JP2015111067A5 - - Google Patents

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Publication number
JP2015111067A5
JP2015111067A5 JP2013253110A JP2013253110A JP2015111067A5 JP 2015111067 A5 JP2015111067 A5 JP 2015111067A5 JP 2013253110 A JP2013253110 A JP 2013253110A JP 2013253110 A JP2013253110 A JP 2013253110A JP 2015111067 A5 JP2015111067 A5 JP 2015111067A5
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JP
Japan
Prior art keywords
circuit board
flexible circuit
electronic component
sensor module
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013253110A
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English (en)
Japanese (ja)
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JP2015111067A (ja
JP6030539B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2013253110A external-priority patent/JP6030539B2/ja
Priority to JP2013253110A priority Critical patent/JP6030539B2/ja
Priority to US14/560,818 priority patent/US9772242B2/en
Priority to CN201410730593.7A priority patent/CN104697699B/zh
Priority to EP14196600.2A priority patent/EP2889599B1/en
Priority to CN201911064121.1A priority patent/CN110763392A/zh
Publication of JP2015111067A publication Critical patent/JP2015111067A/ja
Publication of JP2015111067A5 publication Critical patent/JP2015111067A5/ja
Publication of JP6030539B2 publication Critical patent/JP6030539B2/ja
Application granted granted Critical
Priority to US15/641,807 priority patent/US10113926B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013253110A 2013-12-06 2013-12-06 センサモジュール及び物理量測定センサ Active JP6030539B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013253110A JP6030539B2 (ja) 2013-12-06 2013-12-06 センサモジュール及び物理量測定センサ
US14/560,818 US9772242B2 (en) 2013-12-06 2014-12-04 Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projection
CN201911064121.1A CN110763392A (zh) 2013-12-06 2014-12-05 物理量测定传感器以及传感器模块
EP14196600.2A EP2889599B1 (en) 2013-12-06 2014-12-05 Physical quantity measuring sensor and sensor module
CN201410730593.7A CN104697699B (zh) 2013-12-06 2014-12-05 物理量测定传感器以及传感器模块
US15/641,807 US10113926B2 (en) 2013-12-06 2017-07-05 Ceramic sensor module including diaphragm and cylindrical portion integrated with the diaphragm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013253110A JP6030539B2 (ja) 2013-12-06 2013-12-06 センサモジュール及び物理量測定センサ

Publications (3)

Publication Number Publication Date
JP2015111067A JP2015111067A (ja) 2015-06-18
JP2015111067A5 true JP2015111067A5 (enExample) 2015-12-24
JP6030539B2 JP6030539B2 (ja) 2016-11-24

Family

ID=53525991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013253110A Active JP6030539B2 (ja) 2013-12-06 2013-12-06 センサモジュール及び物理量測定センサ

Country Status (1)

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JP (1) JP6030539B2 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966039A (en) * 1988-04-21 1990-10-30 Marelli Autronica S.P.A. Electrical force and/or deformation sensor, particularly for use as a pressure sensor
JP2002310826A (ja) * 2001-02-08 2002-10-23 Tgk Co Ltd 圧力センサの調整方法
JP2006078379A (ja) * 2004-09-10 2006-03-23 Tgk Co Ltd 圧力センサおよびその製造方法
US8476087B2 (en) * 2011-04-21 2013-07-02 Freescale Semiconductor, Inc. Methods for fabricating sensor device package using a sealing structure

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