JP2015504970A5 - - Google Patents

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Publication number
JP2015504970A5
JP2015504970A5 JP2014545125A JP2014545125A JP2015504970A5 JP 2015504970 A5 JP2015504970 A5 JP 2015504970A5 JP 2014545125 A JP2014545125 A JP 2014545125A JP 2014545125 A JP2014545125 A JP 2014545125A JP 2015504970 A5 JP2015504970 A5 JP 2015504970A5
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JP
Japan
Prior art keywords
pulse
target
voltage
target surface
intermediate state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014545125A
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English (en)
Japanese (ja)
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JP2015504970A (ja
JP6113743B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2012/004848 external-priority patent/WO2013083238A1/de
Publication of JP2015504970A publication Critical patent/JP2015504970A/ja
Publication of JP2015504970A5 publication Critical patent/JP2015504970A5/ja
Application granted granted Critical
Publication of JP6113743B2 publication Critical patent/JP6113743B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014545125A 2011-12-05 2012-11-23 反応性スパッタリングプロセス Expired - Fee Related JP6113743B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161566836P 2011-12-05 2011-12-05
US61/566,836 2011-12-05
PCT/EP2012/004848 WO2013083238A1 (de) 2011-12-05 2012-11-23 Reaktiver sputterprozess

Publications (3)

Publication Number Publication Date
JP2015504970A JP2015504970A (ja) 2015-02-16
JP2015504970A5 true JP2015504970A5 (enExample) 2015-12-24
JP6113743B2 JP6113743B2 (ja) 2017-04-12

Family

ID=47504785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014545125A Expired - Fee Related JP6113743B2 (ja) 2011-12-05 2012-11-23 反応性スパッタリングプロセス

Country Status (18)

Country Link
US (1) US10458015B2 (enExample)
EP (1) EP2789006B1 (enExample)
JP (1) JP6113743B2 (enExample)
KR (1) KR101990658B1 (enExample)
CN (1) CN104272429B (enExample)
AR (1) AR089044A1 (enExample)
BR (1) BR112014013533B1 (enExample)
CA (1) CA2858251C (enExample)
ES (1) ES2704121T3 (enExample)
MX (1) MX368733B (enExample)
MY (1) MY181526A (enExample)
PH (1) PH12014501269B1 (enExample)
PL (1) PL2789006T3 (enExample)
RU (1) RU2632210C2 (enExample)
SG (1) SG11201402945YA (enExample)
SI (1) SI2789006T1 (enExample)
TW (1) TWI565816B (enExample)
WO (1) WO2013083238A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014196352A1 (ja) * 2013-06-04 2014-12-11 株式会社村田製作所 薄膜形成方法
MY187100A (en) 2013-07-03 2021-08-31 Oerlikon Surface Solutions Ag Pfaeffikon Tixsi1-xn layers and their production
DE102016012460A1 (de) 2016-10-19 2018-04-19 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zur Herstellung definierter Eigenschaften von Gradientenschichten in einem System mehrlagiger Beschichtungen bei Sputter - Anlagen
EP3406761A1 (en) 2017-05-24 2018-11-28 Walter Ag A method for producing a coated cutting tool and a coated cutting tool
CN110184571A (zh) * 2019-05-07 2019-08-30 天津君盛天成科技发展有限公司 高功率脉冲涂装方法
WO2021160337A1 (en) * 2020-02-11 2021-08-19 Oerlikon Surface Solutions Ag, Pfäffikon Method of surface smoothening of additive manufactured metal components
CN111621756B (zh) * 2020-03-27 2021-12-24 中国科学院力学研究所 一种室温溅射制备晶态透明氧化铝薄膜的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3700633C2 (de) * 1987-01-12 1997-02-20 Reinar Dr Gruen Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma
DE19610012B4 (de) * 1996-03-14 2005-02-10 Unaxis Deutschland Holding Gmbh Verfahren zur Stabilisierung eines Arbeitspunkts beim reaktiven Zerstäuben in einer Sauerstoff enthaltenden Atmosphäre
SE521095C2 (sv) 2001-06-08 2003-09-30 Cardinal Cg Co Förfarande för reaktiv sputtring
US8025775B2 (en) * 2002-03-15 2011-09-27 Oerlikon Trading Ag, Truebbach Vacuum plasma generator
JP3866615B2 (ja) * 2002-05-29 2007-01-10 株式会社神戸製鋼所 反応性スパッタリング方法及び装置
US20050103620A1 (en) * 2003-11-19 2005-05-19 Zond, Inc. Plasma source with segmented magnetron cathode
US8500965B2 (en) * 2004-05-06 2013-08-06 Ppg Industries Ohio, Inc. MSVD coating process
DE102006017382A1 (de) 2005-11-14 2007-05-16 Itg Induktionsanlagen Gmbh Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen
GB0608582D0 (en) * 2006-05-02 2006-06-07 Univ Sheffield Hallam High power impulse magnetron sputtering vapour deposition
DE102006061324B4 (de) * 2006-06-20 2008-07-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Regelung eines reaktiven Hochleistungs-Puls-Magnetronsputterprozesses und Vorrichtung hierzu
SE533395C2 (sv) * 2007-06-08 2010-09-14 Sandvik Intellectual Property Sätt att göra PVD-beläggningar
US7685852B2 (en) 2007-06-28 2010-03-30 Rahamim Komemi Tool for pin tumbler locks
US9039871B2 (en) * 2007-11-16 2015-05-26 Advanced Energy Industries, Inc. Methods and apparatus for applying periodic voltage using direct current
KR101923221B1 (ko) * 2007-12-07 2018-11-28 에바텍 아크티엔게젤샤프트 Hipims를 이용한 반응성 스퍼터링
JP2010065240A (ja) * 2008-09-08 2010-03-25 Kobe Steel Ltd スパッタ装置
DE202010001497U1 (de) * 2010-01-29 2010-04-22 Hauzer Techno-Coating B.V. Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle
EP2700083B1 (de) 2011-04-20 2015-04-22 Oerlikon Surface Solutions AG, Trübbach Verfahren zur bereistellung sequenzieller leistungspulse

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