JP2015111067A - Sensor module, and physical quantity measurement sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor module capable of facilitating connection work to an electronic component.SOLUTION: A ceramic sensor module 2 is provided with a diaphragm part 21 having a displacement portion 210 and a cylindrical part 22 integrally formed with the diaphragm part 21. An electronic component 6 is arranged on a plane of the diaphragm part 21. The electronic component 6 includes: a component body 61 arranged with a space separated from a plane central portion 21A corresponding the displacement portion 210 in the plane of the diaphragm part 21; and lead frames 62 each with a base end that is connected to the component body 61 and with a tip end that is joined to a plane outer peripheral portion 21B other than the plane central portion 21A.

Description

  The present invention relates to a sensor module and a physical quantity measurement sensor that includes the sensor module and measures the pressure and other physical quantities of a fluid to be measured.

As a physical quantity measurement sensor, there is a pressure sensor in which a sensor module in which a detection unit for detecting the pressure of a fluid to be measured is formed is provided in a joint.
This pressure sensor includes a connector provided with a terminal terminal and a housing part provided with a sensor module, and a signal detected by the sensor module is sent to the terminal terminal via an electronic component.

As this pressure sensor, one end of a flexible circuit board is connected to the detection part of the diaphragm member, an amplifier circuit composed of a circuit component is mounted on the other end of the flexible circuit board, and the flexible circuit board on which the circuit component is mounted is mounted. There is a conventional example (Patent Document 1) in which the other end is attached to a connector member.
Furthermore, as a different pressure sensor, there is a conventional example (Patent Document 2) in which a pressure-sensitive element and an output terminal are connected by a flexible circuit board, an ASIC is mounted on the flexible circuit board, and an end is attached to a connector. .

JP 2002-310826 A JP 2006-78379 A

In the conventional examples shown in Patent Document 1 and Patent Document 2, an electronic component is attached to a flexible circuit board in order to electrically connect a circuit component or an ASIC electronic component to a sensor module. Therefore, in these conventional examples, the mounting work of the electronic component to the flexible circuit board and the assembly work of the pressure sensor become complicated, and the manufacturing cost becomes high.
That is, since the flexible circuit board is easily bent, in order to attach an electronic component to the board plane, the flexible circuit board must be fixed to a support base or the like, and the work is complicated. Furthermore, when assembling the pressure sensor, it is necessary to connect one end of the flexible circuit board to the sensor module and connect the other end to the terminal terminal. In the connection work, the electronic component joined to the flexible circuit board is connected to the flexible circuit board. You should not fall out of it.

  An object of the present invention is to provide a sensor module and a physical quantity measurement sensor that can easily perform a connection operation with an electronic component.

  The sensor module of the present invention is a ceramic sensor module comprising a diaphragm portion having a displacement portion that is displaced by the pressure of a fluid to be measured and a cylindrical portion formed integrally with the diaphragm portion, An electronic component is arranged on a plane of the diaphragm portion that is opposite to the surface that contacts the fluid to be measured, and the electronic component is arranged away from the plane corresponding to the displacement portion of the plane. And a lead frame having a base end connected to the component main body and having a distal end joined to a position different from the plane of the displacement portion on the plane of the diaphragm portion.

In the present invention having this configuration, the leading end portion of the lead frame of the electronic component is located at a different position from the plane of the displacement portion in the plane of the diaphragm portion, and the component main body is separated from the plane of the displacement portion. For this reason, even if the fluid to be measured is introduced into the sensor module and the displacement portion is displaced, the displacement is not hindered, so that an appropriate physical quantity can be measured.
In the present invention, since the sensor module is a ceramic hard member, it is not necessary to attach the electronic component to the flexible circuit board which is easily bent by directly attaching the electronic component to the sensor module. Therefore, the electrical connection work of the electronic component to the sensor module can be easily performed.

In the sensor module of the present invention, the electronic component is preferably an ASIC.
In this configuration, the ASIC is an indispensable electronic component and is a large component as compared with other electronic components, and thus is suitable for installation in the sensor module.

The physical quantity measuring sensor according to the present invention is a joint having a cylindrical projecting portion in which an introduction hole for introducing a fluid to be measured is formed and the projecting portion of the joint disposed on the downstream side in the flow direction of the fluid to be measured. And a flexible circuit board having one end electrically connected to the sensor module and the other end electrically connected to a terminal terminal. One end of the flexible circuit board is on the plane of the diaphragm portion. And it is connected to the position different from the said displacement part, It is characterized by the above-mentioned.
In this configuration, by attaching the electronic component directly to the sensor module, it is not necessary to attach the electronic component to the flexible circuit board that is easily bent.
Therefore, it is easy to attach the electronic component to the flexible circuit board. Moreover, since no electronic parts are attached to the flexible circuit board, the electronic parts do not get in the way when connecting the flexible circuit board to the sensor module or terminal terminals, and the assembly work of the physical quantity measurement sensor is easy. Can be done.

In the physical quantity measurement sensor of the present invention, it is preferable that the terminal terminal is provided in a connector connected to the joint, and a lid is provided in the connector, and the flexible circuit board is inserted into the lid. .
In this configuration, after the resin mold is provided so that the connection portion between the terminal terminal and the flexible circuit board does not deviate, dripping of the resin mold is blocked by the lid. Therefore, it can prevent that a resin mold adheres to an electronic component or a sensor module.
Therefore, it is possible to prevent the measurement accuracy of the physical quantity measurement sensor from being lowered.

Sectional drawing which shows the physical quantity measurement sensor concerning one Embodiment of this invention. Sectional drawing which shows the principal part of a physical quantity measurement sensor. The exploded sectional view of the important section of a physical quantity measurement sensor. (A) The top view of a sensor module, (B) Sectional drawing of a sensor module. (A) The top view of the sensor module to which the electronic component was attached, (B) The side view of the sensor module to which the electronic component was attached. The development view of a flexible circuit board.

An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows the overall configuration of a physical quantity measurement sensor according to this embodiment.
In FIG. 1, the physical quantity measurement sensor includes a joint 1, a sensor module 2 provided on the joint 1, a connector 3 covering the sensor module 2, a terminal terminal 4 provided on the connector 3, a terminal terminal 4, and a sensor module 2. Is a pressure sensor including a flexible circuit board 5 that is electrically connected to each other and an electronic component 6 provided in the sensor module 2.

The joint 1 is integrally formed with a shaft portion 11 in which an introduction hole 1 </ b> A for introducing a fluid to be measured is formed, a flange portion 12 formed extending in a radial direction from a central portion of the shaft portion 11, and an outer peripheral portion of the flange portion 12. A metal member having a formed sleeve portion 13.
One end portion of the shaft portion 11 is a screw portion 14 that is screwed into a to-be-attached portion (not shown). The other end portion of the shaft portion 11 is a protruding portion 15 where the sensor module 2 is provided.
A step having a smaller diameter at the distal end than the proximal end is formed in the intermediate portion of the protrusion 15. The flat surface of the step is a joint-side flat portion 15 </ b> A that is orthogonal to the axial direction of the protruding portion 15 and extends in the radial direction.
An inclined surface 15B having a diameter that decreases toward the tip is formed at the tip of the protrusion 15 (see FIGS. 2 and 3).
A space S partitioned by the flange portion 12, the protruding portion 15, and the sleeve portion 13 is a space for housing the sensor module 2. The space S communicates with a recess S1 formed in a planar ring shape having a predetermined width on the outer peripheral plane portion of the flange portion 12. The recess S1 is formed so that the corner of the sensor module 2 can be accommodated. The plane of the recess S1 is separated from the bottom surface of the sensor module 2.
The planar shape of the space S for housing the sensor module 2 is circular, and the planar shape of the sensor module 2 is substantially circular, and their diameters are substantially equal.
The open end of the sleeve portion 13 is a locking portion 13A that locks the connector 3.

The connector 3 is a synthetic resin part including a ring-shaped base portion 3A held by the locking portion 13A and a main body portion 3B that is integrally formed with the base portion 3A and supports the terminal terminal 4.
The base 3 </ b> A is closed with a lid 30.
The lid body 30 includes a metal lid body 31 having an opening 30 </ b> A formed in the center, and an insulating holding plate 32 provided in the opening 30 </ b> A of the lid body 31.
The lid body 31 includes a dish-shaped portion 31A and a peripheral edge portion 31B provided on the outer peripheral edge of the dish-shaped portion 31A. The peripheral edge portion 31 </ b> B is sandwiched between the sleeve portion 13 and the base portion 3 </ b> A of the connector 3.
The holding plate 32 is a plate member made of synthetic resin, and is provided with a holding hole for holding the flexible circuit board 5.
In the space partitioned by the base 3A of the connector 3 and the lid 30, in order to prevent the connection portion between the terminal terminal 4 and the flexible circuit board 5 from shifting and to ensure waterproofness, a resin mold ( (Not shown) is provided.

The terminal terminal 4 is insert-molded in a mounting member 40 made of synthetic resin. In FIG. 1, only one terminal terminal 4 is illustrated, but in the present embodiment, three terminal terminals 4 are arranged along the paper surface penetration direction in FIG. 1.
The attachment member 40 includes a main body portion 40A that holds the terminal terminals 4 and leg portions 40B that are integrally formed with the main body portion 40A. The main body 40A is attached to the base 3A.
An end portion of the terminal terminal 4 is exposed from the main body portion 40A of the mounting member 40, and one end portion of the flexible circuit board 5 is connected to the exposed portion. Note that one end of the flexible circuit board 5 is connected in a folded state to the terminal terminal 4 in order to make it difficult for force to be applied to the connection portion with the terminal terminal 4 even if the tip thereof is shaken.

A specific configuration of the sensor module 2 is shown in FIGS.
2 and 3 each show a cross-section of the main part of the physical quantity measurement sensor, and FIG. 4 shows the sensor module 2.
2 to 4, the sensor module 2 is arranged on the downstream side of the projecting portion 15 of the joint 1 in the flow direction of the fluid to be measured.
The sensor module 2 is made of ceramic, and is provided at the protruding portion 15 integrally formed with the diaphragm portion 21 provided at the downstream end portion of the protruding portion 15 of the joint 1 in the flow direction of the fluid to be measured. And a cylindrical portion 22.

The joint 1 is provided with a retaining member 23 for preventing the sensor module 2 from coming off from the protruding portion.
The retaining member 23 is a spring ring having a rectangular cross section that is fitted into a fitting recess 13 </ b> B formed in the inner circumferential surface of the sleeve portion 13 along the circumferential direction. This spring ring is a C-shaped spring member having a flat surface, the outer peripheral portion is fitted in the fitting recess 13 </ b> B, and a part of the inner peripheral portion presses the outer peripheral edge of the diaphragm portion 21.

The surface of the diaphragm portion 21 opposite to the surface facing the protruding portion 15 is a flat surface 20A.
The central portion of the diaphragm portion 21 is a displacement portion 210 that is displaced by the pressure of the fluid to be measured. A fluid to be measured is introduced into the space formed by the bottom surface of the displacement portion 210 and the inner peripheral surface of the cylindrical portion 22 from the introduction hole 1A of the joint 1. The fluid to be measured measured in the present embodiment includes a liquid such as water and a gas such as air.
The surface (bottom surface) that contacts the fluid to be measured of the displacement portion 210 is formed according to the shape of the top of the protrusion 15, and may be formed flat, for example. It may be formed to be curved so as to be thin.
A detection unit (not shown) made of a strain gauge or the like is provided in the flat central portion 21A corresponding to the displacement unit 210 in the flat surface 20A.

A sensor module side flat portion 22 </ b> A is formed on the inner peripheral portion of the cylindrical portion 22 near the diaphragm portion 21.
The sensor module side flat portion 22A is a plane that is orthogonal to the axial direction of the cylindrical portion 22 and extends in the radial direction. The sensor module side flat portion 22A has a diameter larger than that of the displacement portion 210 and the surface flat surface of the sensor module 2. It is formed in parallel with 20A.
The inner peripheral portion of the opening end of the cylindrical portion 22 is fitted to the outer peripheral portion of the protruding portion 15 over a predetermined length, and an inclined portion 22B is formed from the edge of the fitting portion to the opening end. Yes.
The inclined portion 22B may be formed in a flat shape or may be formed in a curved shape.

An O-ring 7 is provided between the cylindrical portion 22 of the sensor module 2 and the protruding portion 15 of the joint 1.
The O-ring 7 is disposed in a space between the sensor module side flat portion 22A and the joint side flat portion 15A. The sensor module side flat portion 22 </ b> A and the joint side flat portion 15 </ b> A regulate movement of the protruding portion 15 of the O-ring 7 in the axial direction, and are parallel to each other when the sensor module 2 is mounted on the protruding portion 15. It is said that.
The sensor module-side flat portion 22A and the joint-side flat portion 15A have a radial width dimension of the cylindrical portion 22 such that the O-ring 7 is sandwiched between the cylindrical portion 22 and the protruding portion 15, respectively. The thickness dimension is the same as or slightly smaller.

The axial dimension from the joint side flat part 15A of the protrusion 15 to the inclined surface 15B may be at least the thickness dimension of the O-ring 7.
The inner peripheral side edge of the sensor module side flat portion 22A is prevented from interfering with the protruding portion 15 by the inclined surface 15B.
The axial dimension from the sensor module side flat part 22A to the inclined part 22B of the cylindrical part 22 may be at least the thickness dimension of the O-ring 7.
Three outer peripheral grooves 2 </ b> A are formed in the outer peripheral portion of the sensor module 2 in parallel with the axial direction of the cylindrical portion 22.
These outer peripheral grooves 2A are used for positioning the sensor module 2 with a positioning device (not shown) when pattern-printing a detection unit or the like on the surface flat surface 20A of the sensor module 2.
In order to accurately position the sensor module 2, the three outer peripheral grooves 2 </ b> A are arranged at unequal intervals. That is, two outer peripheral grooves 2A among these outer peripheral grooves 2A are at positions opposite to each other across the axis of the sensor module 2, and are close to either one of these two outer peripheral grooves 2A. One remaining outer peripheral groove 2A is arranged at the position. In the present embodiment, in order to position the sensor module 2 in place of the outer peripheral groove 2A, the recess 2B may be formed at positions opposite to each other with the axis of the sensor module 2 interposed therebetween.

FIG. 5 shows a state where the electronic component 6 is attached to the sensor module 2.
In FIG. 5, an electronic component 6 of the present embodiment is an ASIC (Application Specific Integrated Circuit) used for correction of a measured value or the like.
The electronic component 6 is disposed on the surface (plane) opposite to the surface with which the fluid to be measured contacts the diaphragm portion 21.
The electronic component 6 includes a plate-shaped component main body 61 and a plurality of lead frames 62 each having a base end connected to the component main body 61.

The component main body 61 is disposed away from the plane center portion 21 </ b> A of the diaphragm portion 21.
The leading end portion of the lead frame 62 is joined to the flat outer peripheral portion 21B located on the outer periphery of the flat central portion 21A in the flat surface 20A of the diaphragm portion 21. A conductive adhesive or the like is used for joining the leading end portion of the lead frame 62 and the planar outer peripheral portion 21B.
A plurality of circuit elements 63 are joined to the planar outer peripheral portion 21B. The circuit element 63 and the lead frame 62 are connected to a planar circuit portion (not shown) formed on the planar outer peripheral portion 21B. The planar circuit unit is connected to a detection unit (not shown) provided in the displacement unit 210 and the three pads 21D.

The detailed structure of the flexible circuit board 5 is shown in FIG. FIG. 6 is a development view of the flexible circuit board 5.
1 and 6, the flexible circuit board 5 includes a first end 51 connected to the terminal terminal 4, a second end 52 connected to the diaphragm 21, and the second end 52 and the first end. An intermediate surface portion 53 is provided between the end portion 51 and held by the holding plate 32.
The first end 51 is formed with an engagement hole 51 </ b> A that engages with the terminal terminal 4. In the present embodiment, the engagement hole 51A and the terminal terminal 4 are connected to each other by soldering.
The second end 52 is fixed to the diaphragm 21 by thermocompression bonding. The second end portion 52 is formed with three terminal portions 52A that are soldered to the pads 21D (see FIG. 5) of the planar circuit portion.
These terminal portions 52A and the engaging holes 51A are electrically connected by a circuit pattern (not shown).

In order to assemble the physical quantity measuring sensor having the above configuration, first, the sensor module 2 is made of ceramic.
Various methods can be adopted to manufacture the sensor module 2. For example, a mold (not shown) is filled with ceramic powder to form a molded body, and the molded body is sintered. At this time, the mold is previously provided with a step portion for forming the sensor module side flatness or the like in the mold. Thereby, the sensor module side flat portion 22A is formed as a part of the molded body.
The compact is put into a firing furnace (not shown), fired at a predetermined temperature, and taken out from the firing furnace.

A planar circuit part and a detection part are formed in the diaphragm part 21 of the sensor module 2 manufactured in this way. Then, the electronic component 6 and the circuit element 63 are attached to the diaphragm portion 21, and the second end portion 52 of the flexible circuit board 5 is joined to the diaphragm portion 21.
Further, the joint 1 is formed by grinding a metal block body or the like. At this time, the joint-side flat portion 15 </ b> A is formed in the protruding portion 15 at the same time as the joint 1 is processed. Other parts constituting the physical quantity measuring sensor are also manufactured.

Thereafter, the O-ring 7 is attached to the outer peripheral portion of the protrusion 15 of the joint 1, and the sensor module 2 to which the flexible circuit board 5, the electronic component 6, and other necessary members are attached is attached to the protrusion 15 (FIG. 3). reference). As a result, the O-ring 7 is disposed between the sensor module-side flat portion 22A of the sensor module 2 and the joint-side flat portion 15A of the protruding portion 15.
Furthermore, the retaining member 23 is attached to the joint 1 to prevent the sensor module 2 from coming off.
And the intermediate surface part 53 of the flexible circuit board 5 is hold | maintained by the holding plate 32 located in the center part of the cover body 30, and the terminal insert-molded by the attachment member 40 previously to the 1st end part 51 of the flexible circuit board 5 is carried out. Terminal 4 is joined.
Further, the terminal terminal 4 is attached to the connector 3 and the connector 3 is locked to the sleeve portion 13 of the joint 1.

Therefore, in the present embodiment, the following operational effects can be achieved.
(1) A ceramic sensor module 2 including a diaphragm portion 21 having a displacement portion 210 and a cylindrical portion 22 formed integrally with the diaphragm portion 21, and the electronic component 6 is disposed on the plane of the diaphragm portion 21. The electronic component 6 is a component main body 61 arranged away from the plane central portion 21A corresponding to the displacement portion 210 in the plane of the diaphragm portion 21, and the base end portion is connected to the component main body 61. And a lead frame 62 having a tip end joined to a different planar outer peripheral portion 21B. Since the tip end portion of the lead frame 62 of the electronic component 6 is in a plane position away from the displacement portion 210, proper measurement can be performed without hindering displacement of the displacement portion 210. Since the sensor module 2 is a ceramic hard member, it is not necessary to attach the electronic component 6 to the flexible circuit board 5 which is easily bent by directly attaching the electronic component 6 to the sensor module 2. Therefore, the electrical connection work of the electronic component 6 to the sensor module 2 is facilitated.

(2) The sensor module 2 in which the electronic component 6 is attached to the diaphragm portion 21 and the flexible circuit board in which the first end portion 51 is connected to the terminal terminal 4 and the second end portion 52 is electrically connected to the sensor module 2. 5, and the second end 52 of the flexible circuit board 5 is connected to the planar outer peripheral portion 21 </ b> B on the plane of the diaphragm portion 21 and away from the planar central portion 21 </ b> A of the displacement portion 210. Therefore, since it is not necessary to attach the electronic component 6 to the flexible circuit board 5 that is easily bent, it is easy to attach the electronic component 6 to the flexible circuit board 5. Moreover, since the electronic component 6 is not attached to the flexible circuit board 5, the electronic component 6 does not get in the way when the flexible circuit board 5 is connected to the sensor module 2 or the terminal terminal 4.

(3) The ASIC, which is the electronic component 6, is an important electronic component for the physical quantity measurement sensor, and is a large component compared to other electronic components, and thus is suitable for installation in the sensor module 2.

(4) The terminal terminal 4 is provided on the connector 3, and the connector 3 is provided with a lid 30. The flexible circuit board 5 is inserted into the lid 30, so that the terminal terminal 4, the flexible circuit board 5, The resin mold is blocked by the lid 30 when the resin molding is performed in order to prevent the connection portion from being displaced and to ensure waterproofness. Therefore, since the resin mold does not adhere to the electronic component 6 or the sensor module 2, it is possible to prevent the measurement accuracy from being lowered.

(5) The joint 1 having the projecting portion 15, the diaphragm 21, the ceramic sensor module 2 having the tubular portion 22 formed integrally with the diaphragm portion 21 and provided on the projecting portion 15, and the shaft of the tubular portion 22 O-ring 7 provided between the sensor module side flat portion 22A formed extending in the direction orthogonal to the direction and the joint side flat portion 15A formed extending in the direction orthogonal to the axial direction of the protrusion 15. A physical quantity measuring sensor is configured. The operation of forming a U-shaped groove for providing the O-ring 7 only in the joint 1 is not required, and the structure for holding the O-ring 7 is simplified. Since the length from the joint-side flat portion 15A of the protruding portion 15 toward the distal end side and the length from the sensor module-side flat portion 22A of the sensor module 2 toward the opening end can be set short, the protruding portion 15 and the sensor module can be set. The physical quantity measurement sensor can be downsized by shortening the length along the axial direction of 2.

(6) Since the sensor module side flat portion 22A is formed in parallel with the surface flat surface 20A of the diaphragm portion 21, the surface flat surface 20A of the sensor module 2 is perpendicular to the axial direction of the protruding portion 15. The sensor module side flat portion 22A is also positioned in the same direction. Therefore, the O-ring 7 does not come off from the protrusion 15.

(7) Since the inclined surface 15B is formed at the tip of the projecting portion 15, when the projecting portion 15 of the joint 1 is attached to the cylindrical portion 22 of the sensor module 2, the inner portion of the sensor module side flat portion 22A The peripheral edge is less likely to interfere with the protrusion 15. Therefore, the mounting operation of the sensor module 2 on the protruding portion 15 can be easily performed.

(8) Since the joint member 1 is provided with the retaining member 23 that prevents the sensor module 2 from coming off from the protruding portion 15, the sensor module 2 is inclined with respect to the joint 1 even if the physical quantity measurement sensor vibrates during transportation or after installation. Therefore, accurate measurement can be performed.

(9) Since the retaining member 23 is a spring ring fitted in the fitting recess 13 </ b> B of the sleeve portion 13, the retaining member 23 can be easily attached to the joint 1.

(10) Since the planar shape of the space S for housing the sensor module 2 of the joint 1 is the same as the planar shape of the sensor module 2, the peripheral surface of the sensor module 2 housed in the space S of the joint 1 is a sleeve. It comes into contact with the inner peripheral surface of the portion 13. For this reason, the sensor module 2 does not tilt with respect to the protrusion 15, so that accurate measurement can be performed from this point.

(11) Since the joint 1 includes the sleeve portion 13 for locking the connector 3, a casing for connecting the joint 1 and the connector 3 is not necessary, and the physical quantity measurement sensor is assembled by reducing the number of parts. Can be performed efficiently.

(12) Since the outer peripheral groove 2A is formed in the outer peripheral portion of the sensor module 2, the sensor module 2 can be accurately positioned when patterning the detection portion or the like on the surface flat surface 20A of the sensor module 2. . Therefore, the accuracy of the physical quantity measurement sensor can be increased by accurately forming the detection unit and the like in the sensor module 2.

It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
For example, in the above embodiment, the electronic component 6 directly installed on the diaphragm portion 21 is an ASIC. However, in the present invention, a capacitor, an amplifier circuit, and other elements may be used as an electronic component as long as there is a lead frame. .
Moreover, in the said embodiment, although the cover 30 was provided in the connector 3 and it was set as the structure which penetrated the flexible circuit board 5 in this cover 30, the cover 30 may be abbreviate | omitted in this invention.

In the embodiment, in order to restrict the movement of the protruding portion 15 of the O-ring 7 along the axial direction, the sensor module side flat portion 22A is formed extending in a direction orthogonal to the axial direction of the cylindrical portion 22 and protruding. The joint-side flat portion 15A is formed by extending in a direction orthogonal to the axial direction of the portion 15, but in the present invention, other configurations, for example, an O-ring on the protruding portion 15 can be used as long as the movement of the O-ring 7 can be restricted. 7 may be formed.
Furthermore, the processing method of the ceramic sensor module 2 and the joint 1 is not limited to the above embodiment. For example, the sensor module 2 including the sensor module-side flat portion 22A may be processed by molding a molded body serving as a base of the sensor module 2 with a mold or the like and cutting or grinding the molded body.

In the present invention, the retaining member 23 that prevents the sensor module 2 from coming off the joint 1 may be configured such that a plurality of locking pins are provided on the inner peripheral surface of the joint 1 instead of the spring ring.
Furthermore, although the pressure sensor was illustrated and demonstrated in the said embodiment as a physical quantity measurement sensor, in this invention, it is not limited to this, For example, it can apply also to a differential pressure sensor and a temperature sensor.
Moreover, although the joint 1 was formed from the metal member in the said embodiment, in this invention, a joint may be formed from a synthetic resin member.

  DESCRIPTION OF SYMBOLS 1 ... Joint, 2 ... Sensor module, 3 ... Connector, 4 ... Terminal terminal, 5 ... Flexible circuit board, 6 ... Electronic component, 7 ... O-ring, 15 ... Projection part, 20A ... Surface flat surface, 21 ... Diaphragm part, 21A ... Planar center portion, 21B ... Planar outer peripheral portion, 22 ... Cylindrical portion, 30 ... Lid, 51 ... First end portion, 52 ... Second end portion, 61 ... Component body, 62 ... Lead frame, 210 ... Displacement Part

Claims (4)

A ceramic sensor module comprising a diaphragm portion having a displacement portion that is displaced by the pressure of a fluid to be measured, and a cylindrical portion formed integrally with the diaphragm portion,
An electronic component is disposed on a plane that is a surface on the opposite side of the surface of the diaphragm portion that is in contact with the fluid to be measured,
The electronic component includes a component main body arranged away from a plane corresponding to the displacement portion of the plane, and a base end portion connected to the component main body on the plane of the diaphragm portion, and the plane of the displacement portion And a lead frame having a tip part bonded to a position different from the sensor module. The sensor module according to claim 1,
The sensor module according to claim 1, wherein the electronic component is an ASIC. The joint according to claim 1 or claim 2, wherein the joint has a cylindrical projecting portion in which an introduction hole for introducing the fluid to be measured is formed, and is disposed downstream of the projecting portion of the joint in the flow direction of the fluid to be measured. A flexible circuit board having one end electrically connected to the sensor module and the other end electrically connected to a terminal terminal,
One end of the flexible circuit board is connected to a position different from the displacement portion on the plane of the diaphragm portion. The physical quantity measurement sensor according to claim 3,
The physical quantity measuring sensor, wherein the terminal terminal is provided on a connector connected to the joint, and a lid is provided on the connector, and the flexible circuit board is inserted into the lid.

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