JPH05113380A - Sensor device - Google Patents

Abstract

PURPOSE:To prevent the malfunction of a sensor device due to applied charge by rapidly discharging the applied charge at a charging position to the outside of the sensor device. CONSTITUTION:A pedestal 6 is provided in a package 1 by die bonding through a die pad 4 and a semiconductor pressure sensor chip 7 is mounted on the pedestal 6. The inner wall of the package and the die pad 4 are connected to a ground lead terminal 11 by a conductive member 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor device such as a semiconductor diffusion resistance type pressure sensor device, and more particularly to preventing a sensor chip mounted therein from malfunctioning due to charging.

[0002]

2. Description of the Related Art FIG. 3 is a schematic sectional view of a conventional semiconductor diffusion resistance type pressure sensor device, in which a die pad 4 is provided on a bottom surface 2 of a plastic package 1 with a die bonding material 3 interposed therebetween. A pedestal 6 made of Pyrex glass is further fixed on the die pad 4 via a die bonding material 5. By mounting the pedestal 6 on the die pad 4 in this manner, the mounting position is stabilized. On the pedestal 6, a semiconductor pressure sensor chip (one example of which is a pressure-sensitive diaphragm structure in which a resistance is diffused on a silicon single crystal substrate by a semiconductor manufacturing technique to form a strain gauge) 7 is mounted. A vacuum chamber 8 is formed between the lower surface of the semiconductor pressure sensor chip 7 and the pedestal 6 to apply a measurement pressure to the lower surface. The semiconductor pressure sensor chip 7 is distorted according to the pressure difference between the external pressure and the pressure in the vacuum chamber 8, and outputs a pressure sensor signal corresponding to the strain. For derivation of the pressure sensor signal via the thin metal wire 9. One end of each of the lead terminal 10 and the ground lead terminal 11, which is one of them, is connected.
The other end of each lead terminal 10 and 11 is the package 1
The package 12 is filled with a gel 12 made of silicon or the like, which is guided to the outside from the outside and protects the inside and does not hinder the distortion of the semiconductor pressure sensor chip 7.

Since the pressure detection by the pressure sensor device having the above structure is well known, its details are omitted.

[0004]

The package 1 and the pedestal 6 of the above-mentioned device are made of an insulating material such as plastic or Pyrex glass and are places that are extremely easily charged. However, the semiconductor pressure sensor chip 7 is made of a semiconductor. Therefore, it is well known that such an electric charge easily causes a malfunction such as a so-called latch-up phenomenon, which is a phenomenon unique to the semiconductor, due to the electric charge.

Of course, even if the sensor is not a semiconductor,
Even a sensor made of a material that is mechanically distorted under pressure and electrically outputs the distortion is likely to malfunction due to the charging phenomenon.

Therefore, an object of the present invention is to prevent the device from malfunctioning due to the charged electric charge by promptly discharging the charged electric charge at the above-mentioned charged portion to the outside of the device.

[0007]

In order to achieve such an object, in the sensor device of the present invention, in claim 1, the charged part in the package is connected to the ground part of the sensor chip by a conductive member. It is characterized by The sensor chip may be a semiconductor pressure sensor chip as in claim 2, and the ground portion has one end connected to the sensor chip as in claim 3, and the other end penetrating the package to the outside. It may be a lead terminal for ground of the sensor chip that has been pulled out.

[0008]

Since the charged portion in the package is connected to the ground portion of the sensor chip by the conductive member, even if the charged portion is charged, the charged charge is promptly grounded through the conductive member. Since the sensor chip is discharged, the sensor chip does not malfunction due to the charged electric charge.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a sectional view of a semiconductor pressure sensor device according to an embodiment of the present invention. Parts corresponding to those of FIG. The detailed description of is omitted.

In this embodiment, a conductive member 13 is provided in the package 1, one end of the conductive member 13 is fixed to the die pad 4 for electrical connection, and the other end is fixed to the ground lead terminal 11. In addition to being electrically connected, the structure is such that the middle portion is electrically connected along the inner wall of the package 1. By providing the conductive member 13 as described above, when the pedestal 6 is charged, the charged charge is guided to the ground lead terminal 11 via the die-hond material 5, the die pad 4, and the conductive member 13, and then the outside of the package 1. To be discharged. Further, even if the package 1 is charged, the charged charge is similarly guided to the ground lead terminal 11 via the conductive member 13 and then discharged to the outside of the package 1. Therefore, the semiconductor pressure sensor chip 7 mounted on the pedestal 6 is prevented from malfunctioning due to the latch-up phenomenon caused by the charge. In addition, as for the conductive member 13, it is sufficient that one end side or the middle part is connected to the charging location and the other end side is connected to the ground lead terminal 11.
Therefore, as shown in FIG. 1, one end and the middle part are connected to the die pad 4 and the inner wall of the package 1, respectively, or the state where both the one end and the middle part are not along the inner wall of the package 1 as shown in FIG. You may make it provide it.

Such a conductive member 13 has a conductive property such as a conductive resin or a metal such as solder in terms of material, and the connection to a charged portion is well known by vapor deposition or plating. In addition to the above method, the film may be formed into a film shape or a linear shape.

[0013]

As described above, according to the present invention, since the electrically charged portion in the package is connected to the ground portion of the sensor chip by the conductive member, even if the electrically charged portion is charged, the electrified portion is quickly charged. Since the sensor chip is grounded and discharged via the conductive member, the sensor chip does not malfunction due to the charging.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor resistance diffusion type pressure sensor device according to an embodiment of the present invention.

FIG. 2 is a sectional view of a semiconductor resistance diffusion type pressure sensor device according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a semiconductor resistance diffusion type pressure sensor device according to a conventional example.

[Explanation of symbols]

 1 Package 2 Package Bottom Surface 3 Die Bonding Material 4 Die Pad 5 Die Bonding Material 6 Pedestal 7 Semiconductor Pressure Sensor Chip 11 Ground Lead Terminal 13 Conductive Member

[Procedure amendment]

[Submission date] February 19, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] Explanation of code

[Correction method] Change

[Correction content]

[Explanation of Codes] 1 Package 2 Package Bottom 3 Die Bonding Material 4 Die Pad 5 Die Bonding Material 6 Pedestal 7 Semiconductor Pressure Sensor Chip 8 Vacuum Chamber 9 Metal Wire 10, 11 Lead Terminal 12 Gel 13 Conductive Member

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

Claims (3)

[Claims] 1. A sensor device in which a pedestal is die-bonded in a package through a die pad, and a sensor chip is mounted on the pedestal, and a charged portion in the package is a conductive member at a ground portion of the sensor chip. A sensor device characterized by being connected by. 2. The sensor device according to claim 1, wherein the sensor chip is a semiconductor pressure sensor chip. 3. The ground lead terminal of the sensor chip, wherein one end of the ground portion is connected to the sensor chip and the other end penetrates the package and is pulled out to the outside. 2. The sensor device according to item 2.