JP2015220370A5 - - Google Patents
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- Publication number
- JP2015220370A5 JP2015220370A5 JP2014103609A JP2014103609A JP2015220370A5 JP 2015220370 A5 JP2015220370 A5 JP 2015220370A5 JP 2014103609 A JP2014103609 A JP 2014103609A JP 2014103609 A JP2014103609 A JP 2014103609A JP 2015220370 A5 JP2015220370 A5 JP 2015220370A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- silicon wafer
- cleaning
- ppb
- haze value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N HF Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014103609A JP6311446B2 (ja) | 2014-05-19 | 2014-05-19 | シリコンウェーハの製造方法 |
TW104101629A TWI553722B (zh) | 2014-05-19 | 2015-01-19 | Silicon wafer manufacturing method and silicon wafer |
CN201510171396.0A CN105097444B (zh) | 2014-05-19 | 2015-04-13 | 硅晶片的制造方法及硅晶片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014103609A JP6311446B2 (ja) | 2014-05-19 | 2014-05-19 | シリコンウェーハの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015220370A JP2015220370A (ja) | 2015-12-07 |
JP2015220370A5 true JP2015220370A5 (sv) | 2016-06-02 |
JP6311446B2 JP6311446B2 (ja) | 2018-04-18 |
Family
ID=54577621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014103609A Active JP6311446B2 (ja) | 2014-05-19 | 2014-05-19 | シリコンウェーハの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6311446B2 (sv) |
CN (1) | CN105097444B (sv) |
TW (1) | TWI553722B (sv) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6432497B2 (ja) * | 2015-12-10 | 2018-12-05 | 信越半導体株式会社 | 研磨方法 |
JP6641197B2 (ja) * | 2016-03-10 | 2020-02-05 | 株式会社荏原製作所 | 基板の研磨装置および研磨方法 |
CN116852183B (zh) * | 2023-08-02 | 2024-04-02 | 山东有研半导体材料有限公司 | 一种用于大型晶圆研磨机改善晶圆形貌的研磨工艺 |
CN117161839B (zh) * | 2023-11-01 | 2024-02-06 | 山东有研艾斯半导体材料有限公司 | 一种改善硅抛光片边缘机械损伤的方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0521412A (ja) * | 1991-07-10 | 1993-01-29 | Fujitsu Ltd | 半導体基板の処理方法 |
JP2000315635A (ja) * | 1999-04-30 | 2000-11-14 | Mitsubishi Materials Silicon Corp | 張り合わせ用シリコンウェーハおよびこれを用いた張り合わせ基板の製造方法 |
JP2004291150A (ja) * | 2003-03-27 | 2004-10-21 | Tungaloy Corp | 立方晶窒化硼素焼結体回転工具 |
WO2006035865A1 (ja) * | 2004-09-30 | 2006-04-06 | Shin-Etsu Handotai Co., Ltd. | 半導体ウェーハの製造方法及び半導体ウェーハ |
EP1801859A4 (en) * | 2004-09-30 | 2009-02-11 | Shinetsu Handotai Kk | SOI WAFER CLEANING METHOD |
WO2008029725A1 (fr) * | 2006-09-06 | 2008-03-13 | Nitta Haas Incorporated | Tampon de polissage |
JP2009252413A (ja) * | 2008-04-02 | 2009-10-29 | Kobe Steel Ltd | 電子線源 |
US20110300776A1 (en) * | 2010-06-03 | 2011-12-08 | Applied Materials, Inc. | Tuning of polishing process in multi-carrier head per platen polishing station |
JP2012001798A (ja) * | 2010-06-21 | 2012-01-05 | Yokogawa Electric Corp | 電解装置用電極の製造方法 |
DE112011102252T5 (de) * | 2010-07-02 | 2013-05-02 | Sumco Corporation | Verfahren zum Polieren von Siliziumwafern |
-
2014
- 2014-05-19 JP JP2014103609A patent/JP6311446B2/ja active Active
-
2015
- 2015-01-19 TW TW104101629A patent/TWI553722B/zh active
- 2015-04-13 CN CN201510171396.0A patent/CN105097444B/zh active Active
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