CN111936835A

CN111936835A - Pressure sensor

Info

Publication number: CN111936835A
Application number: CN201880092041.4A
Authority: CN
Inventors: 高月修; 笠原龙则; 保坂优太; 金原太郎
Original assignee: Fujikoki Corp
Current assignee: Fujikoki Corp
Priority date: 2018-03-30
Filing date: 2018-11-07
Publication date: 2020-11-13
Anticipated expiration: 2038-11-07
Also published as: WO2019187303A1; JPWO2019187303A1; JP6709486B2; CN111936835B

Abstract

Provided is a pressure sensor which has a conductive member with a simple structure for suppressing the influence of electrostatic noise and the like, and which can be miniaturized and can be manufactured at a reduced cost. A pressure sensor (1) is provided with: a diaphragm (50) subject to fluid pressure; a base (40) in which a pressure receiving space (52) in which an insulating medium is sealed is formed between the base and the diaphragm (50); a pressure detection device (60) disposed on the base (40) in the pressure receiving space (52) and configured to detect a pressure transmitted to the insulating medium and convert the pressure into a voltage signal; a plurality of terminal pins (70, 72) for making electrical connection between the pressure detection device (60) and an external circuit; and a conductive member (150) having a conductive plate (151) disposed so as to face the surface of the pressure detection device (60) and a leg (152) supporting the conductive plate (151), wherein at least either of the conductive plate (151) and the terminal pin is electrically connected.

Description

Pressure sensor

Technical Field

The present invention relates to a pressure sensor.

Background

A pressure sensor having a pressure detection device is used to detect a refrigerant pressure in a refrigeration and refrigeration apparatus or an air conditioning apparatus, or to detect various fluid pressures in an industrial equipment machine. In one type of such a pressure detection device, the sensor chip is disposed in a pressure receiving chamber partitioned by a diaphragm and sealed with oil, and thus the pressure sensor has a function of converting a pressure change in the pressure receiving chamber into a voltage signal and outputting the voltage signal to the outside.

However, in this type of pressure detection device, there is a concern that static electricity may be charged for some reason.

In contrast, the following patent documents disclose the following: in the pressure receiving space in which oil is sealed, a conductive member is arranged particularly between the sensor chip and the diaphragm, and the conductive member is connected to a zero potential of a circuit in the sensor chip to remove electricity.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 3987386 Specification

Technical problem to be solved by the invention

Here, according to the conventional technique of patent document 1, a cylindrical space is formed by a metal lower plate and a metal member, and a sensor chip is disposed in the space, or the metal member is joined to an upper end of an oil filling pipe, a support ring, or an annular metal member. However, when the metal members are joined in this way, the manufacturing man-hours increase and the cost rises. Further, since a space for installing a backup ring or an annular metal member is required, the pressure sensor is increased in size.

Disclosure of Invention

The invention aims to provide a pressure sensor which is provided with a conductive member for inhibiting the influence caused by static noise and the like by a simple structure, and can realize miniaturization and reduce cost.

Means for solving the problems

In order to achieve the above object, a pressure sensor according to the present invention includes:

a diaphragm that is subject to fluid pressure;

a base forming a pressure receiving space in which an insulating medium is sealed between the base and the diaphragm;

a pressure detection device disposed on the base in the pressure-receiving space, detecting a pressure transmitted to the insulating medium, and converting the pressure into a voltage signal;

a plurality of terminal pins for making electrical connection between the pressure detection device and an external circuit; and

a conductive member having a conductive plate disposed to face a surface of the pressure detection device and a leg portion supporting the conductive plate,

at least the conductive plate is electrically connected to any one of the terminal pins.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to provide a pressure sensor that has a conductive member that suppresses the influence of electrostatic noise or the like with a simple structure, and that can be reduced in size and cost.

Drawings

Fig. 1 is a longitudinal sectional view showing a pressure sensor according to a first embodiment of the present invention.

Fig. 2 is a cross-sectional view of the pressure sensor of fig. 1, taken along the line a-a and viewed in the direction of the arrows.

Fig. 3 is a longitudinal sectional view of the pressure sensor of fig. 2, taken along line B-B, showing the pressure detecting unit and its vicinity.

Fig. 4 is a perspective view of a conductive member attached to a static elimination plate.

Fig. 5 is a diagram illustrating a process of manufacturing the pressure detection unit according to the first embodiment.

Fig. 6 is a diagram illustrating a process of manufacturing the pressure detection unit according to the first embodiment.

Fig. 7 is a diagram illustrating a process of manufacturing the pressure detection unit according to the first embodiment.

Fig. 8 is a longitudinal sectional view of a pressure sensor according to a second embodiment of the present invention.

Fig. 9 is an enlarged cross-sectional view showing the pressure detection unit and its vicinity in the pressure sensor of fig. 8.

Fig. 10 is a cross-sectional view of the pressure detecting unit shown in fig. 9, taken along the line C-C and viewed from the direction of the arrows.

Fig. 11 is a view of the pressure detection unit shown in fig. 9 as viewed from the direction of arrow D.

Fig. 12 is a perspective view of the conductive member according to the present embodiment.

Fig. 13 is a diagram illustrating a process of manufacturing the pressure detection unit according to the second embodiment.

Fig. 14 is a diagram illustrating a process of manufacturing the pressure detection unit according to the second embodiment.

Fig. 15 is a diagram illustrating a process of manufacturing the pressure detection unit according to the second embodiment.

Detailed Description

(first embodiment)

Embodiments according to the present invention will be described below with reference to the drawings. Fig. 1 is a longitudinal sectional view showing an embodiment of a pressure sensor. As shown in fig. 1, the pressure sensor 1 includes a cover 10 made of resin, and the cover 10 has the following shape: the large cylinder portion 10a having a circular tube-like cross section, for example, is arranged coaxially with the small cylinder portion 10b having an annular, oblong, or elliptical cross section, and the ends of the large cylinder portion 10a and the small cylinder portion 10b are joined together via the step portion 10 d. The pressure detection unit 2 is attached to the inside of the large tube portion 10a of the cover 10.

The pressure detection unit 2 includes: a disk-shaped mounting member 30 for supporting the coupling nut 20 to which a fluid inflow pipe, not shown, is connected; a disk-shaped base 40 disposed opposite to the mounting member 30; and a metal diaphragm 50, wherein the outer periphery of the diaphragm 50 is sandwiched between the mounting member 30 and the base 40. The mounting member 30, the base 40, and the diaphragm 50 are formed of, for example, a stainless alloy, and the outer peripheral portions thereof are integrated by welding W.

A cylindrical portion 20a is formed to protrude from the upper end of the coupling nut 20, and the cylindrical portion 20a is sealingly fitted and fixed to a circular hole 30a formed in the center of the mounting member 30 by brazing or the like. A through passage 20b is formed inside the cylindrical portion 20a, and the inside of the attachment member 30 and the inside of the coupling nut 20 communicate with each other through the through passage.

Fig. 2 is a cross-sectional view of the pressure sensor 1 of fig. 1 cut along the line a-a and viewed from the direction of the arrows. Fig. 3 is a longitudinal sectional view of the pressure sensor 1 of fig. 2 cut along the line B-B to show the pressure detection unit 2 and its vicinity.

In each of the drawings, an insulating liquid medium such as oil is filled in a pressure receiving space (pressure receiving chamber) 52 defined by the base 40 and the diaphragm 50 (see fig. 3 in particular). After the liquid medium is filled into the pressure receiving space, the ball 40b is fixedly attached to the base 40 by means of welding or the like as shown in fig. 1 in order to close the pressure receiving space.

In fig. 3, a semiconductor-shaped pressure detection device 60 is disposed in the center of the susceptor 40 on the pressure receiving space 52 side. The pressure detection device 60 includes a glass pedestal 62 fixed to the base 40, and a pressure detection element (semiconductor chip) 64 attached to a surface of the pedestal 62.

In fig. 2, eight bonding pads (electrodes) are provided near the outer periphery of the pressure detection element 64. As shown in fig. 5, three of the bonding pads are a sensor input power pad 64a, a ground pad 64b, and a sensor output pad 64c, and the remaining five are signal adjustment pads 64 d. However, the number of the bonding pads is not limited to eight. In the present embodiment, the voltage of the sensor input power pad 64a is maintained at 5V, the voltage of the ground pad 64b is maintained at 0V, and the voltage of the sensor output pad 64c is changed in a range of 0V or more and 5V or less (preferably, 0.5V or more and 4.5V or less) according to the detected pressure. The arrangement of the bonding pads is not limited to the above.

A plurality of (eight in this example)

terminal pins

70 and 72 are disposed around the semiconductor-shaped pressure detection device 60 so as to penetrate the base 40. The terminal pins 70, 72 are insulated and sealed with respect to the base 40 by a hermetic seal 74.

One of the plurality of terminal pins is a terminal pin 70 for grounding. Seven terminal pins 72 and one terminal pin 70 for grounding, excluding the terminal pin for grounding, are connected to the wiring of the relay substrate 90 shown in fig. 1.

A lead wire 94 is provided in a control panel of a refrigeration and refrigeration apparatus, an air conditioning apparatus, or the like, in which the pressure sensor 1 is provided, and the lead wire 94 is connected to a circuit not shown. From such a circuit, a power supply voltage can be applied to the pressure detection element 64 via the lead wire 94 and the terminal pins 70 and 72, and a pressure detection signal can be output.

In fig. 2, the sensor input power supply pad 64a, the sensor output pad 64c, and the signal adjustment pad 64d of the semiconductor-shaped pressure detection device 60 (pressure detection element 64) other than the ground pad 64b are connected (wired) to the terminal pin 72 by the bonding wire 80. In the present embodiment, the ground pad 64b is connected (wired) to a power strip 100 (described later) via a bonding wire 82, and the power strip 100 and the terminal pin 70 for grounding are connected (wired) via a bonding wire 81.

In fig. 1, after the pressure detection unit 2 described above is disposed so as to abut against the stepped portion 10d formed inside the large tube portion 10a of the cover 10, the interior of the cover 10 is filled with the resin P from the lower end side of the large tube portion 10a and the upper end side of the small tube portion 10b (lead wire 94 leading side), and is cured. Thereby, the electrical components of the pressure detection unit 2 are hermetically fixed in the cover 10.

The pressure detection device 60 operates by being supplied with power from an external circuit via the terminal pin 72 for inputting power. When the fluid is introduced into the coupling nut 20 and enters the fluid introduction chamber 32 inside the mounting member 30, the diaphragm 50 is elastically deformed by the pressure, and the insulating medium in the pressure receiving space 52 is pressurized. The pressure detection element 64 detects the pressure fluctuation, converts the pressure fluctuation into an electric signal, and outputs the electric signal, that is, a pressure detection signal to the outside via the terminal pin 72. The external circuit to which the pressure detection signal is input can detect the pressure of the fluid introduced into the coupling nut 20 with high accuracy.

In the present embodiment, as shown in fig. 2 and 3, the discharging plate 100 is bonded to the base 40 by using an adhesive or the like around the semiconductor-shaped pressure detecting device 60.

The outer shape of the neutralization plate 100 has an outer peripheral shape of a polygonal shape (here, an octagon), and a window hole 102 for surrounding the outer periphery of the pressure detection device 60 is provided inside the neutralization plate 100.

The electricity removal plate 100 is composed of an insulating plate made of an inorganic material such as ceramic or glass, or a material having high heat resistance such as polyamide, polyimide, polyethylene terephthalate (PET), or PPS, and a conductive layer formed on one surface 101 of the insulating plate. Preferably, the face opposite to the face 101 is bonded to the base 40. The conductive layer may be formed in a metal plate shape, or may be formed by printing or firing. The conductive layer is typically made of gold, silver, copper, aluminum, nickel, or the like, but a material having a high melting point such as tungsten or molybdenum can be used to obtain high voltage durability.

As is clear from the above, the surface 101 of the charge removal plate 100 is electrically conductive and insulated from the base 40.

As shown in fig. 2, the surface 101 is connected to the ground pad 64b via a bonding wire 82, and the surface 101 is connected to the terminal pin 70 for grounding via a bonding wire 81.

The terminal pin 70 for grounding is connected to a zero potential of a circuit provided in a control panel of a refrigeration and refrigeration apparatus, an air conditioning apparatus, or the like, in which the pressure sensor 1 is provided, via a lead wire 94 (fig. 1). That is, the surface 101 of the neutralization plate 100 is connected to a zero potential.

Fig. 4 is a perspective view of the conductive member 150 attached to the discharging plate 100. The conductive member 150 includes a substantially rectangular plate-shaped conductive plate 151 integrally formed by pressing a metal plate, for example, and a pair of leg portions 152 extending obliquely and symmetrically from the centers of opposite edges of the conductive plate 151. The distal end of each leg 152 is bent in an L shape to form a mounting portion 153.

As shown in fig. 3, the conductive member 150 is attached to the discharging plate 100 via the leg portion 152 by closely engaging the attachment portion 153 with the outer peripheral edge of the surface 101 of the discharging plate 100, and the conductive plate 151 is disposed to face the upper surface of the pressure detecting device 60. Since the mounting portion 153 is fixed to the surface 101 by soldering, the conductive plate 151 is maintained at zero potential similarly to the surface 101 of the charge eliminating plate 100. In fig. 2, the conductive plate 151 of the conductive member 150 is shown in a double-hatched manner, and the pressure detection device 60 is shown in a perspective view.

According to the present embodiment, when the liquid medium filled in the pressure receiving space 52 is electrically charged due to the surrounding environment, a large potential difference is generated between the diaphragm 50 and the conductive plates 151 of the conductive member 150, but the potential difference between the conductive plates 151 and the pressure detection device 60 is maintained at substantially zero. Therefore, in addition to maintaining the surface 101 of the discharging plate 100 at zero potential, the influence of the electrification of the pressure detecting device 60 can be suppressed.

Further, according to the present embodiment, as described below, since the conductive member 150 can be assembled at an appropriate position only by soldering the mounting portion 153 of the leg portion 152 to the electric board 100, it is possible to reduce the size of the pressure sensor, to reduce the number of manufacturing steps, and to reduce the cost.

Fig. 5 to 7 are diagrams showing a process of manufacturing the pressure detection unit 2 according to the present embodiment, and are viewed from a plan view as in fig. 2. First, in fig. 5, the terminal pins 70 and 72 are attached to the base 40 via the airtight seal 74, and are joined to the pressure detection device 60.

As shown in fig. 6, a neutralization plate 100 having a conductive layer formed on a surface 101 is bonded to the base 40 while surrounding the pressure detection device 60 through a window hole 102.

Subsequently, as shown in fig. 7, the terminal pin 72 other than the ground is connected to the power input pad 64a, the sensor signal output pad 64c, and the signal adjustment pad 64d via the bonding wire 80, and the terminal pin 70 for the ground is connected to the ground pad 64b via the neutral plate 100 and the

bonding wires

81 and 82.

Referring to the plan view shown in fig. 2, the entire pressure detection device 60 is covered with the conductive plate 151 of the conductive member 150, and the mounting portion 153 of the leg portion 152 is soldered to the surface 101 of the discharging plate 100. The conductive plate 151 is disposed at a predetermined position with respect to the surface 101 and in parallel with the surface 101 via the leg portion 152. Since the interval between the pair of mounting portions 153 is substantially equal to the width of the surface 101, the conductive plate 151 can be disposed centered with respect to the center of the pressure detection device 60 simply by engaging the mounting portions 153 with the edges of the surface 101. Further, since the width of the leg portion 152 is sufficiently smaller than the size of the pressure detection device 60, the mounting can be performed without interfering with the bonding wire 80.

As shown in fig. 1 and 3, the mounting member 30 is welded to the base 40 with the diaphragm 50 interposed therebetween, and after the liquid medium is injected into the pressure receiving space 52 through the hole 40a of the base 40, the hole 40a is sealed by the ball 40b as shown in fig. 1. The mounting member 30 is welded to the base 40 in a state where the coupling nut 20 is joined. The pressure detection unit 2 is manufactured as described above. As shown in fig. 1, the pressure detection unit 2 thus fabricated is mounted on the cover 10 and appropriately wired.

According to the present embodiment described above, the conductive member 150 is connected to the zero potential via the terminal pin 70 connected to the ground pad 64b of the pressure detection device 60, but is not limited thereto. For example, the terminal pin 72 connected to the power input pad (power voltage terminal) 64a of the pressure detection device 60 may be connected to the conductive member 150, or the terminal pin 72 connected to the signal output pad 64c may be connected to the conductive member 150, and the signal output pad 64c may output an electric signal (voltage force signal) according to the pressure detected by the pressure detection device 60. This improves the degree of freedom in selecting the terminal pin to be wire-bonded to the conductive member 150, and is therefore advantageous for design and implementation. The conductive member 150 and the terminal pin may be connected directly or indirectly via another conductive member.

Here, the power supply voltage of the pressure detection device 60 is about 5V, and the sensor output voltage is usually about 0.5 to 4.5V. Therefore, even when the conductive member 150 is connected to the terminal pin 72 connected to the power supply voltage pad and is set to a potential of 5V, for example, the potential difference between the diaphragm 50 and the conductive member 150 is very large (at most, several hundred V or more in the case of charging), and therefore there is almost no difference in the effect on the pressure detection device 60 from the effect of the conductive member 150 being set to zero potential.

The joining between the conductive member 150 and the charge removing plate 100 is not limited to soldering, and may be electrically connected by other means such as adhesion using a conductive adhesive. The conductive plate 151 and the leg portion 152 may be separate bodies, and for example, a terminal pin may be used as the leg portion. When the leg portion 152 is a nonconductive member, the conductive plate 151 and the terminal pin are directly connected.

Further, although the conductive member 150 of the present embodiment is connected to the base 40 via the discharging plate 100, it may be directly provided on the base 40 without via the discharging plate 100. However, in order to maintain the conductive member 150 at a predetermined potential, it is necessary to dispose an insulator between the conductive base 40 and the leg portion 152, and connect the terminal pin 70 (or 72) and the conductive member 150 via a bonding wire or another conductive member.

(second embodiment)

Next, a second embodiment will be described with reference to the drawings. Fig. 8 is a longitudinal sectional view of a pressure sensor 1A according to a second embodiment of the present invention. Fig. 9 is a cross-sectional view showing the pressure detection unit 2A and its vicinity in the pressure sensor 1A of fig. 8 enlarged. Fig. 10 is a cross-sectional view of the pressure detecting unit 2A shown in fig. 9 cut along the line C-C and viewed from the arrow direction. Fig. 11 is a view of the pressure detection unit 2A shown in fig. 9 as viewed from the direction of arrow D. Fig. 12 is a perspective view of the conductive member 150A.

In the second embodiment, the pressure detection unit 2A does not have a discharging plate, the terminal pins are set to five, and the base 40A and the conductive member 150A are different in shape from the first embodiment. Since the other configurations are the same as those of the first embodiment, the same reference numerals are used and redundant description is omitted.

Referring to fig. 9 and 10, three

terminal pins

70, 71, and 72 and two support pins 73 are disposed around the semiconductor-shaped pressure detection device 60 so as to penetrate the base 40A. The terminal pins 70, 71, and 72 and the support pin 73 are preferably formed of the same conductive material, and preferably have the same shape and length. The terminal pins 70, 71, and 72 and the support pin 73 are insulated and sealed from the through hole of the base 40 by the airtight seal 74.

Among the three terminal pins, the terminal pin 70 is for grounding, the terminal pin 71 is for power input, the terminal pin 72 is for sensor signal output, and the two support pins 73 support the conductive member 150A. The terminal pins 70, 71, 72 are electrically connected to the respective pads of the pressure detecting element 64 via bonding wires 80. Further, the positions of the pads of the pressure detecting element 64 are different from those of the first embodiment.

As shown in fig. 12, the conductive member 150A according to the present embodiment is formed such that the mounting portions 153A at the distal ends of the pair of leg portions 152 are not formed in an L shape, but extend substantially parallel to the conductive plate 151 and face each other.

As shown in fig. 9, the end of the support pin 73 protrudes from the base 40A toward the diaphragm 50, and the end abuts against the mounting portion 153A, and the support pin 73 and the mounting portion 153A are joined by laser welding or the like so as to be electrically conductive. The support pin 73 and the mounting portion 153A may be joined by soldering, application of a conductive adhesive, soldering, or the like, but it is preferable that the mounting portion 153A is joined with a gap so as not to contact the hermetic seal 74 or the base 40A.

In fig. 11, the upper ends of the terminal pins 70, 71, and 72 and the support pin 73 are fixed to the relay board 90, and the terminal pins 70, 71, and 72 and the support pin 73 extend to the back side in the vertical direction of the paper. The lower ends of the three

link pins

91a, 91b, and 91c are fixed to the relay board 90, and the three

link pins

91a, 91b, and 91c extend toward the front side in the vertical direction of the drawing sheet. The connection pins 91a, 91b, and 91c are engaged with a female member in the connector 92 (fig. 8) and receive signals with an external circuit.

In the present embodiment, the terminal pin 70 for grounding is connected to the connecting pin 91a via the wiring WL on the relay board 90, and the connecting pin 91a is connected to one support pin 73 (on the right side in fig. 11) via the wiring WL. That is, the conductive member 150A is electrically connected to the terminal pin 70 for grounding. In this case, the other support pin 73 (left side in fig. 11) is a dummy pin that is not electrically connected, but both support pins 73 may be connected to the conductive member 150A.

In the relay board 90, the terminal pin 71 for power input is connected to the connection pin 91b via a wire WL, and the terminal pin 72 for sensor signal output is connected to the connection pin 91c via a wire WL. However, instead of the terminal pin 70 for grounding, a terminal pin 71 for power input or a terminal pin 72 for signal input may be connected to the support pin 73 via a wire WL and electrically connected to the conductive member 150A.

Further, on the relay substrate 90, capacitors CP are connected between the terminal pin 70 for grounding and the terminal pin 71 for power input, and between the terminal pin 70 for grounding and the terminal pin 72 for sensor signal output, respectively. However, such a capacitor CP is for suppressing transmission of noise from the outside to the pressure detection device 60, and is not necessarily provided.

As in the above-described embodiment, when the liquid medium filled in the pressure receiving space 52 is electrically charged by the surrounding environment, a large potential difference is generated between the diaphragm 50 and the conductive plates 151 of the conductive member 150A, but the potential difference between the conductive plates 151 and the pressure detection device 60 is maintained at substantially zero. Therefore, the influence of the electrification of the pressure detection device 60 can be suppressed. In addition, according to the present embodiment, simplification of the structure and reduction in cost are achieved by not providing a neutralization plate.

Next, a mounting process of the pressure detection unit 2A will be described. First, as shown in fig. 13, after the terminal pins 70, 71, and 72 and the support pin 73 are fixed to the through holes of the base 40A by the airtight seal 74, the pressure detection device 60 is fixed to the center of the base 40A by an adhesive.

Here, the temperature correction operation (adjustment operation) of the pressure detecting element 64 is performed by bringing the energizing probe into contact with the bonding pad of the pressure detecting device 60.

Here, in a state where a load (pressure) is applied to the pressure detection element 64 at a reference temperature (for example, room temperature), an output value output from the sensor signal output pad 64c or the signal adjustment pad 64d is read, and a relationship between a predetermined pressure and an output is obtained, thereby setting a correction coefficient (correction function).

Next, as shown in fig. 14, the terminal pins 70, 71, and 72 are connected to the corresponding ground pad 64b, power input pad 64a, and sensor signal output pad 64c of the pressure detection device 60 by bonding wires 80.

Subsequently, as shown in fig. 15, the conductive plate 151 and the pressure detection device 60 are opposed to each other, and the mounting portion 153A of the conductive member 150 is brought into contact with the end portion of the support pin 73, and then the contact portion is irradiated with the laser beam LB to perform bonding.

After the base 40A and the mounting member 30 sandwich the diaphragm 50, the outer peripheries thereof are welded, oil is filled into the pressure receiving chamber 52 from the hole 40A of the base 40A, and the seal ball 40b is welded to complete the pressure detecting unit 2A (fig. 9). Subsequently, as described in connection with fig. 11, the end portions of the terminal pins 70, 71, 72 and the support pin 73 of the pressure detection unit 2A are fixed to the relay board 90 by an adhesive, and are connected to the connection pins 91a, 91b, 91c via the wiring WL.

Description of the symbols

1. 1a … pressure sensor; 2. 2a … pressure detection unit; 10 … a cover; 20 … connecting nut; 30 … mounting components; 32 … fluid introduction chamber; 40. a 40A … base; a 50 … septum; 52 … pressure-containing space; 60 … pressure sensing means; 62 … a vitreous stand; 64 … pressure sensing element; 70 … terminal pins for grounding; 71. 72 … terminal pins; 73 … support pins; 74 … airtight seals; 80 … bond wires; 81. 82 … bond wires for grounding; 90 … relay substrate; a 92 … connector; 94 lead wires 94 …; 100 … electricity removal board; 150. 150a … conductive member; 151 … a conductive plate; 152 … foot.

Claims

1. A pressure sensor, comprising:

a diaphragm that is subject to fluid pressure;

2. The pressure sensor of claim 1,

a voltage-eliminating plate is arranged on the base around the pressure detection device,

the conductive member has a leg portion which is conductive and is joined to the discharging plate,

the discharging plate is electrically connected to any one of the terminal pins.

3. The pressure sensor of claim 1,

the conductive member has a conductive leg portion connected to a conductive support pin fixed to the base,

the support pin is electrically connected to any one of the terminal pins.

4. The pressure sensor according to any one of claims 1 to 3,

the terminal pin electrically connected to the conductive plate is a terminal pin connected to a ground terminal of the pressure detection device, a terminal pin connected to a power supply voltage terminal of the pressure detection device, or a terminal pin outputting a voltage force signal of the pressure detection device.

5. The pressure sensor of any one of claims 1 to 4,

the conductive member is integrally formed with the conductive plate and the leg portion by punching a metal plate.