JP2015195178A5 - - Google Patents
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- Publication number
- JP2015195178A5 JP2015195178A5 JP2015024163A JP2015024163A JP2015195178A5 JP 2015195178 A5 JP2015195178 A5 JP 2015195178A5 JP 2015024163 A JP2015024163 A JP 2015024163A JP 2015024163 A JP2015024163 A JP 2015024163A JP 2015195178 A5 JP2015195178 A5 JP 2015195178A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- conductive
- circuit board
- electronic component
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 239000010419 fine particle Substances 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 239000011230 binding agent Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000007771 core particle Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011859 microparticle Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015024163A JP2015195178A (ja) | 2014-03-26 | 2015-02-10 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
| PCT/JP2015/055318 WO2015146434A1 (ja) | 2014-03-26 | 2015-02-25 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
| CN201580016482.2A CN106133846A (zh) | 2014-03-26 | 2015-02-25 | 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 |
| TW104107282A TW201537584A (zh) | 2014-03-26 | 2015-03-06 | 導電性粒子、導電性接著劑、接合體之製造方法、電子零件之連接方法、及接合體 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014063130 | 2014-03-26 | ||
| JP2014063130 | 2014-03-26 | ||
| JP2015024163A JP2015195178A (ja) | 2014-03-26 | 2015-02-10 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015195178A JP2015195178A (ja) | 2015-11-05 |
| JP2015195178A5 true JP2015195178A5 (enrdf_load_stackoverflow) | 2017-12-21 |
Family
ID=54194968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015024163A Pending JP2015195178A (ja) | 2014-03-26 | 2015-02-10 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015195178A (enrdf_load_stackoverflow) |
| CN (1) | CN106133846A (enrdf_load_stackoverflow) |
| TW (1) | TW201537584A (enrdf_load_stackoverflow) |
| WO (1) | WO2015146434A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513673B (zh) * | 2016-02-03 | 2017-07-07 | 郑州职业技术学院 | 一种导电粒子及其制备方法 |
| KR102124997B1 (ko) * | 2018-10-05 | 2020-06-22 | 주식회사 아이에스시 | 도전성 입자의 제조방법 및 그 제조방법으로 제조된 도전성 입자 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4950451B2 (ja) * | 2005-07-29 | 2012-06-13 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| JP4877230B2 (ja) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
| JP5151920B2 (ja) * | 2008-02-05 | 2013-02-27 | 日立化成工業株式会社 | 導電粒子及び導電粒子の製造方法 |
| JP5430093B2 (ja) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法 |
| CN103748636A (zh) * | 2011-12-21 | 2014-04-23 | 积水化学工业株式会社 | 导电性粒子、导电材料及连接结构体 |
| JP6212366B2 (ja) * | 2013-08-09 | 2017-10-11 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| CN105593947B (zh) * | 2014-01-08 | 2019-04-19 | 积水化学工业株式会社 | 背接触式的太阳能电池模块用导电性粒子、导电材料及太阳能电池模块 |
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2015
- 2015-02-10 JP JP2015024163A patent/JP2015195178A/ja active Pending
- 2015-02-25 CN CN201580016482.2A patent/CN106133846A/zh active Pending
- 2015-02-25 WO PCT/JP2015/055318 patent/WO2015146434A1/ja active Application Filing
- 2015-03-06 TW TW104107282A patent/TW201537584A/zh unknown