JP2015195274A - 高周波半導体装置 - Google Patents
高周波半導体装置 Download PDFInfo
- Publication number
- JP2015195274A JP2015195274A JP2014072450A JP2014072450A JP2015195274A JP 2015195274 A JP2015195274 A JP 2015195274A JP 2014072450 A JP2014072450 A JP 2014072450A JP 2014072450 A JP2014072450 A JP 2014072450A JP 2015195274 A JP2015195274 A JP 2015195274A
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- Prior art keywords
- matching circuit
- input
- output
- frequency oscillation
- semiconductor device
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- Granted
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 230000010355 oscillation Effects 0.000 claims abstract description 60
- 230000001629 suppression Effects 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 abstract description 15
- 238000003786 synthesis reaction Methods 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 12
- DFBKLUNHFCTMDC-GKRDHZSOSA-N endrin Chemical compound C([C@@H]1[C@H]2[C@@]3(Cl)C(Cl)=C([C@]([C@H]22)(Cl)C3(Cl)Cl)Cl)[C@@H]2[C@H]2[C@@H]1O2 DFBKLUNHFCTMDC-GKRDHZSOSA-N 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000005669 field effect Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/125—Discriminating pulses
- H03K5/1252—Suppression or limitation of noise or interference
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Amplifiers (AREA)
- Microwave Amplifiers (AREA)
Abstract
Description
11・・・高周波半導体パッケージ
12・・・電界効果トランジスタ(FET)チップ
13・・・入力分配・整合回路
14・・・出力合成・整合回路
15・・・入力リード
16・・・入力パターン
17、18、21、22、32、44・・・接続導体
19・・・出力リード
20・・・出力パターン
23・・・ユニットFET
24・・・半導体基板
25、37・・・絶縁基板
26・・・分配線路
27、39・・・キャパシタ
28、31、40、43・・・抵抗体
29、41・・・誘電体基板
30、42・・・上部電極
33、45・・・低周波発振抑制回路
34、46・・・ワイヤー
35・・・チップキャパシタ
36・・・チップ抵抗
38・・・合流線路
51・・・分配回路
52・・・合流回路
Claims (4)
- 並列に配置された複数のユニットFETと、
これらのユニットFETに接続され、かつ複数に分割された出力端部、および入力端部、を有し、前記入力端部の中心軸に対して左右対称形状である入力分配・整合回路と、
前記複数のユニットFETに接続され、かつ複数に分割された入力端部、および出力端部、を有し、前記出力端部の中心軸に対して左右対称形状である出力合成・整合回路と、
前記入力分配・整合回路の前記入力端部および前記出力合成・整合回路の前記出力端部、のうち、少なくともいずれか一方に接続される低周波発振抑制回路と、
を具備する高周波半導体装置。 - 前記低周波発振抑制回路を複数有し、
これらの低周波発振抑制回路は、前記入力分配・整合回路の前記入力端部および前記出力合成・整合回路の前記出力端部に接続される請求項1に記載の高周波半導体装置。 - 前記低周波発振抑制回路は、ワイヤー、チップキャパシタ、およびチップ抵抗が直列に接続されたものである請求項1または2に記載の高周波半導体装置。
- 前記入力分配・整合回路の前記複数に分割された出力端部の間、および前記出力合成・整合回路の前記複数に分割された入力端部の間、にはそれぞれ、抵抗体が設けられている請求項1乃至3のいずれかに記載の高周波半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014072450A JP6203103B2 (ja) | 2014-03-31 | 2014-03-31 | 高周波半導体装置 |
US14/615,859 US9712142B2 (en) | 2014-03-31 | 2015-02-06 | High frequency semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014072450A JP6203103B2 (ja) | 2014-03-31 | 2014-03-31 | 高周波半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015195274A true JP2015195274A (ja) | 2015-11-05 |
JP6203103B2 JP6203103B2 (ja) | 2017-09-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014072450A Expired - Fee Related JP6203103B2 (ja) | 2014-03-31 | 2014-03-31 | 高周波半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9712142B2 (ja) |
JP (1) | JP6203103B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6273247B2 (ja) * | 2015-12-03 | 2018-01-31 | 株式会社東芝 | 高周波半導体増幅器 |
JP7302925B2 (ja) * | 2018-08-29 | 2023-07-04 | 住友電工デバイス・イノベーション株式会社 | 高周波増幅器 |
TWI742935B (zh) * | 2019-12-20 | 2021-10-11 | 日商村田製作所股份有限公司 | 功率放大模組 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163772A (ja) * | 1996-10-04 | 1998-06-19 | Sanyo Electric Co Ltd | 電力増幅器およびチップキャリヤ |
JPH10233637A (ja) * | 1997-02-20 | 1998-09-02 | Fujitsu Ltd | 高周波電子回路 |
JP2002335136A (ja) * | 2001-05-11 | 2002-11-22 | Matsushita Electric Ind Co Ltd | 高周波半導体装置 |
JP2011254439A (ja) * | 2010-06-04 | 2011-12-15 | Toshiba Corp | 高周波回路 |
JP2012109825A (ja) * | 2010-11-18 | 2012-06-07 | Toshiba Corp | 高周波回路 |
JP2013098339A (ja) * | 2011-10-31 | 2013-05-20 | Sumitomo Electric Device Innovations Inc | 高周波回路装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6005442A (en) * | 1996-03-26 | 1999-12-21 | Matsushita Electric Industrial Co., Ltd. | Divider/combiner |
US6943289B2 (en) * | 2003-12-17 | 2005-09-13 | Freescale Semiconductor, Inc. | Slotted planar power conductor |
JP5238633B2 (ja) | 2009-07-27 | 2013-07-17 | 株式会社東芝 | 半導体装置 |
US8533528B2 (en) * | 2009-12-16 | 2013-09-10 | Hewlett-Packard Development Company, L.P. | Fault tolerant power sequencer |
JP5714924B2 (ja) | 2011-01-28 | 2015-05-07 | ラピスセミコンダクタ株式会社 | 電圧識別装置及び時計制御装置 |
JP2012182438A (ja) | 2011-02-08 | 2012-09-20 | Toshiba Corp | 半導体装置 |
JP5487187B2 (ja) | 2011-11-16 | 2014-05-07 | 株式会社東芝 | 高周波増幅器 |
JP5711778B2 (ja) | 2013-03-06 | 2015-05-07 | 株式会社東芝 | 半導体装置 |
JP2014175368A (ja) | 2013-03-06 | 2014-09-22 | Toshiba Corp | 電界効果トランジスタおよび半導体装置 |
-
2014
- 2014-03-31 JP JP2014072450A patent/JP6203103B2/ja not_active Expired - Fee Related
-
2015
- 2015-02-06 US US14/615,859 patent/US9712142B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163772A (ja) * | 1996-10-04 | 1998-06-19 | Sanyo Electric Co Ltd | 電力増幅器およびチップキャリヤ |
JPH10233637A (ja) * | 1997-02-20 | 1998-09-02 | Fujitsu Ltd | 高周波電子回路 |
JP2002335136A (ja) * | 2001-05-11 | 2002-11-22 | Matsushita Electric Ind Co Ltd | 高周波半導体装置 |
JP2011254439A (ja) * | 2010-06-04 | 2011-12-15 | Toshiba Corp | 高周波回路 |
JP2012109825A (ja) * | 2010-11-18 | 2012-06-07 | Toshiba Corp | 高周波回路 |
JP2013098339A (ja) * | 2011-10-31 | 2013-05-20 | Sumitomo Electric Device Innovations Inc | 高周波回路装置 |
Also Published As
Publication number | Publication date |
---|---|
US20150280697A1 (en) | 2015-10-01 |
US9712142B2 (en) | 2017-07-18 |
JP6203103B2 (ja) | 2017-09-27 |
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