KR100414224B1 - Stacked package structure of image sensor - Google Patents

Abstract

An image sensor of a stacked package structure for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate such that a cavity is formed between the first substrate and the second substrate. An integrated circuit is located in the cavity and is electrically connected to the first substrate. The image sensing chip is installed on the second substrate. The transparent layer covers the image sensing chip, which receives the image signal through the transparent layer and converts the image signal into an electrical signal transmitted to the first substrate. Therefore, the image sensing chip and the integrated circuit of the image sensing product can be integrated packaged.

Description

Stacked package structure of image sensor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor of a stacked package structure, and more particularly to reducing the number of package substrates and integrating integrated circuits and image sensing chips each having different functions. It relates to a structure in which an integrated circuit and an image sensing chip are packaged in one package body.

Typical sensors are used to detect signals, which may be visual or audio signals. The sensor of the present invention is used to take an image signal and convert the image signal into an electrical signal that is sent to a printed circuit board.

A general image sensor is used to take an image signal and convert the image signal into an electrical signal transmitted to a printed circuit board. The image sensor is then electrically connected to other integrated circuits to retain any desired functionality. For example, the image sensor may be electrically connected to an electronic signal processor that processes a signal generated from the image sensor. In addition, the image sensor may be electrically connected to a microcontroller, a central processing unit, or the like to retain any desired functionality.

However, since a conventional image sensor is packaged, an integrated circuit corresponding to the image sensor must be packaged separately with the image sensor. The packaged image sensor and the various signal processing units are then electrically connected to the printed circuit board.

The image sensor is then electrically connected to the signal processing unit by a plurality of wires. Thus, in order to individually package each signal processing unit and image sensor, multiple substrates and package bodies must be used, resulting in increased manufacturing costs. In addition, when each signal processing unit is installed on a printed circuit board, a larger area printed circuit board is required, and thus the product cannot be made smaller, thinner and lighter.

In order to solve the above-mentioned problems, the present invention provides an image sensor having a stack structure that overcomes the disadvantages caused by the conventional image sensor.

It is a first object of the present invention to provide an image sensor of a stack package structure for reducing the number of packaged elements and reducing the package cost.

It is a second object of the present invention to provide an image sensor of a stack package structure to simplify and facilitate the manufacturing process.

A third object of the present invention is to provide an image sensor having a stack package structure for reducing the area of the image sensor.

A fourth object of the present invention is to provide an image sensor having a stack package structure for reducing package cost and inspection cost of an image sensing product.

According to an aspect of the present invention, an image sensor of a stack package structure for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The first substrate has a first surface and a second surface opposite to the first surface. The first surface of the first substrate is formed to have a signal input terminal. The second surface of the first substrate is formed to have a signal output terminal for electrically connecting to the printed circuit board. The second substrate has a top surface and a bottom surface opposite to the top surface. The bottom surface of the second substrate is fixed to the first surface of the first substrate so that a cavity is formed on the first substrate. An integrated circuit is installed on the first surface of the first substrate and positioned in the cavity, and is electrically connected to the signal input terminal on the first surface of the first substrate. The image sensing chip is installed on the upper surface of the second substrate. The transparent layer covers the image sensing chip, which receives the image signal through the transparent layer and converts the image signal into an electrical signal transmitted to the first substrate.

Therefore, the image sensing chip and the integrated circuit of the image sensing product can be integrated packaged.

1 is a schematic diagram of an image sensor of a stack package structure according to a first embodiment of the present invention.

2 is a schematic diagram of an image sensor of a stack package structure according to a second embodiment of the present invention.

3 is a schematic diagram of an image sensor of a stack package structure according to a third embodiment of the present invention.

4 is a schematic diagram of an image sensor of a stack package structure according to a fourth embodiment of the present invention.

Embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the image sensor of the stack package structure of the present invention includes a first substrate 10, a second substrate 22, an integrated circuit 30, an image sensing chip 34, and a projecting structure. , 38), and transparent layer 40.

The first substrate 10 has a first surface 12 and a second surface 14 opposite the first surface 12. The first surface 12 of the first substrate 10 is formed to have a signal input terminal 16. The second surface 14 of the first substrate 10 is formed with a signal output terminal 18 for transmitting a signal from the first substrate 10 to the printed circuit board 20, the signal output terminal ( 18 may be a metal ball arranged in the form of a ball grid array.

The second substrate 22 has an upper surface 24 and a lower surface 26 opposite the upper surface 24. The bottom surface 26 of the second substrate 22 is fixed to the first surface 12 of the first substrate 10 such that a cavity 28 is formed on the first substrate 10.

The integrated circuit 30 may be a signal processing unit such as an electronic signal processor, a microprocessor, a central processing unit (CPU), or the like. The integrated circuit 30 is installed on the first surface 12 of the first substrate 10 and positioned in the cavity 28. The integrated circuit 30 is connected to the signal input terminal 16 formed on the first surface 12 of the first substrate 10 by wire bonds through a plurality of wirings 32. As such, the integrated circuit 30 is electrically connected to the first substrate 10. If the integrated circuit 30 is an electronic signal processor, the signal from the image sensing chip 34 may be processed in advance and then transmitted to the printed circuit board 20.

The image sensing chip 34 is installed on the top surface 24 of the second substrate 22 and is electrically connected to the signal input terminal 16 formed on the first surface 12 of the first substrate 10. Therefore, the signal from the image sensing chip 34 may be transmitted to the first substrate 10.

The protruding structure 38 is a frame installed on the first surface 12 of the first substrate 10 to surround the integrated circuit 30 and the image sensing chip 34.

The transparent layer 40 may be a transparent glass covering the protruding structure 38 to seal the integrated circuit 30 and the image sensing chip 34. The image sensing chip 34 may receive an image signal through the transparent layer 40, and then convert the image signal into an electrical signal transmitted to the first substrate 10.

2 is a schematic diagram illustrating an image sensor of a stack package structure according to a second embodiment of the present invention. The upper surface 24 of the second substrate 22 is formed to have a signal input terminal 42. The bottom surface 26 of the second substrate 22 is mounted on the first surface 12 of the first substrate 10. Thus, a cavity 28 is formed on the first substrate 10. Integrated circuit 30 is installed on first surface 12 and is located within cavity 28. The integrated circuit 30 is then electrically connected to the signal input terminal 42 formed on the first surface 12 of the first substrate 10 by wire bonding through a plurality of wires 32.

The image sensing chip 34 is installed on the top surface 24 of the second substrate 22 and electrically connected to the signal input terminal 42 formed on the top surface 24 of the second substrate 22.

The protruding structure 38 is installed on the first surface 12 of the first substrate 10 to surround the integrated circuit 30 and the image sensing chip 34.

The transparent layer 40 may be transparent glass installed on the protruding structure 38 to seal the integrated circuit 30 and the image sensing chip 34. The image sensing chip 34 may receive an image signal through the transparent layer 40, and then convert the image signal into an electrical signal transmitted to the first substrate 10.

Referring to FIG. 3, the transparent layer 40 may be a transparent adhesive covered on the top surface 24 of the second substrate 22, so that the integrated circuit 30 and the image sensing chip 34 may be formed by the transparent layer 40. It is sealed. Subsequently, the image sensing chip 34 may receive an image signal through the transparent layer 40, and then convert the image signal into an electrical signal transmitted to the first substrate 10.

Referring to FIG. 4, the transparent layer 40 includes a support column 46 for mounting on the top surface 24 of the second substrate 22. "Type" transparent adhesive. " The " -type " transparent layer 40 can be formed by injection or press molding. As such, the image sensing chip 34 and the integrated circuit 30 are covered with a transparent layer 40, so that the image signal is transparent. May be accepted by the image sensing chip 34.

" The transparent layer 40 is made thick so that the image sensor of the stack package structure can provide better transmittance.

Although the invention has been described by way of examples and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, the intention is to cover various modifications. Accordingly, the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.

According to the above structure, the following advantages can be obtained.

1. Since the image sensing chip 34 and the integrated circuit 30 can be integrated packaged, the material forming the substrate 10 can be saved, thus reducing the manufacturing cost of the image sensing product.

2. Since the image sensing chip 34 and the integrated circuit 30 can be integrated packaged, the area of the image sensing product can be reduced.

3. Since the image sensing chip 34 and the integrated circuit 30 can be integrated packaged, there is only one package body. Therefore, since only one specimen is needed, the inspection cost can also be reduced.

4. Since the image sensing chip 34 and the integrated circuit 30 can be integrated packaged, two chips can be packaged by a single packaging process. Thus, the package cost can be significantly reduced.

Claims (5)

A first substrate having a first surface formed to have a signal input terminal and a second surface opposite the first surface formed to have a signal output terminal for electrically connecting to a printed circuit board; A second substrate having an upper surface and a lower surface opposite the upper surface, comprising: a second substrate fixed to the first surface of the first substrate to form a cavity on the first substrate; An integrated circuit disposed on the first surface of the first substrate and located in the cavity and electrically connected to a signal input terminal on the first surface of the first substrate; An image sensing chip disposed on an upper surface of the second substrate and electrically connected to the first substrate; And A transparent layer overlying the image sensing chip such that the image sensing chip receives the image signal through the transparent layer and then converts the image signal into an electrical signal to be transmitted to the first substrate. An image sensor of a stacked package structure for electrically connecting to a printed circuit board comprising a. The image sensor of claim 1, wherein the integrated circuit is a signal processing unit. The image sensor of claim 1, wherein the transparent layer is transparent glass. The image sensor of claim 1, wherein the protrusion structure is disposed around the top surface of the second substrate, and the transparent layer is positioned on the protrusion structure. The image sensor of claim 1, wherein the transparent layer is a transparent adhesive.