JP2015182125A5 - - Google Patents

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Publication number
JP2015182125A5
JP2015182125A5 JP2014062417A JP2014062417A JP2015182125A5 JP 2015182125 A5 JP2015182125 A5 JP 2015182125A5 JP 2014062417 A JP2014062417 A JP 2014062417A JP 2014062417 A JP2014062417 A JP 2014062417A JP 2015182125 A5 JP2015182125 A5 JP 2015182125A5
Authority
JP
Japan
Prior art keywords
long
chain
flux
chain dibasic
dibasic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014062417A
Other languages
English (en)
Japanese (ja)
Other versions
JP5952849B2 (ja
JP2015182125A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014062417A external-priority patent/JP5952849B2/ja
Priority to JP2014062417A priority Critical patent/JP5952849B2/ja
Priority to CN201580016031.9A priority patent/CN106132629B/zh
Priority to PCT/JP2015/055781 priority patent/WO2015146473A1/ja
Priority to US15/128,231 priority patent/US9902022B2/en
Priority to EP15770209.3A priority patent/EP3124167B1/en
Priority to KR1020167029054A priority patent/KR101712787B1/ko
Priority to TW104106780A priority patent/TWI596154B/zh
Publication of JP2015182125A publication Critical patent/JP2015182125A/ja
Publication of JP2015182125A5 publication Critical patent/JP2015182125A5/ja
Publication of JP5952849B2 publication Critical patent/JP5952849B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014062417A 2014-03-25 2014-03-25 フラックス及びソルダペースト Active JP5952849B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014062417A JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト
EP15770209.3A EP3124167B1 (en) 2014-03-25 2015-02-27 Flux and solder paste
PCT/JP2015/055781 WO2015146473A1 (ja) 2014-03-25 2015-02-27 フラックス及びソルダペースト
US15/128,231 US9902022B2 (en) 2014-03-25 2015-02-27 Flux and solder paste
CN201580016031.9A CN106132629B (zh) 2014-03-25 2015-02-27 助焊剂及焊膏
KR1020167029054A KR101712787B1 (ko) 2014-03-25 2015-02-27 플럭스 및 솔더 페이스트
TW104106780A TWI596154B (zh) 2014-03-25 2015-03-04 Flux and solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014062417A JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト

Publications (3)

Publication Number Publication Date
JP2015182125A JP2015182125A (ja) 2015-10-22
JP2015182125A5 true JP2015182125A5 (https=) 2016-03-31
JP5952849B2 JP5952849B2 (ja) 2016-07-13

Family

ID=54195004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014062417A Active JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト

Country Status (7)

Country Link
US (1) US9902022B2 (https=)
EP (1) EP3124167B1 (https=)
JP (1) JP5952849B2 (https=)
KR (1) KR101712787B1 (https=)
CN (1) CN106132629B (https=)
TW (1) TWI596154B (https=)
WO (1) WO2015146473A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5962832B1 (ja) * 2015-09-18 2016-08-03 千住金属工業株式会社 フラックス
JP2017130623A (ja) * 2016-01-22 2017-07-27 株式会社村田製作所 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法
JP2017183571A (ja) * 2016-03-31 2017-10-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6536503B2 (ja) * 2016-07-12 2019-07-03 千住金属工業株式会社 フラックス
JP6399242B1 (ja) 2018-01-17 2018-10-03 千住金属工業株式会社 フラックス及びソルダペースト
US12138714B2 (en) 2018-03-09 2024-11-12 Origin Company, Limited Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package
US11833622B2 (en) 2018-08-10 2023-12-05 Koki Company Limited Flux and solder paste
US12240061B2 (en) 2020-03-17 2025-03-04 Panasonic Intellectual Property Management Co., Ltd. Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure
JP7620916B2 (ja) 2020-12-17 2025-01-24 パナソニックＩｐマネジメント株式会社 フラックス用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6971163B1 (en) 1998-04-22 2005-12-06 Dow Corning Corporation Adhesive and encapsulating material with fluxing properties
GB9808587D0 (en) * 1998-04-22 1998-06-24 Craig Hugh P Adhesive and encapsulating material with fluxing properties
JP4504481B2 (ja) * 1998-11-26 2010-07-14 岡村製油株式会社 長鎖二塩基酸組成物及びこれを用いる電解液
JP3849842B2 (ja) * 1999-10-05 2006-11-22 Ｔｄｋ株式会社 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
TW527253B (en) * 1999-10-05 2003-04-11 Tdk Corp Soldering flux, soldering paste and soldering process
JP2001219294A (ja) * 1999-12-03 2001-08-14 Tdk Corp 熱硬化性はんだ付け用フラックスおよびはんだ付け方法
WO2001047660A1 (en) * 1999-12-27 2001-07-05 Sumitomo Bakelite Company, Ltd. Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
JP3791403B2 (ja) 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
JP3888573B2 (ja) 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3702418B2 (ja) * 2002-03-07 2005-10-05 株式会社 東京第一商興 ソルダペースト用フラックス及びソルダペースト
WO2006064849A1 (ja) * 2004-12-15 2006-06-22 Tamurakaken Corporation 導電性接着剤、これを用いた導電部及び電子部品モジュール
US8227536B2 (en) 2005-08-11 2012-07-24 Senju Metal Industry Co., Ltd. Lead-free solder paste and its use
JP5760170B2 (ja) * 2010-11-30 2015-08-05 パナソニックＩｐマネジメント株式会社 はんだペースト
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
KR20140116216A (ko) 2012-02-24 2014-10-01 히타치가세이가부시끼가이샤 반도체용 접착제, 플럭스제, 반도체 장치의 제조 방법 및 반도체 장치

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