JP2015160250A5 - - Google Patents

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Publication number
JP2015160250A5
JP2015160250A5 JP2014034825A JP2014034825A JP2015160250A5 JP 2015160250 A5 JP2015160250 A5 JP 2015160250A5 JP 2014034825 A JP2014034825 A JP 2014034825A JP 2014034825 A JP2014034825 A JP 2014034825A JP 2015160250 A5 JP2015160250 A5 JP 2015160250A5
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JP
Japan
Prior art keywords
workpiece
static pressure
water
pad
pressure pad
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Application number
JP2014034825A
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English (en)
Japanese (ja)
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JP6250435B2 (ja
JP2015160250A (ja
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Application filed filed Critical
Priority to JP2014034825A priority Critical patent/JP6250435B2/ja
Priority claimed from JP2014034825A external-priority patent/JP6250435B2/ja
Priority to CN201510083693.XA priority patent/CN104858736B/zh
Priority to TW104105971A priority patent/TWI641449B/zh
Priority to KR1020150026513A priority patent/KR102241071B1/ko
Publication of JP2015160250A publication Critical patent/JP2015160250A/ja
Publication of JP2015160250A5 publication Critical patent/JP2015160250A5/ja
Application granted granted Critical
Publication of JP6250435B2 publication Critical patent/JP6250435B2/ja
Active legal-status Critical Current
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JP2014034825A 2014-02-26 2014-02-26 両頭平面研削法 Active JP6250435B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014034825A JP6250435B2 (ja) 2014-02-26 2014-02-26 両頭平面研削法
CN201510083693.XA CN104858736B (zh) 2014-02-26 2015-02-16 双头平面磨削方法
TW104105971A TWI641449B (zh) 2014-02-26 2015-02-25 兩頭平面磨削法
KR1020150026513A KR102241071B1 (ko) 2014-02-26 2015-02-25 양두 평면 연삭법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014034825A JP6250435B2 (ja) 2014-02-26 2014-02-26 両頭平面研削法

Publications (3)

Publication Number Publication Date
JP2015160250A JP2015160250A (ja) 2015-09-07
JP2015160250A5 true JP2015160250A5 (enrdf_load_stackoverflow) 2016-08-18
JP6250435B2 JP6250435B2 (ja) 2017-12-20

Family

ID=53905124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014034825A Active JP6250435B2 (ja) 2014-02-26 2014-02-26 両頭平面研削法

Country Status (4)

Country Link
JP (1) JP6250435B2 (enrdf_load_stackoverflow)
KR (1) KR102241071B1 (enrdf_load_stackoverflow)
CN (1) CN104858736B (enrdf_load_stackoverflow)
TW (1) TWI641449B (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5969720B1 (ja) 2016-02-17 2016-08-17 日本精工株式会社 研削装置
CN106271980B (zh) * 2016-08-01 2018-10-26 湘潭大学 一种高静液压磨削设备及磨削方法
JP6814009B2 (ja) * 2016-10-04 2021-01-13 株式会社ディスコ 搬送パッド及びウエーハの搬送方法
CN109227667B (zh) * 2018-08-30 2020-12-29 重庆水利电力职业技术学院 装饰板施工用切割打磨装置
CN109352445B (zh) * 2018-12-05 2019-11-12 江苏博克斯科技股份有限公司 一种用于电子产品内部板件的打磨装置及其工作方法
CN110509134B (zh) * 2019-09-12 2021-04-09 西安奕斯伟硅片技术有限公司 一种晶圆研磨装置
CN114274041B (zh) * 2021-12-24 2023-03-14 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN115256081A (zh) * 2022-10-08 2022-11-01 徐州晨晓精密机械制造有限公司 一种五金件打磨装置
CN115781477B (zh) * 2022-12-29 2024-10-08 苏州市豪致达精密机械有限公司 一种用于金属连接件的精加工成型设备及其成型工艺
CN116117682B (zh) * 2023-03-31 2024-04-12 西安奕斯伟材料科技股份有限公司 静压垫、研磨设备及硅片
CN116160356B (zh) * 2023-04-18 2023-08-22 西安奕斯伟材料科技股份有限公司 静压支撑件、双面研磨装置和双面研磨方法
CN117359488A (zh) * 2023-10-17 2024-01-09 广东豪特曼机床股份有限公司 一种用于周边磨床的装夹行程控制装置及控制方法
CN119282911A (zh) * 2024-11-19 2025-01-10 西安奕斯伟材料科技股份有限公司 一种硅片定位组件及硅片研磨设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3571310B2 (ja) * 2001-06-12 2004-09-29 コマツ電子金属株式会社 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
JP4541824B2 (ja) * 2004-10-14 2010-09-08 リンテック株式会社 非接触型吸着保持装置
JP4752475B2 (ja) * 2005-12-08 2011-08-17 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法
JP3136316U (ja) * 2007-07-03 2007-10-25 博 明石 ディスク非接触脱着器
JP4985451B2 (ja) * 2008-02-14 2012-07-25 信越半導体株式会社 ワークの両頭研削装置およびワークの両頭研削方法
JP5463570B2 (ja) * 2008-10-31 2014-04-09 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウェハ用両頭研削装置および両頭研削方法
JP5437680B2 (ja) * 2009-03-30 2014-03-12 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの両面研削装置及び両面研削方法
JP5777549B2 (ja) * 2012-03-23 2015-09-09 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5872947B2 (ja) * 2012-04-05 2016-03-01 光洋機械工業株式会社 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤
JP5820329B2 (ja) * 2012-04-24 2015-11-24 光洋機械工業株式会社 両頭平面研削法及び両頭平面研削盤

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