CN106133846A - 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 - Google Patents
导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 Download PDFInfo
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- CN106133846A CN106133846A CN201580016482.2A CN201580016482A CN106133846A CN 106133846 A CN106133846 A CN 106133846A CN 201580016482 A CN201580016482 A CN 201580016482A CN 106133846 A CN106133846 A CN 106133846A
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- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014063130 | 2014-03-26 | ||
| JP2014-063130 | 2014-03-26 | ||
| JP2015024163A JP2015195178A (ja) | 2014-03-26 | 2015-02-10 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
| JP2015-024163 | 2015-02-10 | ||
| PCT/JP2015/055318 WO2015146434A1 (ja) | 2014-03-26 | 2015-02-25 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106133846A true CN106133846A (zh) | 2016-11-16 |
Family
ID=54194968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580016482.2A Pending CN106133846A (zh) | 2014-03-26 | 2015-02-25 | 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015195178A (enrdf_load_stackoverflow) |
| CN (1) | CN106133846A (enrdf_load_stackoverflow) |
| TW (1) | TW201537584A (enrdf_load_stackoverflow) |
| WO (1) | WO2015146434A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513673B (zh) * | 2016-02-03 | 2017-07-07 | 郑州职业技术学院 | 一种导电粒子及其制备方法 |
| KR102124997B1 (ko) * | 2018-10-05 | 2020-06-22 | 주식회사 아이에스시 | 도전성 입자의 제조방법 및 그 제조방법으로 제조된 도전성 입자 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102089832A (zh) * | 2008-07-24 | 2011-06-08 | 索尼化学&信息部件株式会社 | 导电性粒子、各向异性导电膜、接合体以及连接方法 |
| JP4950451B2 (ja) * | 2005-07-29 | 2012-06-13 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| WO2013094636A1 (ja) * | 2011-12-21 | 2013-06-27 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| CN103594146A (zh) * | 2008-02-05 | 2014-02-19 | 日立化成工业株式会社 | 导电粒子及导电粒子的制造方法 |
| CN105593947A (zh) * | 2014-01-08 | 2016-05-18 | 积水化学工业株式会社 | 背接触式的太阳能电池模块用导电性粒子、导电材料及太阳能电池模块 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4877230B2 (ja) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
| JP6212366B2 (ja) * | 2013-08-09 | 2017-10-11 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
-
2015
- 2015-02-10 JP JP2015024163A patent/JP2015195178A/ja active Pending
- 2015-02-25 CN CN201580016482.2A patent/CN106133846A/zh active Pending
- 2015-02-25 WO PCT/JP2015/055318 patent/WO2015146434A1/ja active Application Filing
- 2015-03-06 TW TW104107282A patent/TW201537584A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4950451B2 (ja) * | 2005-07-29 | 2012-06-13 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| CN103594146A (zh) * | 2008-02-05 | 2014-02-19 | 日立化成工业株式会社 | 导电粒子及导电粒子的制造方法 |
| CN102089832A (zh) * | 2008-07-24 | 2011-06-08 | 索尼化学&信息部件株式会社 | 导电性粒子、各向异性导电膜、接合体以及连接方法 |
| WO2013094636A1 (ja) * | 2011-12-21 | 2013-06-27 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| CN103748636A (zh) * | 2011-12-21 | 2014-04-23 | 积水化学工业株式会社 | 导电性粒子、导电材料及连接结构体 |
| CN105593947A (zh) * | 2014-01-08 | 2016-05-18 | 积水化学工业株式会社 | 背接触式的太阳能电池模块用导电性粒子、导电材料及太阳能电池模块 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201537584A (zh) | 2015-10-01 |
| JP2015195178A (ja) | 2015-11-05 |
| WO2015146434A1 (ja) | 2015-10-01 |
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