウム化合物を有することを特徴とする、請求項7記載の配合物。
- 前記配合物が、a)亜鉛の硝酸塩および三価の酸化段階での第3主族の少なくとも1つの元素の硝酸塩を溶解し、b)水酸化物含有沈殿物を水酸化物塩基を用いて沈殿させ、c)溶剤を分離し、およびd)沈殿物をアンモニア水中に収容することによって製造可能であることを特徴とする、請求項1から8までのいずれか1項に記載の配合物。
- ZnO含有層の製造法であって、請求項1から9までのいずれか1項に記載の配合物を基体上に施与し、それに引き続いて熱変換することを特徴とする、前記方法。
- 電子構造部品を製造するため、殊にトランジスタ、光電子構造部品およびセンサーを製造するための、請求項1から9までのいずれか1項に記載の配合物の使用。
- 請求項10記載の方法により製造された、少なくとも1つのZnO含有層を含む電子構造部品。
- 電子構造部品がトランジスタであることを特徴とする、請求項12記載の電子構造部品。
- 電子構造部品が光電子構造部品であることを特徴とする、請求項12記載の電子構造部品。
- 電子構造部品がセンサーであることを特徴とする、請求項12記載の電子構造部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012206234A DE102012206234A1 (de) | 2012-04-17 | 2012-04-17 | Formulierungen enthaltend ammoniakalische Hydroxo-Zink-Verbindungen |
DE102012206234.3 | 2012-04-17 | ||
PCT/EP2013/056341 WO2013156274A1 (de) | 2012-04-17 | 2013-03-26 | Formulierungen enthaltend ammoniakalische hydroxo-zink-verbindungen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015522502A true JP2015522502A (ja) | 2015-08-06 |
JP6257585B2 JP6257585B2 (ja) | 2018-01-10 |
Family
ID=47997514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015506162A Expired - Fee Related JP6257585B2 (ja) | 2012-04-17 | 2013-03-26 | アンモニア性ヒドロキソ亜鉛化合物を含有する配合物 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9978591B2 (ja) |
EP (1) | EP2839504A1 (ja) |
JP (1) | JP6257585B2 (ja) |
KR (1) | KR101993495B1 (ja) |
CN (1) | CN104221133B (ja) |
DE (1) | DE102012206234A1 (ja) |
RU (1) | RU2640237C2 (ja) |
TW (1) | TWI629245B (ja) |
WO (1) | WO2013156274A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014202718A1 (de) | 2014-02-14 | 2015-08-20 | Evonik Degussa Gmbh | Beschichtungszusammensetzung, Verfahren zu ihrer Herstellung und ihre Verwendung |
GB2528908A (en) * | 2014-08-04 | 2016-02-10 | Isis Innovation | Thin film semiconductor |
CN114695826A (zh) * | 2020-12-31 | 2022-07-01 | Tcl科技集团股份有限公司 | 调控氧化锌的电子迁移率的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010018479A (ja) * | 2008-07-10 | 2010-01-28 | Fujifilm Corp | 金属酸化物膜とその製造方法、及び半導体装置 |
JP2010132545A (ja) * | 2008-12-05 | 2010-06-17 | Korea Electronics Telecommun | 金属酸化物の形成方法及びこれを含むトランジスタ構造体の形成方法 |
WO2010146053A1 (de) * | 2009-06-16 | 2010-12-23 | Basf Se | Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU897052A1 (ru) * | 1980-07-18 | 1984-05-30 | Проектно-Технологический И Научно-Исследовательский Институт | Способ изготовлени полупроводниковых приборов с резисторами |
ES2187083T3 (es) | 1998-02-19 | 2003-05-16 | Goldschmidt Ag Th | Esteres de acido fosforico y su utilizacion como agentes dispersantes. |
DE19940797A1 (de) | 1999-08-27 | 2001-03-01 | Goldschmidt Ag Th | Durch Akoxylierung erhaltene blockcopolymere, styrenoxidhaltige Polyalkylenoxide und deren Verwendung |
DE10232115A1 (de) | 2002-07-16 | 2004-02-05 | Goldschmidt Ag | Organopolysiloxane zur Entschäumung wässriger Systeme |
DE10348825A1 (de) | 2003-10-21 | 2005-06-02 | Goldschmidt Ag | Dispergiermittel zur Herstellung wässriger Pigmentpasten |
EP1812969B1 (en) * | 2004-11-10 | 2015-05-06 | Canon Kabushiki Kaisha | Field effect transistor comprising an amorphous oxide |
US7402506B2 (en) * | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
DE202005010697U1 (de) | 2005-07-07 | 2005-09-15 | Schoen Hendrik | Flexibler, transparenter Feldeffekttransistor |
KR101190917B1 (ko) * | 2006-02-09 | 2012-10-12 | 삼성코닝정밀소재 주식회사 | 칼코게나이드-cnt 하이브리드 박막 및 그 제조방법 |
US20070287221A1 (en) * | 2006-06-12 | 2007-12-13 | Xerox Corporation | Fabrication process for crystalline zinc oxide semiconductor layer |
US7906415B2 (en) * | 2006-07-28 | 2011-03-15 | Xerox Corporation | Device having zinc oxide semiconductor and indium/zinc electrode |
DE102008058040A1 (de) | 2008-11-18 | 2010-05-27 | Evonik Degussa Gmbh | Formulierungen enthaltend ein Gemisch von ZnO-Cubanen und sie einsetzendes Verfahren zur Herstellung halbleitender ZnO-Schichten |
US8877657B2 (en) * | 2009-04-28 | 2014-11-04 | Basf Se | Process for producing semiconductive layers |
WO2011135514A2 (en) * | 2010-04-28 | 2011-11-03 | Basf Se | Process for preparing a zinc complex in solution |
CN102260907B (zh) * | 2011-06-17 | 2013-03-13 | 浙江大学 | 一种ZnO纳米同质p-n结阵列的制备方法 |
-
2012
- 2012-04-17 DE DE102012206234A patent/DE102012206234A1/de not_active Ceased
-
2013
- 2013-03-26 US US14/395,339 patent/US9978591B2/en not_active Expired - Fee Related
- 2013-03-26 JP JP2015506162A patent/JP6257585B2/ja not_active Expired - Fee Related
- 2013-03-26 KR KR1020147028739A patent/KR101993495B1/ko active IP Right Grant
- 2013-03-26 RU RU2014145777A patent/RU2640237C2/ru not_active IP Right Cessation
- 2013-03-26 EP EP13712255.2A patent/EP2839504A1/de not_active Withdrawn
- 2013-03-26 CN CN201380020604.6A patent/CN104221133B/zh not_active Expired - Fee Related
- 2013-03-26 WO PCT/EP2013/056341 patent/WO2013156274A1/de active Application Filing
- 2013-04-15 TW TW102113291A patent/TWI629245B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010018479A (ja) * | 2008-07-10 | 2010-01-28 | Fujifilm Corp | 金属酸化物膜とその製造方法、及び半導体装置 |
JP2010132545A (ja) * | 2008-12-05 | 2010-06-17 | Korea Electronics Telecommun | 金属酸化物の形成方法及びこれを含むトランジスタ構造体の形成方法 |
WO2010146053A1 (de) * | 2009-06-16 | 2010-12-23 | Basf Se | Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten |
Non-Patent Citations (3)
Title |
---|
FLEISCHHAKER FRIEDERIKE ET AL.: "ZNO BASED FIELD-EFFECT TRANSISTORS (FETS): solution-processable at low temperatures on flexible subs", JOURNAL OF MATERIALS CHEMISTRY, vol. V20, JPN5015005754, 12 July 2010 (2010-07-12), pages 6622 - 6625, ISSN: 0003673508 * |
MEYERS STEPHEN T.: "AQUEOUS INORGANIC INKS FOR LOW-TEMPERATURE FABRICATION OF ZNO TFTS", J. AM. CHEM. SOC., vol. V130 N51, JPN5015005755, 12 March 2008 (2008-03-12), pages 17603 - 17609, ISSN: 0003673507 * |
PARK, JAECHUL ET AL.: "Source/Drain Series-Resistance Effects in Amorphous Gallium-Indium Zinc-Oxide Thin Film Transistors", IEEE ELECTRON DEVICE LETTERS, vol. 29, JPN6017003972, 2008, pages 879 - 881, XP011231703, ISSN: 0003496035, DOI: 10.1109/LED.2008.2000815 * |
Also Published As
Publication number | Publication date |
---|---|
RU2014145777A (ru) | 2016-06-10 |
JP6257585B2 (ja) | 2018-01-10 |
TWI629245B (zh) | 2018-07-11 |
EP2839504A1 (de) | 2015-02-25 |
CN104221133B (zh) | 2018-03-06 |
WO2013156274A1 (de) | 2013-10-24 |
DE102012206234A1 (de) | 2013-10-17 |
CN104221133A (zh) | 2014-12-17 |
US20150076421A1 (en) | 2015-03-19 |
RU2640237C2 (ru) | 2017-12-27 |
TW201404724A (zh) | 2014-02-01 |
KR101993495B1 (ko) | 2019-06-26 |
US9978591B2 (en) | 2018-05-22 |
KR20150010708A (ko) | 2015-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8889476B2 (en) | Formulations comprising a mixture of ZnO cubanes and process using them to produce semiconductive ZnO layers | |
US8513646B2 (en) | Solution-processed high mobility inorganic thin-film transistors | |
Meyers et al. | Aqueous inorganic inks for low-temperature fabrication of ZnO TFTs | |
Jeong et al. | Metal salt-derived In–Ga–Zn–O semiconductors incorporating formamide as a novel co-solvent for producing solution-processed, electrohydrodynamic-jet printed, high performance oxide transistors | |
JP5798041B2 (ja) | プリント電子部品のための機能性材料 | |
Young Choi et al. | Effect of hafnium addition on Zn-Sn-O thin film transistors fabricated by solution process | |
US20070287221A1 (en) | Fabrication process for crystalline zinc oxide semiconductor layer | |
KR102060492B1 (ko) | 고성능 및 전기 안정성의 반전도성 금속 산화물 층의 제조 방법, 및 상기 방법에 따라 제조된 층 및 그의 용도 | |
CN101213671A (zh) | 利用金属氧化物纳米粒子制备电子器件的方法 | |
JP2005051224A (ja) | カルコゲニド(chalcogenide)皮膜の溶液堆積 | |
Pujar et al. | Trends in low‐temperature combustion derived thin films for solution‐processed electronics | |
JP6257585B2 (ja) | アンモニア性ヒドロキソ亜鉛化合物を含有する配合物 | |
WO2011146744A1 (en) | Organic-inorganic hybrid multilayer gate dielectrics for thin-film transistors | |
Liu et al. | Synthesis of ZnO Nanoparticles to Fabricate a Mask‐Free Thin‐Film Transistor by Inkjet Printing | |
Baek et al. | Comparative study of antimony doping effects on the performance of solution-processed ZIO and ZTO field-effect transistors | |
Yoon et al. | Nonvolatile memory transistors using solution-processed zinc–tin oxide and ferroelectric poly (vinylidene fluoride-trifluoroethylene) | |
Sanctis | Multinary metal oxide semiconductors-A study of different material systems and their application in thin-film transistors | |
de Barros | Development of p-type oxide semiconductors based on tin oxide and its alloys: application to thin film transistors | |
Bae et al. | Simple aqueous solution route for fabrication high performance oxide TFT | |
Shimoda et al. | Thin-Film Oxide Transistor by Liquid Process (1): FGT (Ferroelectric Gate Thin-Film Transistor) | |
Kim et al. | Metal‐Oxide Thin‐Film Transistors for Flexible Electronics |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20151222 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160323 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170213 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170511 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171205 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6257585 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |