JP2015195178A5 - - Google Patents
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- Publication number
- JP2015195178A5 JP2015195178A5 JP2015024163A JP2015024163A JP2015195178A5 JP 2015195178 A5 JP2015195178 A5 JP 2015195178A5 JP 2015024163 A JP2015024163 A JP 2015024163A JP 2015024163 A JP2015024163 A JP 2015024163A JP 2015195178 A5 JP2015195178 A5 JP 2015195178A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- conductive
- circuit board
- electronic component
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002245 particle Substances 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 239000010419 fine particle Substances 0.000 claims 6
- 230000001070 adhesive Effects 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 239000011230 binding agent Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000007771 core particle Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- HPCHGGAMBXTKGB-UHFFFAOYSA-N $l^{1}-alumanyloxysilicon Chemical compound [Al]O[Si] HPCHGGAMBXTKGB-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011859 microparticle Substances 0.000 claims 1
- CNRZQDQNVUKEJG-UHFFFAOYSA-N oxo-bis(oxoalumanyloxy)titanium Chemical compound O=[Al]O[Ti](=O)O[Al]=O CNRZQDQNVUKEJG-UHFFFAOYSA-N 0.000 claims 1
Claims (15)
前記コア粒子を被覆する第２の金属層と、
前記第２の金属層に配置される微粒子と、
前記第２の金属層と前記微粒子とを共に被覆する第１の金属層とを備える導電性粒子。 Core particles,
A second metal layer covering the core particles;
Fine particles disposed in the second metal layer;
Electroconductive particle provided with the 1st metal layer which coat | covers both the said 2nd metal layer and the said microparticles | fine-particles.
前記電子部品の上から熱圧着ツールによって加熱押圧し、前記回路基板及び前記電子部品の各電極間に前記導電性粒子が挟持された状態で前記バインダー樹脂を硬化させる工程を有する、回路基板に電子部品が接続された接続体の製造方法。The circuit board is heated and pressed by a thermocompression bonding tool from above the electronic component, and the binder resin is cured in a state where the conductive particles are sandwiched between the electrodes of the circuit board and the electronic component. A method of manufacturing a connection body to which components are connected.
前記電子部品の上から熱圧着ツールによって加熱押圧し、前記回路基板及び前記電子部品の各電極間に前記導電性粒子が挟持された状態で前記バインダー樹脂を硬化させる工程を有する、回路基板に電子部品を接続する接続方法。The circuit board is heated and pressed by a thermocompression bonding tool from above the electronic component, and the binder resin is cured in a state where the conductive particles are sandwiched between the electrodes of the circuit board and the electronic component. Connection method for connecting parts.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015024163A JP2015195178A (en) | 2014-03-26 | 2015-02-10 | Conductive particle, conductive adhesive, method for producing connection body, method for connecting electronic component, and connection body |
| CN201580016482.2A CN106133846A (en) | 2014-03-26 | 2015-02-25 | Conducting particles, conductive adhesive, the manufacture method of connector, the method for attachment of electronic unit and connector |
| PCT/JP2015/055318 WO2015146434A1 (en) | 2014-03-26 | 2015-02-25 | Electroconductive particles, electroconductive adhesive, method for manufacturing connection body, method for connecting electronic component, and connection body |
| TW104107282A TW201537584A (en) | 2014-03-26 | 2015-03-06 | Electrically conductive particles, electrically conductive adhesive, production method of connected body, connecting method of electronic component, and connected body |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014063130 | 2014-03-26 | ||
| JP2014063130 | 2014-03-26 | ||
| JP2015024163A JP2015195178A (en) | 2014-03-26 | 2015-02-10 | Conductive particle, conductive adhesive, method for producing connection body, method for connecting electronic component, and connection body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015195178A JP2015195178A (en) | 2015-11-05 |
| JP2015195178A5 true JP2015195178A5 (en) | 2017-12-21 |
Family
ID=54194968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015024163A Pending JP2015195178A (en) | 2014-03-26 | 2015-02-10 | Conductive particle, conductive adhesive, method for producing connection body, method for connecting electronic component, and connection body |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015195178A (en) |
| CN (1) | CN106133846A (en) |
| TW (1) | TW201537584A (en) |
| WO (1) | WO2015146434A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513673B (en) * | 2016-02-03 | 2017-07-07 | 郑州职业技术学院 | A kind of conducting particles and preparation method thereof |
| KR102124997B1 (en) * | 2018-10-05 | 2020-06-22 | 주식회사 아이에스시 | Manufacturing method of conductive particle and conductive particle manufactured by the method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4950451B2 (en) * | 2005-07-29 | 2012-06-13 | 積水化学工業株式会社 | Conductive fine particles, anisotropic conductive material, and connection structure |
| CN101309993B (en) * | 2005-11-18 | 2012-06-27 | 日立化成工业株式会社 | Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
| JP5151920B2 (en) * | 2008-02-05 | 2013-02-27 | 日立化成工業株式会社 | Conductive particles and method for producing conductive particles |
| JP5430093B2 (en) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | Conductive particles, anisotropic conductive film, joined body, and connection method |
| KR101942602B1 (en) * | 2011-12-21 | 2019-01-25 | 세키스이가가쿠 고교가부시키가이샤 | Conductive particles, conductive material, and connection structure |
| JP6212366B2 (en) * | 2013-08-09 | 2017-10-11 | 積水化学工業株式会社 | Conductive particles, conductive materials, and connection structures |
| KR20160106004A (en) * | 2014-01-08 | 2016-09-09 | 세키스이가가쿠 고교가부시키가이샤 | Conductive particles for back contact solar cell modules, conductive material, and solar cell module |
-
2015
- 2015-02-10 JP JP2015024163A patent/JP2015195178A/en active Pending
- 2015-02-25 CN CN201580016482.2A patent/CN106133846A/en active Pending
- 2015-02-25 WO PCT/JP2015/055318 patent/WO2015146434A1/en active Application Filing
- 2015-03-06 TW TW104107282A patent/TW201537584A/en unknown
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