JP6500691B2 - Physical quantity sensor device and method of manufacturing physical quantity sensor device - Google Patents

Description

  The present invention relates to a physical quantity sensor device and a method of manufacturing the physical quantity sensor device.

  Many physical quantity sensor devices are used in automobiles and industrial equipment. Physical quantity sensor devices such as pressure sensor devices and acceleration sensor devices are often used in severe environments with high temperature and high humidity. In the physical quantity sensor device, a connector portion (socket portion) for accommodating signal terminal pins (contact pins) to the outside, and a terminal pin (lead pin) for taking out a signal of the sensor element or a housing for accommodating the entire sensor element An integrated configuration is known.

  As such a physical quantity sensor device, the pressure detection element is fitted together with the O-ring into the element storage hole of the joint, and the connector part is fitted together with the O-ring into the element storage hole, after which the thin opening edge of the element storage hole An apparatus has been proposed in which the pressure detection element, the joint, and the connector portion are integrated by caulking (see, for example, Patent Document 1 (paragraph 0030, FIG. 1) described below).

  In addition, as another physical quantity sensor device, the joint formed of brass or the like, the sensor element accommodated inside the joint, and the opening edge of the joint are crimped to prevent the detachment from the joint and to prevent the joint from being dislodged. There has been proposed a device constituted of a connector portion to be integrated (see, for example, Patent Document 2 (paragraph 0002, FIG. 6) described below).

  In addition, as another physical quantity sensor device, a device provided with a sensor element including a pressure detection element and a connector unit that covers the sensor element and is connected to the pressure detection element and accommodates a lead wire is proposed. There is. The connector unit is fitted from the outside of the base on which the pressure detection element is attached to accommodate the sensor element (see, for example, Patent Document 3 (paragraph 0013, 0018, FIG. 1)).

  Also, as another physical quantity sensor device, an O-ring is disposed in a recess inside the housing body, the sensor element is mounted thereon, and a connector portion for taking out an electrical signal from the sensor element is fixed to the housing body An apparatus has been proposed (see, for example, Patent Document 4 (paragraphs 0038 to 0039, FIG. 4) described below).

JP 2001-116643 A JP, 2004-163321, A JP, 2012-068105, A JP, 2014-132218, A

  However, the following problems arise in the above-mentioned patent documents 1-4. First, in the method of assembling (manufacturing method) of the conventional physical quantity sensor device in which the connector portion and the housing are integrated by resin molding, the method of welding the lead pin and the contact pin will be described using the conventional configuration shown in FIG. . FIG. 18 is a perspective view showing a state during assembly of a conventional physical quantity sensor device. FIG. 18A shows the state of the sensor element before attachment of the connector portion (not shown) after welding of the lead pin 101 and the contact pin 102. FIG. 18B is an enlarged view of a welded portion 103 between the lead pin 101 and the contact pin 102 in FIG. FIGS. 18 (a) and 18 (b) are FIGS. 2 and 5 of Patent Document 2 respectively.

  As shown in FIG. 18A, in the conventional physical quantity sensor device, a plurality of lead pins 101 are fixed to a hermetic glass (not shown) loaded in an opening of a sensor housing 105. On the upper surface of the sensor housing 105, a holder 106 in which the contact pin 102 is erected is disposed. An upper end portion 101a of the lead pin 101 protrudes upward from the three holes 107 exposed to the notch portion 106a of the holder 106, respectively. Lower end portions 102b of the contact pins 102 are spot-welded to the upper end portions 101a of the three lead pins 101 respectively by laser light so that the lead pins 101 and the contact pins 102 form the same straight line. Reference numeral 108 is a hole into which the remaining lead pins (not shown) are inserted.

  As shown in FIG. 18B, the laser beam 104 needs to be applied to the welded portion 103 between the lead pin 101 and the contact pin 102 from the direction (horizontal direction) orthogonal to the axial direction (longitudinal direction) of the lead pin 101 is there. For this reason, until welding the lead pin 101 and the contact pin 102, in order to secure the entry path of the laser beam 104, a member that becomes an obstacle should not be disposed on the entry path of the laser beam 104. Therefore, before attaching the connector part (not shown) which encloses the contact pin 102, a two-stage assembly of attaching a cover capable of holding the connector part is required. That is, since one step of welding the lead pin 101 and the contact pin 102 is required, one or more additional steps are required to complete the assembly.

  Further, the lead pin 101 and the contact pin 102 are thin. For example, when the planar shape of the end cross section is circular or rectangular, the length is about 0.5 mm. Therefore, in order to align the upper end portion 101 a of the lead pin 101 with the lower end portion 102 a of the contact pin 102, processing tolerance of the lead pin 101 and the contact pin 102 is required. Further, when the lead pin 101 and the contact pin 102 are welded, the lower end portion 102 a of the contact pin 102 is abutted against the upper end portion 101 a of the lead pin 101. For this reason, a load is applied to the lead pin 101, and an additional load is applied to the hermetic glass on which the lead pin 101 is fixed.

  An object of the present invention is to provide a physical quantity sensor device that can be easily assembled, and a method for manufacturing the physical quantity sensor device, in order to solve the above-mentioned problems with the prior art.

  In order to solve the problems described above and achieve the object of the present invention, a method of manufacturing a physical quantity sensor device according to the present invention has the following features. First, a first step of fixing the sensor element on the pedestal portion provided at one end of the introduction hole of the screw portion having the introduction hole for introducing the pressure measurement gas or the pressure measurement liquid, so as to close the introduction hole Do. Next, the first accommodation is performed in the first sensor element so as to sandwich the sensor element between the screw portion and the first terminal disposed in the sensor element so as to receive a first terminal for extracting a signal of the sensor element. Perform the second step of fixing the part. Next, a third step of bonding the first terminal and a second terminal disposed in the first accommodation portion and serving as a connection portion to the external wiring is performed. Next, a fourth step of fixing the second accommodating portion to the first accommodating portion is performed so as to sandwich the first accommodating portion with the sensor element and to accommodate the second terminal. In the second step, the first terminal and the second terminal are brought into contact with each other so as to be exposed to the outside of the first accommodation portion. In the third step, a laser is irradiated to a contact portion between the first terminal and the second terminal to bond the first terminal and the second terminal.

  Further, in the method of manufacturing a physical quantity sensor device according to the present invention, in the above-described invention, the second terminal is integrated with the first housing portion, and the first portion exposed outside the first housing portion is Have. In the second step, the first terminal is penetrated through the through hole of the first accommodation portion, and the first terminal is brought into contact with the first portion inside the through hole of the first accommodation portion. I assume.

  Further, in the method of manufacturing a physical quantity sensor device according to the present invention, in the above-mentioned invention, the second terminal is connected to the first portion, and has a second portion protruding outside the first accommodation portion. In the fourth step, the second portion is accommodated in the second accommodation portion.

  In the method of manufacturing a physical quantity sensor device according to the present invention, in the above-described invention, the first housing portion and the second housing portion are resin members. In the second step, the first storage portion is fixed to the sensor element by an adhesive.

  In addition, in order to solve the problems described above and achieve the object of the present invention, the method for manufacturing a physical quantity sensor device according to the present invention has the following features. First, a first step of fixing the sensor element on the pedestal portion provided at one end of the introduction hole of the screw portion having the introduction hole for introducing the pressure measurement gas or the pressure measurement liquid, so as to close the introduction hole Do. Next, the first accommodation is performed in the first sensor element so as to sandwich the sensor element between the screw portion and the first terminal disposed in the sensor element so as to receive a first terminal for extracting a signal of the sensor element. Perform the second step of fixing the part. Next, a third step of bonding the first terminal and a second terminal disposed in the first accommodation portion and serving as a connection portion to the external wiring is performed. Next, a fourth step of fixing the second accommodating portion to the first accommodating portion is performed so as to sandwich the first accommodating portion with the sensor element and to accommodate the second terminal. In the second step, the first storage portion is fixed to the sensor element by an adhesive.

  Further, in order to solve the problems described above and achieve the object of the present invention, a physical quantity sensor device according to the present invention comprises a screw portion, a sensor element, first and second terminals, and first and second housing portions. It has a feature. The screw portion has an introduction hole for introducing a pressure measurement gas or a pressure measurement liquid, and one end of the introduction hole includes a pedestal. The sensor element is fixed on the pedestal so as to close the introduction hole. The first terminal is disposed on the sensor element and takes out a signal of the sensor element. The first housing portion is fixed to the sensor element so as to sandwich the sensor element with the screw portion, and accommodates the first terminal. The second terminal is disposed in the first housing portion and joined to the first terminal to be a connection portion with an external wiring. The second accommodation portion is fixed to the first accommodation portion so as to sandwich the first accommodation portion with the sensor element, and accommodates the second terminal.

  In the physical quantity sensor device according to the present invention, in the above-described invention, the contact portion between the first terminal and the second terminal is exposed to the second accommodation portion side, and is joined at the contact portion. It is characterized by

  Further, in the physical quantity sensor device according to the present invention, in the above-mentioned invention, the second terminal is integrated with the first housing portion and has a first portion exposed to the outside of the first housing portion. The first terminal penetrates the through hole of the first housing portion, and is joined to the first portion inside the through hole of the first housing portion.

  Further, in the physical quantity sensor device according to the present invention, in the above-mentioned invention, the second terminal is connected to the first portion, and has a second portion that protrudes to the outside of the first accommodation portion. The second accommodating portion is characterized in that the second portion is accommodated.

  According to the above-described invention, the upper upper surface of the first accommodation portion can be exposed during the manufacture (in the process of assembly) of the physical quantity sensor device. Therefore, the physical quantity sensor device is formed by integrally molding the second terminal in the first housing portion so that the contact portion (portion to be joined) of the first and second terminals is exposed on the upper upper surface of the first housing portion. The contact portion between the first and second terminals can be exposed so that the contact portion between the first and second terminals can be seen from substantially above in the middle of the assembly. Therefore, since the first and second terminals can be joined by laser welding from almost the upper side, the first and second terminals can be joined easily. In addition, the first housing portion can be easily fixed to the sensor element by an adhesive.

  According to the physical quantity sensor device and the method of manufacturing the physical quantity sensor device according to the present invention, it is possible to easily assemble.

FIG. 1 is a cross-sectional view showing a configuration of a physical quantity sensor device according to a first embodiment. It is explanatory drawing which shows the structure of the connector pin of FIG. It is a top view which shows an example of the end shape of the connector pin of FIG. It is a top view which shows an example of the end shape of the connector pin of FIG. It is a top view which shows an example of the end shape of the connector pin of FIG. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 5 is a perspective view schematically showing a state in the middle of manufacture of the physical quantity sensor device according to the first embodiment. FIG. 7 is a cross-sectional view showing a configuration of a physical quantity sensor device according to a second embodiment. FIG. 8 is a cross-sectional view showing a configuration of a physical quantity sensor device according to a third embodiment. It is a perspective view which shows the state in the middle of the assembly of the conventional physical quantity sensor apparatus.

  Hereinafter, preferred embodiments of a physical quantity sensor and a method of manufacturing the physical quantity sensor according to the present invention will be described in detail with reference to the accompanying drawings. In the following description of the embodiments and the accompanying drawings, the same components are denoted by the same reference numerals and redundant description will be omitted.

Embodiment 1
The configuration of the physical quantity sensor device according to the first embodiment will be described using a pressure sensor device as an example. FIG. 1 is a cross-sectional view showing the configuration of the physical quantity sensor device according to the first embodiment. FIG. 2 is an explanatory view showing a configuration of the connector pin of FIG. FIG. 2A shows a cross-sectional view of the connector pin 31 and FIG. 2B shows an overhead view of the connector pin 31. As shown in FIG. FIGS. 3-5 is a top view which shows an example of the end shape of the connector pin of FIG. 3 shows a plan view of the rectangular frame A of FIG. 2, and FIGS. 4 and 5 show another example of a plan view of the rectangular frame A. As shown in FIG. As shown in FIG. 1, the physical quantity sensor device 100 includes a sensor element 1, a screw portion 2, an inner housing portion (first housing portion) 3, and a socket housing portion (connector housing portion (second housing portion)) 4. The sensor element 1 includes a storage box 10 and a pressure sensor chip (semiconductor chip) 11, a pedestal member 12, and a diaphragm 13 which are stored in the recess 10 a of the storage box 10.

  The storage box 10 is made of, for example, a metal such as stainless steel (SUS). The pressure sensor chip 11 has a diaphragm 11a which is a pressure receiving portion formed by, for example, forming a recess from a first surface (upper surface in FIG. 1) of semiconductor silicon. The pressure is received by the diaphragm 11a. At least four gauges (not shown) made of diffusion resistance are formed on the second surface (lower surface in FIG. 1) of the semiconductor silicon corresponding to the back side of the diaphragm 11a. These gauges convert the strain generated on the second surface of the semiconductor silicon into a resistance value when pressure is applied to the pressure sensor chip 11. The pressure sensor chip 11 may be made of other semiconductor materials.

  Further, although not shown, in the pressure sensor chip 11, a pressure sensor element such as a Wheatstone bridge circuit constituted by the gauge and a control circuit are formed. The control circuit is a circuit that amplifies the output signal of the pressure sensor element, a circuit that corrects the sensitivity, a circuit that corrects the offset, and a circuit that corrects the temperature characteristics of the sensitivity and the offset. The pressure sensor chip 11 is also formed with a surge protection element, a filter (not shown) and the like. Each electrode on the second surface of the pressure sensor chip 11 is connected to a lead pin (first terminal) 15 described later by a bonding wire 14.

  The first surface of the pressure sensor chip 11 is fixed to the bottom surface of the recess 10 a of the storage box 10 via the pedestal member 12. Although the base member 12 is not particularly limited, it is made of, for example, a glass material, that is, Pyrex (registered trademark) glass, Tempax glass, or the like. The pedestal member 12 and the pressure sensor chip 11 are bonded by electrostatic bonding. The pedestal member 12 and the storage box 10 are bonded by an adhesive (not shown). The lead pin 15 is a terminal pin for taking out the signal of the sensor element 1, and a plurality of lead pins 15 are arranged.

  Each lead pin 15 penetrates the storage box 10 through different through holes 10 b of the storage box 10, and is fixed to the storage box 10 by an insulating member 16 such as glass that closes the through hole 10 b. One end (hereinafter referred to as the lower end) of the lead pin 15 protrudes downward (the side of the screw 2) from the recess 10a of the storage box 10, and bonding wires are connected to the circuits on the second surface of the pressure sensor chip 11. 14 are connected. The other end (hereinafter referred to as the upper end) of the lead pin 15 protrudes upward (the socket housing 4 side) from the opposite side to the recess 10 a of the storage box 10.

  Specifically, among the plurality of lead pins 15, the lower end portions of the respective lead pins (hereinafter referred to as first lead pins) 15a which are a power supply terminal, a ground terminal, and an output terminal are Connected to the electrode. The upper end portion of the first lead pin 15 a passes through the through hole 3 b of the inner housing portion 3. Further, the upper end portion of the first lead pin 15 a extends so as to be in contact with the entire inner wall of the through hole 3 b of the inner housing portion 3 and above the through hole 3 b of the inner housing portion 3 (that is, surrounded by the socket housing portion 4) Preferably do not project into the isolated space 41).

  On the other hand, lower ends of lead pins (hereinafter referred to as second lead pins) 15b for characteristic adjustment and trimming among the plurality of lead pins 15 are connected to electrodes of a predetermined control circuit by bonding wires 14, respectively. The second lead pin 15b is used to perform characteristic adjustment / trimming during assembly of the physical quantity sensor device 100, and is not used after the characteristic adjustment / trimming. For this reason, the upper end portion of the second lead pin 15b is cut short to a length that can be accommodated in a recess 32 described later of the inner housing portion 3 after the characteristic adjustment / trimming. That is, the length of the second lead pin 15b is shorter than the length of the first lead pin 15a.

  Specifically, the length of the second lead pin 15b may be, for example, equal to or less than the length that contacts the lower surface (surface facing the storage box 10 in the vertical direction) of the noise countermeasure substrate 17 described later. The length may be such that the noise countermeasure substrate 17 can be fixed by penetrating the through hole 17 a of the noise countermeasure substrate 17. FIG. 1 shows a state in which the noise countermeasure substrate 17 is fixed to the first lead pin 15 a and one second lead pin 15 b. The longitudinal direction is the axial direction of the lead pin 15. The lateral direction is a direction orthogonal to the axial direction of the lead pin 15. The lead pin 15 is made of, for example, a 42 alloy (42 Alloy) or a metal such as an iron-nickel alloy (50 Ni-Fe) containing about 50 wt% of nickel (Ni) and iron (Fe) in the remaining ratio.

  A noise reduction substrate 17 and a noise reduction chip capacitor 18 may be provided above the storage box 10 so as to face the storage box 10 in the vertical direction. The noise countermeasure substrate 17 is provided with a through hole 17 a for allowing the lead pin 15 to penetrate. The first lead pins 15a are soldered to lands (not shown) provided around the through holes 17a. The noise countermeasure substrate 17 is fixed to the first lead pin 15a penetrating the through hole 17a, and the arrangement (longitudinal direction and lateral direction) with respect to the storage box 10 is determined.

  The second lead pin 15b may be penetrated through the through hole 17a of the noise countermeasure substrate 17 to fix the noise countermeasure substrate 17 to the second lead pin 15b. In this case, the land may not be provided around the through hole 17a through which the second lead pin 15b passes. The chip capacitor 18 is disposed on the upper surface of the noise countermeasure substrate 17 (surface opposite to the surface facing the storage box 10 in the vertical direction), and electrically connected to the first lead pin 15 a through the wiring pattern and the land. It is connected.

  The screw portion 2 is made of, for example, a metal such as SUS. At the center of the screw portion 2, a through hole 23 through which a pressure medium such as air or oil passes in the longitudinal direction is provided. The opening of the through hole 23 at one open end of the screw portion 2 is a pressure inlet 24. The diaphragm 13 is provided on the pedestal 21 provided at the other open end of the screw 2 so that the opening 25 of the through hole 23 at the other open end of the screw 2 and the recess 10 a of the storage box 10 face each other. The storage box 10 is placed on both sides of. The periphery of the pedestal portion 21 of the screw portion 2, the diaphragm 13 and the laminated portion of the storage box 10 are joined by laser welding.

  The diaphragm 13 is a corrugated thin metal plate and made of metal such as SUS. The diaphragm 13 is disposed to close the opening of the recess 10 a of the storage box 10 and the other open end of the screw 2. The space surrounded by the recess 10 a of the storage box 10 and the diaphragm 13 is filled with a liquid (pressure medium) 20 such as silicone oil that transmits pressure to the pressure sensor chip 11. The code | symbol 22 around the pedestal part 21 of the screw part 2, the diaphragm 13, and the lamination | stacking location (joining part) of the storage box 10 is a welding part of the pedestal part 21 of the screw part 2, and the storage box 10. Reference numeral 26 is an O-ring.

  The inner housing portion 3 is a resin member integrally molded with the connector pin (second terminal) 31 and has a substantially concave shape surrounding the upper side and the periphery of the sensor element 1. Specifically, the inner housing portion 3 is bonded to the outer peripheral portion on the opposite side to the concave portion 10 a side of the storage box 10 by an adhesive (not shown). An adhesive intervenes on substantially the entire contact surface between the storage box 10 and the inner housing portion 3. By making one surface of the bonding surface between the inner housing part 3 and the storage box 10 be a cross-sectional shape in which unevenness is alternately and repeatedly arranged (for example, a saw-tooth like sawtooth), the amount of adhesive on the bonding surface is increased. The inner housing portion 3 and the storage box 10 may be easily adhered. The recess 32 of the inner housing portion 3 has a depth that can accommodate the second lead pin 15 b, the noise reduction substrate 17, and the noise reduction chip capacitor 18.

  A through hole 3b for allowing the first lead pin 15a to penetrate is provided in a portion 3a of the inner housing portion 3 covering the upper side of the sensor element 1 (hereinafter referred to as the upper portion of the inner housing portion 3). The first lead pin 15 a is hermetically sealed (hermetic processing) in the through hole 3 b of the inner housing portion 3. A connector pin 31 is integrally formed on the upper portion 3 a of the inner housing portion 3. The connector pin 31 is a signal terminal pin for extracting a sensor signal. One end 31 a of the connector pin 31 is exposed to the through hole 3 b of the inner housing portion 3.

  For example, one end 31a of the connector pin 31 may be formed in a substantially ring-like planar shape surrounding the periphery of the through hole 3b of the inner housing portion 3 and exposed on the entire sidewall of the through hole 3b (see FIG. 3). In addition, one end 31 d of the connector pin 31 is formed in a substantially semicircular planar shape surrounding a part of the periphery of the through hole 3 b of the inner housing portion 3 and exposed to a part of the side wall of the through hole 3 b It may be done (Figure 4). Further, one end 31e of the connector pin 31 has a linear planar shape reaching the side wall of the through hole 3b of the inner housing portion 3, and may be exposed to a part of the side wall of the through hole 3b. (Figure 5).

  The contact portion (joined portion) 53a between the upper end portion of the first lead pin 15a and the one end portion 31a of the connector pin 31 is inclined at a predetermined incident angle (about 3 degrees with respect to the vertical direction) from above at the time of assembly The laser beam 53 is emitted at an angle). The upper end portion of the first lead pin 15a hermetically sealed in the through hole 3b of the inner housing portion 3 by this laser welding is joined to one end portion 31a of the connector pin 31 (FIG. 2 (a)) . The inner housing portion 3 is fixed to the first lead pin 15a penetrating the through hole 3b, and the arrangement with respect to the storage box 10 is determined. The connector pin 31 is made of a metal such as 42 alloy or 50 Ni-Fe, as in the case of the lead pin 15, and the connector pin 31 and the lead pin 15 are joined so as to melt each other by the irradiation of the laser beam 53. In FIG. 2A, reference numeral 54 denotes a portion where the connector pin 31 and the lead pin 15 are melted (the same applies to FIGS. 3 to 5 and 16).

  The connector pin 31 is connected to a portion (hereinafter referred to as a horizontal portion (first portion)) 31b embedded in the upper portion 3a of the inner housing portion 3 and the horizontal portion 31b, and is orthogonal to the horizontal portion 31b. And a portion 31c (hereinafter referred to as a vertical portion (second portion)) which protrudes upward, and has a substantially L-shaped cross-sectional shape. The vertical portion 31 c of the connector pin 31 is supported by, for example, a substantially square pyramidal protrusion 3 c on the upper surface (surface exposed in the socket housing portion 4) of the upper portion 3 a of the inner housing portion 3. The protrusions 3c on the upper surface of the upper portion 3a of the inner housing portion 3 are, for example, arranged in the same L-shape as the connector pins 31 (FIG. 2 (b)). FIG. 2B shows a case where one end 31a of the connector pin 31 has a ring-shaped planar shape.

  The socket housing portion 4 is a connection portion with external wiring, which accommodates the vertical portion 31 c of the connector pin 31. The socket housing portion 4 has, for example, a substantially cylindrical shape surrounding the periphery of the vertical portion 31 c of the connector pin 31. The socket housing portion 4 is bonded to the outer peripheral portion of the upper surface 3 a of the inner housing portion 3 by an adhesive (not shown). An adhesive is interposed on substantially the entire contact surface between the inner housing portion 3 and the socket housing portion 4. Asperities 4 a and 3 d may be provided on the joint surfaces of the socket housing 4 and the inner housing 3 so as to be fitted to each other.

  On the lower side (inner housing portion 3 side) of the inner wall of the socket housing portion 4, a laterally projecting protrusion 4b is provided to abut the side surface of the projection 3c on the upper surface of the upper portion 3a of the inner housing portion 3. It is done. The socket housing portion 4 is fixed by bringing the protrusion 4b of the inner wall of the socket housing portion 4 into contact with the side surface of the protrusion 3c on the upper surface of the upper portion 3a of the inner housing portion 3. Is determined. The protrusion 4 b of the inner wall of the socket housing 4 may constitute an unevenness 4 a fitted to the joint surface with the inner housing 3.

  It is preferable that the maximum diameters of the base portion 21 of the screw portion 2, the storage box 10, the inner housing portion 3 and the socket housing portion 4 be approximately equal. The reason is as follows. As described above, the screw portion 2, the storage box 10, the inner housing portion 3 and the socket housing portion 4 are sequentially stacked and joined (or bonded). Therefore, by making the maximum diameters of the pedestal portion 21 of the screw portion 2, the storage box 10, the inner housing portion 3 and the socket housing portion 4 substantially equal, it is possible to miniaturize in the diameter direction (lateral direction). .

  In the physical quantity sensor device 100 configured as described above, a pressure medium is introduced from the pressure introduction port 24, and when pressure is received by the diaphragm 11 a of the pressure sensor chip 11, the diaphragm 11 a is deformed. Then, the gauge resistance value on the diaphragm 11a changes, and a voltage signal corresponding to that changes. The voltage signal is amplified by an amplification circuit adjusted by an adjustment circuit such as a sensitivity correction circuit, an offset correction circuit, or a temperature characteristic correction circuit, and is output from the pressure sensor chip 11. Then, the output signal is output to the first lead pin 15 a via the bonding wire 14.

  Next, a method of manufacturing the physical quantity sensor device 100 (assembly method) according to the first embodiment will be described. 6 to 15 are perspective views schematically showing a state in the middle of manufacturing (in the middle of assembly) of the physical quantity sensor device according to the first embodiment. First, as shown in FIG. 6, the lead pins 15 are respectively penetrated through the through holes 10 b of the storage box 10. Here, the case where the storage box 10 has a substantially circular planar shape and the through hole 10b is provided on the circumference centering on the center of the bottom of the recess 10a of the storage box 10 will be described as an example. Among the plurality of holes, one hole is a hole 10c for injecting oil which is a pressure medium, and the remaining holes are through holes 10b through which the lead pin 15 is penetrated.

  Next, the insulating member 16 such as glass is poured into the through hole 10b of the storage box 10, and the lead pin 15 and the storage box 10 are joined (hermetically sealed). Next, an adhesive 51 is applied to the bottom of the recess 10a of the storage box 10, for example, at the center where the through hole 10b is not provided. Next, as shown in FIG. 7, the pressure sensor chip 11 is mounted and adhered on the adhesive 51 on the bottom of the recess 10 a of the storage box 10. Next, as shown in FIG. 8, the electrodes of the pressure sensor chip 11 and the lead pins 15 are electrically connected by the bonding wires 14. Next, as shown in FIG. 9, the storage box 10 is placed on the pedestal portion 21 of the screw portion 2 with the diaphragm 13 interposed between them so that the concave portion 10a side is down (the screw portion 2 side). The laminated portions of the members are joined by, for example, laser seam welding.

  Next, as shown in FIG. 10, a liquid 20 such as silicon oil is injected from the hole 10c of the storage box 10 into a space surrounded by the recess 10a of the storage box 10 and the diaphragm 13 under a vacuum atmosphere. Next, as shown in FIG. 11, a metal ball 52 made of metal such as SUS is pressed against the hole 10c into which the liquid 20 is injected to apply a voltage. Thereby, the metal ball 52 is welded to the opening of the hole 10c (resistance welding), and the liquid 20 is sealed. Next, characteristic adjustment / trimming of the sensor element 1 is performed by a general method. Next, as shown in FIG. 12, the second lead pin 15b for characteristic adjustment / trimming is cut to shorten its length.

  Next, as shown in FIG. 13, the first lead pin 15a is penetrated through the through hole 17a of the noise countermeasure substrate 17 and soldered, thereby fixing the noise countermeasure substrate 17 to the first lead pin 15a. As a result, the noise countermeasure substrate 17 is mounted so as to face the storage box 10 in the vertical direction. Next, as shown in FIG. 14, the first lead pin 15a is penetrated through the through hole 3b of the inner housing portion 3 in which the connector pin 31 is integrally molded to determine the position of the inner housing portion 3, and the adhesive is used to determine the inner housing portion. Glue 3 to the storage box 10.

  At this time, the first lead pin 15 a is in contact with the connector pin 31 exposed on the upper surface 3 a of the inner housing portion 3 at the through hole 3 b of the inner housing portion 3. Further, at this stage, since the socket housing part 4 covering the periphery of the connector pin 31 is not joined, a member which becomes an obstacle is disposed above the inner housing part 3 on the approach path of the laser beam 53 described later. Not. That is, the contact portion 53a between the upper end portion of the first lead pin 15a and the one end portion 31a of the connector pin 31 is visible from substantially above. Next, the through hole 3b of the inner housing portion 3 is irradiated with the laser beam 53 at a predetermined incident angle from above, and the contact portion 53a between the upper end of the first lead pin 15a and one end 31a of the connector pin 31 is welded (Join).

  Next, for example, as shown in FIG. 15B, the socket housing 4 and the inner housing 3 are joined by laser welding. Thus, the socket housing 4 is joined to the upper surface of the upper portion 3 a of the inner housing 3 so as to surround the connector pin 31. At this time, for example, after the protrusion 4b provided on the inner wall of the socket housing 4 is brought into contact with the side surface of the protrusion 3c on the upper surface of the upper portion 3a of the inner housing 3 (FIG. 15A) Preferably, the socket housing portion 4 and the inner housing portion 3 are joined. Thus, the socket housing portion 4 can be joined to the inner housing portion 3 with high positional accuracy. Thereafter, an O-ring (not shown) is attached to the lower surface of the pedestal portion 21 of the screw portion 2 to complete the physical quantity sensor device 100 shown in FIG.

  As described above, according to the first embodiment, the housing portion is separated into the socket housing portion for housing the connector pin and the inner housing portion for housing the sensor element, so that the physical quantity sensor device is being assembled. Can expose the upper surface of the inner housing part. Therefore, by integrally molding the connector pin on the inner housing portion so that the contact portion (joint portion) between the connector pin and the lead pin is exposed on the upper upper surface of the inner housing portion, substantially during assembly of the physical quantity sensor device The contact portion between the connector pin and the lead pin can be exposed from above. That is, the member which becomes an obstacle on the approach path of the laser beam is not disposed above the contact portion between the connector pin and the lead pin. For this reason, the connector pin and the lead pin can be easily joined by laser welding from substantially above. Therefore, even if the physical quantity sensor device is further miniaturized and the diameter of the lead pin is reduced, the contact portion between the connector pin and the lead pin can be joined by laser irradiation from above, so the connector pin and the lead pin are easily joined. can do. Further, by reducing the diameter of the lead pin, the pressure receiving area of the sensor element can be reduced, and the pressure resistance can be improved.

  Further, according to the first embodiment, the inner housing portion can be easily assembled by fixing the inner housing portion to the sensor element with an adhesive. Further, according to the first embodiment, by separating the inner housing portion and the socket housing portion, the shape of the socket housing portion is changed without changing the configuration of the screw portion, the storage box and the inner housing portion. Can. Therefore, the shape of the socket housing portion can be changed in accordance with the shape of the plug inserted into the socket housing portion, and various plugs can be accommodated. Further, according to the first embodiment, since the screw portion is made of metal, it can be applied to a physical quantity sensor device of a pressure band (for example, 200 MPa) which can not withstand when the screw portion is made of resin.

Second Embodiment
Next, the configuration of the physical quantity sensor device according to the second embodiment will be described. FIG. 16 is a cross-sectional view showing the configuration of the physical quantity sensor device according to the second embodiment. The physical quantity sensor device according to the second embodiment differs from the physical quantity sensor device according to the first embodiment in the following two points. The first difference is that all the lead pins 15 (first and second lead pins 15a and 15b) have almost the same length without cutting the upper end of the second lead pin 15b for characteristic adjustment and trimming. . The second difference is that the upper portion 3a of the inner housing portion 3 is provided with a configuration in which the upper end portion of the second lead pin 15b does not contact the connector pin 31 (an arched portion 3e and a groove 3f described later) That is the point.

  Specifically, as shown in FIG. 16, for example, the second lead pin 15b is inserted into a portion (upper portion of the second lead pin 15b) corresponding to the second lead pin 15b of the upper portion 3a of the inner housing portion 3. A groove 3 f is provided. Further, a portion 3 e raised upward in an arch shape is provided on the upper portion 3 a of the inner housing portion 3 at a portion corresponding to the second lead pin 15 b so as to cover the upper end portion of the second lead pin 15 b. The second lead pin 15 b is separated from the space 41 surrounded by the socket housing portion 4 by the arched portion 3 e. The lead pin 15 has a length which does not protrude upward from the through hole 3 b of the inner housing portion 3. For this reason, in the portion corresponding to the second lead pin 15b of the upper portion 3a of the inner housing portion 3, the depth of the groove 3f may be about the same as the thickness of the upper portion 3a of the inner housing portion 3 Is almost flat. Further, the connector pin 31 is integrally formed on the upper portion 3 a of the inner housing portion 3 so as not to be exposed to the side wall of the groove 3 f of the upper portion 3 a of the inner housing portion 3. For example, the groove 3f may be disposed between the connector pins 31 without changing the shape of the connector pin 31, or the horizontal portion 31b of the connector pin 31 may be bent so as to bypass the groove 3f.

  As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained. Further, according to the second embodiment, the process of cutting the second lead pin can be omitted, and the assembly process of the physical quantity sensor device can be simplified.

Third Embodiment
Next, the configuration of the physical quantity sensor device according to the third embodiment will be described. FIG. 17 is a cross-sectional view showing the configuration of the physical quantity sensor device according to the third embodiment. The physical quantity sensor device according to the third embodiment differs from the physical quantity sensor device according to the first embodiment in that the control circuit, the surge protection element, and the control circuit chip (semiconductor chip) 19 in which the filter is formed Are placed outside the

  Specifically, the control circuit chip 19 in which the control circuit, the surge protection element, and the filter described above are formed is disposed on the upper surface of the noise reduction substrate 17. Two semiconductor chips, a chip capacitor 18 and a control circuit chip 19, are disposed on the top surface of the noise countermeasure substrate 17. On the pressure sensor chip 11, only a pressure sensor element such as a Wheatstone bridge circuit constituted by a gauge is formed. In this case, at the time of characteristic adjustment / trimming, the needle (probe) can be put on each electrode of the control circuit chip 19 to perform characteristic adjustment / trimming, so that it is not necessary to provide a second lead pin for characteristic adjustment / trimming . Further, in order to fix the noise countermeasure substrate 17, a third lead pin 15c which is not connected to any of the electrodes may be provided.

  As described above, according to the third embodiment, the same effect as that of the first embodiment can be obtained.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, although the pressure sensor device is described as an example in each of the embodiments described above, the present invention is not limited to each of the embodiments described above. For example, physical quantities other than pressure such as acceleration, gyro (angle or angular velocity), flow rate and temperature The present invention is also applicable to a physical quantity sensor device that detects In each of the above-described embodiments, a strain gauge type pressure sensor chip is described as an example, but semiconductor piezoresistive type, capacitance type and silicon resonant type pressure sensor chips can also be applied.

  As described above, the physical quantity sensor device and the method of manufacturing the physical quantity sensor device according to the present invention are useful for a physical quantity sensor device provided with a sensor chip that applies pressure from the recess side (diaphragm side) of the storage box. Suitable for sensor devices.

Reference Signs List 1 sensor element 2 screw portion 3 inner housing portion 3a upper portion of inner housing portion 3b through hole in inner housing portion 3c protrusion portion on upper surface of upper portion of inner housing portion 3d unevenness in upper outer peripheral portion of inner housing portion 3e upper portion of inner housing portion Arched part 3f Groove on upper part of inner housing part 4 Socket housing part 4a Concaves and convexes on lower end part of socket housing part 4b Protrusions on inner wall of socket housing part 10 Storage box 10a Storage box recess 10b Storage box through hole 10c Storage box hole 11 Pressure sensor chip 11a Diaphragm 12 Base member 13 Diaphragm 14 Bonding wire 15, 15a to 15c Lead pin 16 Insulating member 17 Noise countermeasure substrate 17a Noise countermeasure substrate through hole 18 Tip coerce Capacitor 19 the control circuit chip 20 liquid 21 one of the open ends of the opening of the through hole 24 threaded portion of the base portion 22 welded portion 23 screw part (pressure opening)
25 Opening of the other open end of the screw 31 Connector pin 31a, 31d, 31e End of connector pin 31b Horizontal part of connector pin 31c Vertical part of connector pin 32 Recess in inner housing part 41 Surrounded by socket housing part Space 51 Adhesive 52 Metal ball 53 Laser light 53a Contact between the upper end of the first lead pin and one end of the connector pin 54 Part where the connector pin and the lead pin are melted 100 physical quantity sensor device

Claims (9)

A first step of fixing the sensor element so as to close the introduction hole on a pedestal portion provided at one end of the introduction hole of a screw portion having an introduction hole for introducing a pressure measurement gas or a pressure measurement liquid;
The first housing portion is fixed to the sensor element so as to receive the first terminal for taking out the signal of the sensor element, which is disposed in the sensor element so as to sandwich the sensor element with the screw portion. The second step of
A third step of bonding the first terminal and a second terminal disposed in the first accommodation portion and serving as a connection portion to an external wiring;
A fourth step of fixing the second accommodating portion to the first accommodating portion so as to sandwich the first accommodating portion with the sensor element and to accommodate the second terminal;
Including
In the second step, the first terminal and the second terminal are brought into contact with each other so as to be exposed to the outside of the first accommodation portion,
In the third step, the contact portion between the first terminal and the second terminal is irradiated with a laser to bond the first terminal and the second terminal, and the method for manufacturing a physical quantity sensor device . The second terminal is integrated with the first housing portion and has a first portion exposed to the outside of the first housing portion,
In the second step, the first terminal is penetrated through the through hole of the first accommodation portion, and the first terminal is brought into contact with the first portion inside the through hole of the first accommodation portion. A method of manufacturing a physical quantity sensor device according to claim 1. The second terminal is connected to the first portion, and has a second portion projecting to the outside of the first accommodation portion.
The method of manufacturing a physical quantity sensor device according to claim 2, wherein in the fourth step, the second portion is accommodated in the second accommodation portion. The first housing portion and the second housing portion are resin members,
The method for manufacturing a physical quantity sensor device according to any one of claims 1 to 3, wherein the first storage portion is fixed to the sensor element with an adhesive in the second step. A first step of fixing the sensor element so as to close the introduction hole on a pedestal portion provided at one end of the introduction hole of a screw portion having an introduction hole for introducing a pressure measurement gas or a pressure measurement liquid;
The first housing portion is fixed to the sensor element so as to receive the first terminal for taking out the signal of the sensor element, which is disposed in the sensor element so as to sandwich the sensor element with the screw portion. The second step of
A third step of bonding the first terminal and a second terminal disposed in the first accommodation portion and serving as a connection portion to an external wiring;
A fourth step of fixing the second accommodating portion to the first accommodating portion so as to sandwich the first accommodating portion with the sensor element and to accommodate the second terminal;
Including
In the second step, the first storage portion is fixed to the sensor element with an adhesive. A screw portion having an introduction hole for introducing a pressure measurement gas or a pressure measurement liquid, and having a pedestal at one end of the introduction hole;
A sensor element fixed on the pedestal so as to close the introduction hole;
A first terminal disposed in the sensor element for extracting a signal of the sensor element;
A first accommodating portion fixed to the sensor element so as to sandwich the sensor element between the screw portion and the first accommodating portion for accommodating the first terminal;
A second terminal disposed in the first housing portion and joined to the first terminal, which is a connection portion with an external wiring;
A second accommodating portion fixed to the first accommodating portion so as to sandwich the first accommodating portion between the sensor element and the second accommodating portion for accommodating the second terminal;
A physical quantity sensor device comprising:   The physical quantity sensor device according to claim 6, wherein a contact portion between the first terminal and the second terminal is exposed to the second accommodation portion side and is joined at the contact portion. The second terminal is integrated with the first housing portion and has a first portion exposed to the outside of the first housing portion,
The said 1st terminal penetrates the through-hole of a said 1st accommodating part, It is joined to the said 1st part inside the through-hole of a said 1st accommodating part, It is characterized by the above-mentioned. Physical quantity sensor device. The second terminal is connected to the first portion, and has a second portion projecting to the outside of the first accommodation portion.
The physical quantity sensor device according to claim 8, wherein the second accommodation portion accommodates the second portion.

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