JP2016127011A5 - - Google Patents
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- Publication number
- JP2016127011A5 JP2016127011A5 JP2015242161A JP2015242161A JP2016127011A5 JP 2016127011 A5 JP2016127011 A5 JP 2016127011A5 JP 2015242161 A JP2015242161 A JP 2015242161A JP 2015242161 A JP2015242161 A JP 2015242161A JP 2016127011 A5 JP2016127011 A5 JP 2016127011A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- connection
- conductive film
- target member
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 12
- 229920001187 thermosetting polymer Polymers 0.000 claims 11
- 150000001875 compounds Chemical class 0.000 claims 9
- 239000002245 particle Substances 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- 239000012965 benzophenone Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014265714 | 2014-12-26 | ||
| JP2014265714 | 2014-12-26 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016127011A JP2016127011A (ja) | 2016-07-11 |
| JP2016127011A5 true JP2016127011A5 (enrdf_load_stackoverflow) | 2018-07-05 |
| JP6557591B2 JP6557591B2 (ja) | 2019-08-07 |
Family
ID=56358109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015242161A Active JP6557591B2 (ja) | 2014-12-26 | 2015-12-11 | 導電フィルム、接続構造体及び接続構造体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6557591B2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017045542A (ja) * | 2015-08-24 | 2017-03-02 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
| JP6626300B2 (ja) * | 2015-09-28 | 2019-12-25 | 積水化学工業株式会社 | 半導体用接着剤及び半導体装置 |
| JP2020047590A (ja) * | 2018-09-18 | 2020-03-26 | 積水化学工業株式会社 | 導電フィルム及び接続構造体 |
| JP7032367B2 (ja) * | 2019-10-25 | 2022-03-08 | デクセリアルズ株式会社 | 接続体の製造方法、異方性導電接合材料、及び接続体 |
| US20230070488A1 (en) * | 2020-02-07 | 2023-03-09 | Dexerials Corporation | Method for manufacturing connection body, and connection body |
| CN115053640B (zh) * | 2020-02-07 | 2024-11-19 | 迪睿合株式会社 | 连接体的制造方法以及连接体 |
| CN115244786A (zh) * | 2020-03-19 | 2022-10-25 | 迪睿合株式会社 | 连接体以及连接体的制造方法 |
| JP2022149722A (ja) * | 2021-03-25 | 2022-10-07 | 太陽インキ製造株式会社 | 導電性樹脂組成物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6114627B2 (ja) * | 2012-05-18 | 2017-04-12 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
| JP2014102943A (ja) * | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
| CN107615401A (zh) * | 2015-08-24 | 2018-01-19 | 积水化学工业株式会社 | 导电材料以及连接结构体 |
| JP6581434B2 (ja) * | 2015-08-24 | 2019-09-25 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
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2015
- 2015-12-11 JP JP2015242161A patent/JP6557591B2/ja active Active