CN106052938A - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
- Publication number
- CN106052938A CN106052938A CN201610188426.3A CN201610188426A CN106052938A CN 106052938 A CN106052938 A CN 106052938A CN 201610188426 A CN201610188426 A CN 201610188426A CN 106052938 A CN106052938 A CN 106052938A
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- CN
- China
- Prior art keywords
- pressure
- detecting element
- electroplax
- except
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a pressure sensor capable of simplifying the assembling work and improving the accuracy of the product. The pressure sensor includes a diaphragm that receives pressure from a fluid; a base that forms a pressurized space in which an insulating medium such as an oil is sealed between the base and the diaphragm; a pressure sensing element which is disposed in a pressed space and comprises a plurality of bonding pads comprising a grounding pad; a plurality of terminal pins and a ground terminal pin, wherein the plurality of terminal pins and the one ground terminal pin pass through the base to be electrically connected with the pressure sensing element. An electricity removing plate is disposed between the base and the pressure sensing element, and the surface, at the side of the pressure sensing element, of the electricity removing plate is provided with a conductive layer. Moreover, the conductive layer is electrically connected with the ground pad and the grounding terminal pins.
Description
Technical field
The present invention relates to pressure transducer, especially relate to contain the liquid-filled pressure of semi-conductor type pressure-detecting device
Force transducer.
Background technology
In the past, semi-conductor type pressure-detecting device was contained in filling in the compression chamber being divided and being sealed with machine oil by barrier film
Liquid formula pressure transducer be equipped on fridge-freezer, air-conditioning device and detect refrigerant pressure, or be equipped on commercial plant
And for the detection of various fluid pressure.
Semi-conductor type pressure-detecting device is configured in above-mentioned compression chamber, has and the pressure in pressurized space is changed conversion
For the function that the signal of telecommunication output are outside.
The barrier film being configured in pressurized space be have flexibility metallic plate, when with the pressure detecting being made up of quasiconductor
When producing potential difference, the machine oil static electrification of inclosure between element, pressure detecting element or its output signal produce bad sometimes
Situation.
Therefore, the following Patent Document 1 discloses a kind of pressure transducer, it is containing above-mentioned pressure detecting unit
Electroconductive component is configured further, by zero electricity by this electroconductive component with the circuit in detection device in the pressurized space of part
Position connects, and realizes eliminating above-mentioned unfavorable condition.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2015-4591 publication
The problem that invention is to be solved
But, in pressure transducer disclosed in patent documentation 1, above-mentioned pressure detecting element is with electroconductive component dividually
Constitute, when it manufactures, after above-mentioned pressure detecting element is installed on the upper side member (pedestal) forming above-mentioned pressurized space
After above-mentioned electroconductive component being installed or above-mentioned electroconductive component being installed on above-mentioned upper side member, above-mentioned pressure detecting element is installed.
Therefore, when above-mentioned installation, need above-mentioned pressure detecting element or electroconductive component relative to above-mentioned upper lateral part
Part positions respectively, and installation exercise is miscellaneous, and packaging efficiency declines, and there is the load of the Product Precision decline relating to multiple bearing
Melancholy.
Summary of the invention
Therefore, it is an object of the invention to provide a kind of can simplify assembling operation, improve Product Precision pressure transducer.
For solving the means of problem
In order to achieve the above object, the pressure transducer of the present invention possesses: barrier film, and described barrier film bears the pressure of fluid；
Pedestal, forms the pressurized space being sealed with the insulating properties media such as machine oil between described pedestal and described barrier film；Pressure detecting unit
Part, described pressure detecting element is located in described pressurized space and possesses the multiple joint sheets comprising ground mat；And it is many
Individual terminal pins and 1 ground terminal pin, the plurality of terminal pins and the described through described pedestal of 1 ground terminal pin and with institute
Stating pressure detecting element electrical connection, described pressure transducer is characterised by, described pedestal and described pressure detecting element it
Between be configured with except electroplax, described be formed with conductive layer, and described conduction on the surface of described pressure detecting element side except electroplax
Layer is electrically connected with described ground mat and described ground terminal pin.
It addition, in an embodiment of the pressure transducer of the present invention, described pressure detecting element is formed at supporting substrates
On, described supporting substrates engages except electroplax with described.
Additionally, in other embodiments of the pressure transducer of the present invention, described pressure detecting element is formed directly into institute
State except on electroplax.
Invention effect
Pressure transducer according to the present invention, using the teaching of the invention it is possible to provide a kind of can simplify assembling operation, improve Product Precision pressure
Force transducer.
Accompanying drawing explanation
Fig. 1 is the longitudinal section of the pressure transducer of embodiments of the invention 1.
Fig. 2 be from pressurized space side observe embodiments of the invention 1 pressure transducer pressure detecting element is installed
Part near skeleton diagram, be taken down from the A-A sectional view of Fig. 1 cover figure.
Fig. 3 is the longitudinal section of the pressure transducer of embodiments of the invention 2.
Symbol description
1 pressure transducer 10 covers
20 attaching nut 30 installing components
32 fluids import room 40 pedestal
50 barrier film 52 pressurized space
60,160 semi-conductor type pressure-detecting devices 62,162 are except electroplax
63,163 supporting substrates 64,164 pressure detecting element
70 terminal pins 74 seals
The 80 earthy bonding lines of bonding line 81
90 interposer 92 adapters
94 lead-in wires
Detailed description of the invention
＜ embodiment ＞
Fig. 1 is the longitudinal section of the pressure transducer of embodiments of the invention 1.It addition, Fig. 2 is to observe from pressurized space side
The skeleton diagram being provided with near the part of pressure detecting element of the pressure transducer of embodiments of the invention 1, is the A-from Fig. 1
A sectional view has taken down the figure of cover.
As it is shown in figure 1, pressure transducer 1 has the cover 10 of drum with the level, at the peristome in the big footpath of cover 10
Being inserted with pressure sensing cell 2 in 10a, this pressure sensing cell 2 is by being equipped with semi-conductor type pressure-detecting device 60 described later
Pedestal 40, supporting be connected with not shown fluid inflow pipe the installing component 30 of attaching nut 20, peripheral part is by pedestal 40
And the barrier film 50 etc. of installing component 30 clamping is constituted.
Aqueous Jie of the insulating properties such as machine oil it is filled with in the pressurized space 52 divided by the pedestal 40 of plate-like and barrier film 50
Matter.At the hole 99a (with reference to Fig. 2) through being formed from pedestal 40, after filling liquid medium in pressurized space 52, ball 99 is used for
This hole is sealed, and is fixed in pedestal 40 by means such as welding.
In the pressure transducer 1 of embodiment 1, the central part in pressurized space 52 side of pedestal 40 is via such as by glass
Except electroplax 62, semi-conductor type pressure-detecting device 60 is installed Deng what insulator was constituted.
Semi-conductor type pressure-detecting device 60 includes: by such as pottery etc. insulator constitute supporting substrates 63, be formed at
The pressure detecting element (semiconductor layer) 64 on its surface.Pressure detecting element 64 possesses 8 joint sheets (electrode) in this example embodiment,
3 therein is the power supply input pad of output signal, ground mat (zero potential) and signal output pad, and remaining 5 is signal
Adjustment pad.
Further, semi-conductor type pressure-detecting device 60 and except electroplax 62 and except electroplax 62 and pedestal 40 all by bonding, expansion
Dissipate the arbitrary joint method such as joint or room temperature joint to install.
Except electroplax 62 is by inorganic material or polyamide, polyimides, polyethylene terephthalates such as such as pottery, glass
Ester (PET), PPS etc. are rich in the insulator of thermostability and constitute, and have the structure being formed with conductive layer in the face of its one side.This
Time, conductive layer can be made up of the tabular of metal or be formed by printing, firing.
It addition, as the material of conductive layer, representational for gold, silver, copper, aluminum, nickel etc., but durable in order to obtain high voltage
Property, it is also possible to it is suitable for the materials with high melting point such as tungsten, molybdenum.
In pedestal 40, be provided with semi-conductor type pressure-detecting device 60 except electroplax 62 around, pass through hermetic seal
It is provided with many (such as 8) terminal pins 70,72 of this pedestal 40 through part 74 and insulated enclosure.
As in figure 2 it is shown, 1 in multiple terminal pins plays a role as ground terminal pin 72.Further, this ground terminal pin
72 and its beyond 7 terminal pins 70 be connected with interposer 90.
It is formed at power supply input pad and the signal output pad of semi-conductor type pressure-detecting device 60 (pressure detecting element 64)
Being connected with 2 in above-mentioned many terminal pins 70, ground mat is connected with ground terminal pin 72.Further, above-mentioned 3 terminal pins 70,
72 are linked to respectively via being located at the metal wiring pattern of interposer 90 and being installed on the adapter 92 of this interposer 90
Lead-in wire 94.
It addition, lead-in wire 94 is connected with the not shown circuit in the control dish being located at fridge-freezer, air-conditioning device etc.,
Described fridge-freezer, air-conditioning device etc. are provided with this pressure transducer 1.Thus, ground terminal pin 72 is via lead-in wire 94
It is connected with outside ground wire.
It addition, the many terminal pins 70,72 being connected with interposer 90 can be above-mentioned 3 with output signal output
The output terminal pins that pad connects, the signal that additionally can also in addition be also connected with and be formed at pressure detecting element 64 adjusts
With at least 1 in 5 terminal pins 70 of pad.
According to such structure, interposer 90 become across adapter 92 possess in the position of both sides with terminal pins 70,
The structure of the junction point of 72, even if therefore in the case of to lead-in wire 94 applying pulling force etc., also will not apply terminal pins 70,72
Horizontal stress, result is that the seal 74 being prevented from being fixed terminal pins 70,72 and pedestal 40 is damaged.
As in figure 2 it is shown, be located at removing in each joint sheet of the pressure detecting element 64 of semi-conductor type pressure-detecting device 60
7 joint sheets beyond ground mat are electrically connected (wiring) by 7 terminal pins 70 and bonding line 80.It addition, ground connection
Pad and ground terminal pin 72 electrically connect (wiring) by bonding line 81 with except electroplax 62 respectively.
Further, after above-mentioned pressure sensing cell 2 is configured in cover 10, from peristome 10a side and the path in the big footpath of cover 10
The peristome 10b side side of 94 (derive lead-in wire) (in FIG, omit the figure of hatching to the inside potting resin P of cover 10
Show) and solidify, thus fixation pressure detector unit 2 in cover 10.
The fluid being imported into attaching nut 20 enters in fluid importing room 32, barrier film 50 bear this pressure, empty to pressurized
Between medium pressurization in 52.
This pressure oscillation is detected and is converted to the signal of telecommunication by pressure detecting element 64, via bonding line 80, terminal pins
70,72 and by the signal of telecommunication to outside export.
In the pressure transducer 1 of the present invention, on the installed surface except the semi-conductor type pressure-detecting device 60 of electroplax 62
It is formed with conductive layer 62a.Further, conductive layer 62a passes through with ground mat and the ground terminal pin 72 of above-mentioned pressure detecting element 64
Bonding line 81 and electrically connect (wiring).
Now, conductive layer 62a can be formed at the installed surface of the above-mentioned semi-conductor type pressure-detecting device 60 except electroplax 62
Whole on but it also may be formed at above-mentioned semi-conductor type pressure-detecting device 60 the part in addition to mounting portion or
Only it is formed at the part beyond above-mentioned mounting portion.
As it has been described above, ground terminal pin 72 via lead-in wire 94 and with the control being located at fridge-freezer, air-conditioning device etc.
The zero potential (outside ground wire) of the circuit in dish connects, and described fridge-freezer, air-conditioning device etc. are provided with the pressure of the present invention
Force transducer 1.
According to such structure, it is possible to the internally charged electric charge at pressure sensing cell 2 is efficient discharged into outside,
Therefore, it is possible to suppression or is filled in the liquid medium in pressurized space 52 electricity around semi-conductor type pressure-detecting device 60
Lotus is charged, and result is to prevent the charged work caused of semi-conductor type pressure-detecting device 60 bad.
According to the pressure transducer of embodiments of the invention 1, have employed and make except electroplax 62 gets involved pedestal 40 and semi-conductor type
The structure installed is carried out, therefore when its installation exercise, it is not necessary to carry out pedestal 40 and partly lead between pressure-detecting device 60
Location between build pressure-detecting device 60, only considers pedestal 40 and except the location of electroplax 62.
Therefore, it is possible to installation exercise when simplifying stacking pressure detector unit, thus without reducing packaging efficiency, result is
Can suppress to relate to the decline of the Product Precision of location.
It addition, in the pressure transducer of embodiment 1, it is also possible to be formed as semi-conductor type beforehand through other assembly lines
Pressure-detecting device 60 is installed on except the structure of electroplax 62, will carry out pressure inspection except electroplax 62 is installed on pedestal 40 by former state
Survey the assembling of unit.
According to such structure, it is possible to omit the semi-conductor type pressure-detecting device 60 in the assembly line of pressure sensing cell
With except the positioning operation of electroplax 62, improve packaging efficiency and Product Precision therefore, it is possible to further.
＜ embodiment 2 ＞
Fig. 3 is the longitudinal section of the pressure transducer of embodiments of the invention 2.
Additionally, main the constituting partly and the embodiment 1 shown in Fig. 1 of the pressure transducer 1 of embodiments of the invention 2
Pressure transducer 1 is common, in figure 3, only the most attached to the major part comprising the part different from the situation of embodiment 1
With symbol and illustrate.
In the pressure transducer 1 of embodiment 2, identical with the situation of embodiment 1, in pressurized space 52 side of pedestal 40
Central part be provided be made up of insulator except electroplax 162.
Further, it is adjacent to be formed directly with conductive layer 162a and pressure detecting element (half above-mentioned except the surface of electroplax 162
Conductor layer) 164.That is, in the pressure transducer 1 of embodiment 2, by make embodiment 1 except electroplax 162 and supporting substrates 163
Common, thus constitute and there is the semi-conductor type pressure-detecting device 160 except Electricity Functional simultaneously.
Now, conductive layer 162a and the method for pressure detecting element 164 are formed as on the surface except electroplax 162, it is possible to
It is suitable for the known maneuvers such as such as photoetching.
In the pressure transducer 1 of embodiment 2, pressure detecting element 164 the most also possesses 8 joint sheets (electricity
Pole), 3 therein is power supply input pad, signal output pad and the ground mat of output signal, and remaining 5 is that signal adjusts
With pad.
Further, identical with the situation of embodiment 1, except electroplax 162 can be connect by bonding, diffusion joint or room temperature with pedestal 40
The arbitrary joint method such as conjunction is installed.
Pressure transducer 1 according to embodiments of the invention 2, have employed and directly form pressure on the surface except electroplax 162
The structure of detecting element 164 is therefore identical with the situation of above-described embodiment 1, at pedestal 40 and except the installation exercise of electroplax 162
Time, it is not necessary to carry out the location between pedestal 40 and pressure detecting element 164, only consider pedestal 40 and except the location of electroplax 162
?.
Therefore, it is possible to installation exercise when simplifying stacking pressure detector unit 2, therefore packaging efficiency will not decline, result
It is the decline that can suppress to relate to the Product Precision of location.
It addition, as it has been described above, in the pressure transducer 1 of embodiment 2, it is possible to by series of processes (such as photoetching skill
Art etc.) it is implemented in except forming conductive layer 162a and the operation of pressure detecting element 164 on electroplax 162, therefore, it is possible to further
Simplify the overall manufacturing process of pressure sensing cell 2.
It addition, the supporting substrates of pressure detecting element 164 can be omitted, therefore it also is able to pressure sensing cell 2 overall
Carry out lightweight.
It addition, the present invention is not limited to the various embodiments described above, it is possible to implement various change.
Such as, in above-described embodiment 1 and 2, exemplified with except electroplax 62,162 with barrier film 50 face (surface) in opposite directions
The situation of upper formation conductive layer but it also may be configured to make this conductive layer be formed at except the side of electroplax 62,162.
It addition, in fig. 2, exemplified with being the situation of tetragon except electroplax 62, at the model of the function do not damaged except electroplax 62
It also is able in enclosing use the shapes such as circle, other polygons (such as pentagon, hexagon or octagon).
Claims (3)
1. a pressure transducer, possesses:
Barrier film, described barrier film bears the pressure of fluid；
Pedestal, forms the pressurized space being sealed with the insulating properties media such as machine oil between described pedestal and described barrier film；
Pressure detecting element, described pressure detecting element is located in described pressurized space, and possesses and comprise ground mat
Multiple joint sheets；And
Multiple terminal pins and 1 ground terminal pin, the plurality of terminal pins and the described through described pedestal of 1 ground terminal pin,
And electrically connect with described pressure detecting element,
Described pressure transducer is characterised by,
It is configured with between described pedestal and described pressure detecting element except electroplax,
The described conductive layer that is formed on the surface of described pressure detecting element side except electroplax, and described conductive layer and described ground connection
Pad and described ground terminal pin are electrically connected.
Pressure transducer the most according to claim 1, it is characterised in that
Described pressure detecting element is formed on supporting substrates,
Described supporting substrates engages except electroplax with described.
Pressure transducer the most according to claim 1, it is characterised in that
Described pressure detecting element is formed directly into described except on electroplax.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015084530A JP2016205871A (en) | 2015-04-16 | 2015-04-16 | Pressure sensor |
| JP2015-084530 | 2015-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106052938A true CN106052938A (en) | 2016-10-26 |
Family
ID=57484195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610188426.3A Pending CN106052938A (en) | 2015-04-16 | 2016-03-29 | Pressure sensor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016205871A (en) |
| CN (1) | CN106052938A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110672260A (en) * | 2018-07-03 | 2020-01-10 | 株式会社不二工机 | Pressure detection unit and pressure sensor using the same |
| CN111936835A (en) * | 2018-03-30 | 2020-11-13 | 株式会社不二工机 | Pressure sensor |
| CN114424038A (en) * | 2019-09-30 | 2022-04-29 | 株式会社不二工机 | Pressure detection unit and pressure sensor using same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7345174B2 (en) * | 2019-10-17 | 2023-09-15 | 株式会社不二工機 | pressure sensor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05113380A (en) * | 1991-10-21 | 1993-05-07 | Mitsubishi Electric Corp | Sensor device |
| CN104048792A (en) * | 2013-03-13 | 2014-09-17 | 株式会社不二工机 | Pressure sensor |
| JP2014178125A (en) * | 2013-03-13 | 2014-09-25 | Fuji Koki Corp | Pressure sensor |
| CN104272073A (en) * | 2013-07-17 | 2015-01-07 | 株式会社和广 | Force sensor |
| CN104425485A (en) * | 2013-08-26 | 2015-03-18 | 武汉飞恩微电子有限公司 | Silicon piezoresistive type pressure sensor chip |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3987386B2 (en) * | 2001-11-20 | 2007-10-10 | 株式会社鷺宮製作所 | Pressure sensor |
| CN1726385B (en) * | 2002-12-12 | 2010-04-21 | 丹福斯有限公司 | A pressure sensor |
| JP4548066B2 (en) * | 2004-09-24 | 2010-09-22 | 株式会社デンソー | Pressure sensor |
| JP5515675B2 (en) * | 2009-11-20 | 2014-06-11 | 日立金属株式会社 | Piezoelectric thin film element and piezoelectric thin film device |
| KR102009043B1 (en) * | 2011-09-02 | 2019-08-08 | 가부시기가이샤 후지고오키 | Pressure sensor |
| JP6111151B2 (en) * | 2013-06-21 | 2017-04-05 | 株式会社不二工機 | Pressure sensor |
-
2015
- 2015-04-16 JP JP2015084530A patent/JP2016205871A/en active Pending
-
2016
- 2016-03-29 CN CN201610188426.3A patent/CN106052938A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05113380A (en) * | 1991-10-21 | 1993-05-07 | Mitsubishi Electric Corp | Sensor device |
| CN104048792A (en) * | 2013-03-13 | 2014-09-17 | 株式会社不二工机 | Pressure sensor |
| JP2014178125A (en) * | 2013-03-13 | 2014-09-25 | Fuji Koki Corp | Pressure sensor |
| CN104272073A (en) * | 2013-07-17 | 2015-01-07 | 株式会社和广 | Force sensor |
| CN104425485A (en) * | 2013-08-26 | 2015-03-18 | 武汉飞恩微电子有限公司 | Silicon piezoresistive type pressure sensor chip |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111936835A (en) * | 2018-03-30 | 2020-11-13 | 株式会社不二工机 | Pressure sensor |
| CN111936835B (en) * | 2018-03-30 | 2023-06-06 | 株式会社不二工机 | Pressure sensor |
| CN110672260A (en) * | 2018-07-03 | 2020-01-10 | 株式会社不二工机 | Pressure detection unit and pressure sensor using the same |
| CN114424038A (en) * | 2019-09-30 | 2022-04-29 | 株式会社不二工机 | Pressure detection unit and pressure sensor using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016205871A (en) | 2016-12-08 |
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Application publication date: 20161026 |