JP2015111067A5 - - Google Patents
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- Publication number
- JP2015111067A5 JP2015111067A5 JP2013253110A JP2013253110A JP2015111067A5 JP 2015111067 A5 JP2015111067 A5 JP 2015111067A5 JP 2013253110 A JP2013253110 A JP 2013253110A JP 2013253110 A JP2013253110 A JP 2013253110A JP 2015111067 A5 JP2015111067 A5 JP 2015111067A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- electronic component
- sensor module
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
Description
本発明の物理量測定センサは、被測定流体を導入する導入孔が形成された筒状の突出部を有する継手と、この継手の突出部の被測定流体の流れ方向の下流側に配置される前述のセンサモジュールと、一端が前記センサモジュールに電気的に接続され他端がターミナル端子と電気的に接続されたフレキシブル回路基板とを備え、このフレキシブル回路基板の一端は、前記ダイアフラム部の平面上であって前記変位部とは異なる位置に接続されていることを特徴とする。
この構成では、センサモジュールに電子部品を直接取り付けることで、撓みやすいフレキシブル回路基板に電子部品を取り付けることを要しない。
従って、電子部品のセンサモジュールへの取付作業が容易となる。しかも、フレキシブル回路基板には電子部品が取り付けられていないことから、フレキシブル回路基板をセンサモジュールやターミナル端子に接続する際に、電子部品が邪魔になることがなく、物理量測定センサの組立作業を容易に行える。
The physical quantity measuring sensor according to the present invention is a joint having a cylindrical projecting portion in which an introduction hole for introducing a fluid to be measured is formed and the projecting portion of the joint disposed on the downstream side in the flow direction of the fluid to be measured. And a flexible circuit board having one end electrically connected to the sensor module and the other end electrically connected to a terminal terminal. One end of the flexible circuit board is on the plane of the diaphragm portion. And it is connected to the position different from the said displacement part, It is characterized by the above-mentioned.
In this configuration, by attaching the electronic component directly to the sensor module, it is not necessary to attach the electronic component to the flexible circuit board that is easily bent.
Accordingly, it is easy to attach the electronic component to the sensor module . Moreover, since no electronic parts are attached to the flexible circuit board, the electronic parts do not get in the way when connecting the flexible circuit board to the sensor module or terminal terminals, and the assembly work of the physical quantity measurement sensor is easy. Can be done.
（２）電子部品６がダイアフラム部２１に取り付けられたセンサモジュール２と、第一端部５１がターミナル端子４に接続され第二端部５２がセンサモジュール２に電気的に接続されたフレキシブル回路基板５とを備え、フレキシブル回路基板５の第二端部５２がダイアフラム部２１の平面上であって変位部２１０の平面中央部２１Ａから離れた平面外周部２１Ｂに接続されている。そのため、撓みやすいフレキシブル回路基板５に電子部品６を取り付けることを要しないので、電子部品６のセンサモジュール２への取付作業が容易となる。しかも、フレキシブル回路基板５には電子部品６が取り付けられていないことから、フレキシブル回路基板５をセンサモジュール２やターミナル端子４に接続する際に、電子部品６が邪魔になることがない。 (2) The sensor module 2 in which the electronic component 6 is attached to the diaphragm portion 21 and the flexible circuit board in which the first end portion 51 is connected to the terminal terminal 4 and the second end portion 52 is electrically connected to the sensor module 2. 5, and the second end 52 of the flexible circuit board 5 is connected to the planar outer peripheral portion 21 </ b> B on the plane of the diaphragm portion 21 and away from the planar central portion 21 </ b> A of the displacement portion 210. Therefore, since it is not necessary to attach the electronic component 6 to the flexible circuit board 5 that is easily bent, the mounting operation of the electronic component 6 to the sensor module 2 is facilitated. Moreover, since the electronic component 6 is not attached to the flexible circuit board 5, the electronic component 6 does not get in the way when the flexible circuit board 5 is connected to the sensor module 2 or the terminal terminal 4.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013253110A JP6030539B2 (en) | 2013-12-06 | 2013-12-06 | Sensor module and physical quantity sensor |
| US14/560,818 US9772242B2 (en) | 2013-12-06 | 2014-12-04 | Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projection |
| CN201410730593.7A CN104697699B (en) | 2013-12-06 | 2014-12-05 | Physical quantity measuring sensor and sensor module |
| EP14196600.2A EP2889599B1 (en) | 2013-12-06 | 2014-12-05 | Physical quantity measuring sensor and sensor module |
| CN201911064121.1A CN110763392A (en) | 2013-12-06 | 2014-12-05 | Physical quantity measuring sensor and sensor module |
| US15/641,807 US10113926B2 (en) | 2013-12-06 | 2017-07-05 | Ceramic sensor module including diaphragm and cylindrical portion integrated with the diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013253110A JP6030539B2 (en) | 2013-12-06 | 2013-12-06 | Sensor module and physical quantity sensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015111067A JP2015111067A (en) | 2015-06-18 |
| JP2015111067A5 true JP2015111067A5 (en) | 2015-12-24 |
| JP6030539B2 JP6030539B2 (en) | 2016-11-24 |
Family
ID=53525991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013253110A Active JP6030539B2 (en) | 2013-12-06 | 2013-12-06 | Sensor module and physical quantity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6030539B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4966039A (en) * | 1988-04-21 | 1990-10-30 | Marelli Autronica S.P.A. | Electrical force and/or deformation sensor, particularly for use as a pressure sensor |
| JP2002310826A (en) * | 2001-02-08 | 2002-10-23 | Tgk Co Ltd | Adjusting method of pressure sensor |
| JP2006078379A (en) * | 2004-09-10 | 2006-03-23 | Tgk Co Ltd | Pressure sensor and manufacturing method therefor |
| US8476087B2 (en) * | 2011-04-21 | 2013-07-02 | Freescale Semiconductor, Inc. | Methods for fabricating sensor device package using a sealing structure |
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2013
- 2013-12-06 JP JP2013253110A patent/JP6030539B2/en active Active
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