JP2015233088A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2015233088A JP2015233088A JP2014119622A JP2014119622A JP2015233088A JP 2015233088 A JP2015233088 A JP 2015233088A JP 2014119622 A JP2014119622 A JP 2014119622A JP 2014119622 A JP2014119622 A JP 2014119622A JP 2015233088 A JP2015233088 A JP 2015233088A
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- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- dam
- emitting device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Abstract
Description
図1は、第1の実施の形態に係る発光装置10の上面図である。図2は、図1の鎖線A−Aに沿った発光装置10の垂直断面図である。
上記実施の形態の発光装置10によれば、発光波長の短い第2の発光素子14を発光波長の長い第1の発光素子13と異なる領域に実装することにより、第1の発光素子13や封止材19に含まれる蛍光体による第2の発光素子14から発せられる光の吸収を抑えて、光取出効率を向上させることができる。
11 基板
13 第1の発光素子
14 第2の発光素子
15 ダム
19 封止材
Claims (5)
- 基板と、
前記基板上に実装された第1の発光素子と、
前記基板上に前記第1の発光素子を囲うように形成された環状の透明なダムと、
前記基板上の前記ダムの内部に実装された、前記第1の発光素子よりもピーク発光波長が短い第2の発光素子と、
前記ダムの内側に充填され、前記第1の発光素子を封止する封止材と、
を有する、発光装置。 - 前記第2の発光素子の発光色が紫色である、
請求項1に記載の発光装置。 - 前記ダムが蛍光体を含まない、
請求項1又は2に記載の発光装置。 - 前記封止材が、蛍光体を含み、
前記第2の発光素子のピーク発光波長が、前記封止材に含まれる蛍光体の吸収スペクトルの波長範囲外にある、
請求項1〜3のいずれか1項に記載の発光装置。 - 前記ダムがフィラーを含む、
請求項1〜4のいずれか1項に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014119622A JP6201904B2 (ja) | 2014-06-10 | 2014-06-10 | 発光装置 |
US14/723,311 US9741698B2 (en) | 2014-06-10 | 2015-05-27 | Light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014119622A JP6201904B2 (ja) | 2014-06-10 | 2014-06-10 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015233088A true JP2015233088A (ja) | 2015-12-24 |
JP6201904B2 JP6201904B2 (ja) | 2017-09-27 |
Family
ID=54770277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014119622A Active JP6201904B2 (ja) | 2014-06-10 | 2014-06-10 | 発光装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9741698B2 (ja) |
JP (1) | JP6201904B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020205392A (ja) * | 2019-06-19 | 2020-12-24 | シチズン電子株式会社 | 発光装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106322225B (zh) * | 2015-06-16 | 2019-05-10 | 群创光电股份有限公司 | 显示装置的背光源 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235458A (ja) * | 2007-03-19 | 2008-10-02 | Toshiba Corp | 白色発光装置、これを用いてなるバックライトおよび表示装置並びに照明装置 |
JP3168550U (ja) * | 2011-04-05 | 2011-06-16 | 柏友照明科技股▲分▼有限公司 | 光混合式マルチチップパッケージ構造 |
JP2014007342A (ja) * | 2012-06-26 | 2014-01-16 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
JP2014086694A (ja) * | 2012-10-26 | 2014-05-12 | Sharp Corp | 発光装置、及び発光装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8835952B2 (en) * | 2005-08-04 | 2014-09-16 | Cree, Inc. | Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants |
JP2009153712A (ja) * | 2007-12-26 | 2009-07-16 | Olympus Corp | 光源装置およびそれを備えた内視鏡装置 |
TWI354365B (en) * | 2009-08-26 | 2011-12-11 | Quasioptical led package structure for increasing | |
JP5703663B2 (ja) | 2010-09-30 | 2015-04-22 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
TWI419373B (zh) * | 2010-10-22 | 2013-12-11 | Paragon Sc Lighting Tech Co | 使用定電壓電源供應器之多晶封裝結構 |
JP2013004815A (ja) * | 2011-06-17 | 2013-01-07 | Sony Corp | 光源回路ユニットおよび照明装置、並びに表示装置 |
JP5810758B2 (ja) | 2011-08-31 | 2015-11-11 | 日亜化学工業株式会社 | 発光装置 |
CN104081112B (zh) * | 2011-11-07 | 2016-03-16 | 克利公司 | 高电压阵列发光二极管(led)器件、设备和方法 |
-
2014
- 2014-06-10 JP JP2014119622A patent/JP6201904B2/ja active Active
-
2015
- 2015-05-27 US US14/723,311 patent/US9741698B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235458A (ja) * | 2007-03-19 | 2008-10-02 | Toshiba Corp | 白色発光装置、これを用いてなるバックライトおよび表示装置並びに照明装置 |
JP3168550U (ja) * | 2011-04-05 | 2011-06-16 | 柏友照明科技股▲分▼有限公司 | 光混合式マルチチップパッケージ構造 |
JP2014007342A (ja) * | 2012-06-26 | 2014-01-16 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
JP2014086694A (ja) * | 2012-10-26 | 2014-05-12 | Sharp Corp | 発光装置、及び発光装置の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020205392A (ja) * | 2019-06-19 | 2020-12-24 | シチズン電子株式会社 | 発光装置 |
JP7353814B2 (ja) | 2019-06-19 | 2023-10-02 | シチズン電子株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
US9741698B2 (en) | 2017-08-22 |
JP6201904B2 (ja) | 2017-09-27 |
US20150357535A1 (en) | 2015-12-10 |
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