JP2015195178A - 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 - Google Patents

導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 Download PDF

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Publication number
JP2015195178A
JP2015195178A JP2015024163A JP2015024163A JP2015195178A JP 2015195178 A JP2015195178 A JP 2015195178A JP 2015024163 A JP2015024163 A JP 2015024163A JP 2015024163 A JP2015024163 A JP 2015024163A JP 2015195178 A JP2015195178 A JP 2015195178A
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JP
Japan
Prior art keywords
metal layer
particles
conductive
conductive particles
evaluation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015024163A
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English (en)
Japanese (ja)
Other versions
JP2015195178A5 (enrdf_load_stackoverflow
Inventor
達朗 深谷
Tatsuro Fukaya
達朗 深谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2015024163A priority Critical patent/JP2015195178A/ja
Priority to PCT/JP2015/055318 priority patent/WO2015146434A1/ja
Priority to CN201580016482.2A priority patent/CN106133846A/zh
Priority to TW104107282A priority patent/TW201537584A/zh
Publication of JP2015195178A publication Critical patent/JP2015195178A/ja
Publication of JP2015195178A5 publication Critical patent/JP2015195178A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2015024163A 2014-03-26 2015-02-10 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 Pending JP2015195178A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015024163A JP2015195178A (ja) 2014-03-26 2015-02-10 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体
PCT/JP2015/055318 WO2015146434A1 (ja) 2014-03-26 2015-02-25 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体
CN201580016482.2A CN106133846A (zh) 2014-03-26 2015-02-25 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体
TW104107282A TW201537584A (zh) 2014-03-26 2015-03-06 導電性粒子、導電性接著劑、接合體之製造方法、電子零件之連接方法、及接合體

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014063130 2014-03-26
JP2014063130 2014-03-26
JP2015024163A JP2015195178A (ja) 2014-03-26 2015-02-10 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体

Publications (2)

Publication Number Publication Date
JP2015195178A true JP2015195178A (ja) 2015-11-05
JP2015195178A5 JP2015195178A5 (enrdf_load_stackoverflow) 2017-12-21

Family

ID=54194968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015024163A Pending JP2015195178A (ja) 2014-03-26 2015-02-10 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体

Country Status (4)

Country Link
JP (1) JP2015195178A (enrdf_load_stackoverflow)
CN (1) CN106133846A (enrdf_load_stackoverflow)
TW (1) TW201537584A (enrdf_load_stackoverflow)
WO (1) WO2015146434A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105513673B (zh) * 2016-02-03 2017-07-07 郑州职业技术学院 一种导电粒子及其制备方法
KR102124997B1 (ko) * 2018-10-05 2020-06-22 주식회사 아이에스시 도전성 입자의 제조방법 및 그 제조방법으로 제조된 도전성 입자

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231326A (ja) * 2005-11-18 2011-11-17 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
WO2013094636A1 (ja) * 2011-12-21 2013-06-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015057757A (ja) * 2013-08-09 2015-03-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4950451B2 (ja) * 2005-07-29 2012-06-13 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
JPWO2015105119A1 (ja) * 2014-01-08 2017-03-23 積水化学工業株式会社 バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231326A (ja) * 2005-11-18 2011-11-17 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
WO2013094636A1 (ja) * 2011-12-21 2013-06-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015057757A (ja) * 2013-08-09 2015-03-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
CN106133846A (zh) 2016-11-16
WO2015146434A1 (ja) 2015-10-01
TW201537584A (zh) 2015-10-01

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