JP5630630B2

JP5630630B2 - Coreless current sensor

Info

Publication number: JP5630630B2
Application number: JP2009251311A
Authority: JP
Inventors: 準二宮本; 季之原田
Original assignee: Kohshin Electric Corp
Current assignee: Kohshin Electric Corp
Priority date: 2009-10-09
Filing date: 2009-10-09
Publication date: 2014-11-26
Anticipated expiration: 2029-10-09
Also published as: JP2011080973A

Description

この発明は電流センサに関し、特に磁性体コアを持たないコアレス電流センサに関する。 The present invention relates to a current sensor, and more particularly to a coreless current sensor having no magnetic core.

従来のコアレス電流センサとして、基板の部品実装面に感磁素子を実装し、基板裏面に一次導体を密着させて取り付けたものがある。（例えば、特許文献１参照） As a conventional coreless current sensor, there is one in which a magnetosensitive element is mounted on a component mounting surface of a substrate and a primary conductor is attached in close contact with the back surface of the substrate. (For example, see Patent Document 1)

公開実用新案平３−８７７０公報Published Utility Model 3-8770

上記特許文献１に開示されているコアレス電流センサは、基板の部品実装面に感磁素子が実装され、その裏面上に一次導体が基板に密着して配置されており、一次導体に流れる電流により発生した磁界を基板部品実装面に実装された感磁素子で検出し、電圧等の信号に変換することで一次電流の大きさを測定するよう構成されている。 In the coreless current sensor disclosed in Patent Document 1, a magnetosensitive element is mounted on a component mounting surface of a substrate, and a primary conductor is disposed in close contact with the substrate on the back surface of the coreless current sensor. The generated magnetic field is detected by a magnetosensitive element mounted on the board component mounting surface, and converted into a signal such as a voltage to measure the magnitude of the primary current.

このようなコアレス電流センサは、一次導体からの磁界を感磁素子で直接測定するため、一次導体と感磁素子の相対位置の変化に敏感であり、一次導体と感磁素子を確実に固定する必要がある。このため、一次導体は基板に密着させた状態で接着固定されている。 Since such a coreless current sensor directly measures the magnetic field from the primary conductor with the magnetosensitive element, it is sensitive to changes in the relative positions of the primary conductor and the magnetosensitive element, and securely fixes the primary conductor and the magnetosensitive element. There is a need. For this reason, the primary conductor is bonded and fixed in a state of being in close contact with the substrate.

しかしながら、一次導体を基板に接着する方法は、接着時の位置決めが難しく、接着剤の硬化に時間が必要なため作業性が悪いという問題点がある。 However, the method of adhering the primary conductor to the substrate has a problem that positioning at the time of adhesion is difficult and workability is poor because it takes time to cure the adhesive.

また、一次導体と基板が密着しているため、一次導体の発熱により感磁素子やその他電子部品が加熱され、特性や信頼性に悪影響を及ぼすという問題がある。 In addition, since the primary conductor and the substrate are in close contact with each other, there is a problem that the magnetosensitive element and other electronic components are heated by the heat generated by the primary conductor, which adversely affects characteristics and reliability.

また、電流センサの感度を変えるためには一次導体と感磁素子の距離を変える必要があるが、一次導体を基板に接着する方法では基板の厚さを変えるしかないため、測定する電流レンジによって感磁素子に印加される磁界の強さを最適化するのが難しいという問題がある。 In order to change the sensitivity of the current sensor, it is necessary to change the distance between the primary conductor and the magneto-sensitive element. However, the method of adhering the primary conductor to the board only changes the thickness of the board. There is a problem that it is difficult to optimize the strength of the magnetic field applied to the magnetosensitive element.

本発明の目的の一つは、一次導体と基板の固定を高精度かつ容易に行うことのできるコアレス電流センサを提供することにある。 One of the objects of the present invention is to provide a coreless current sensor capable of easily and easily fixing a primary conductor and a substrate.

また、本発明の目的の一つは、一次導体の発熱による電子部品への影響を抑えたコアレス電流センサを提供することにある。 Another object of the present invention is to provide a coreless current sensor in which the influence on electronic components due to heat generated by the primary conductor is suppressed.

また、本発明の目的の一つは、測定する電流により、感磁素子へ印加する磁界の強さを最適化するのが容易なコアレス電流センサを提供することにある。 Another object of the present invention is to provide a coreless current sensor that can easily optimize the strength of the magnetic field applied to the magnetosensitive element by the current to be measured.

本発明は、基板の部品実装面に感磁素子、その裏面に一次導体が配置され、前記一次導体に流れる電流により発生した磁界を前記感磁素子で検出し、電圧等の信号に変換することで一次電流の大きさを測定するよう構成されたコアレス電流センサにおいて、前記一次導体側面の一部を略９０°に折り曲げて形成された半田付け用の端子を前記基板に設けたスルーホールに挿入し、前記一次導体と前記基板の間に所定の間隙を空けた状態で半田付け固定したことを特徴とする。In the present invention, a magnetosensitive element is disposed on a component mounting surface of a board, and a primary conductor is disposed on the back surface thereof, and a magnetic field generated by a current flowing through the primary conductor is detected by the magnetosensitive element and converted into a signal such as a voltage. In the coreless current sensor configured to measure the magnitude of the primary current at 1), a soldering terminal formed by bending a part of the side surface of the primary conductor at approximately 90 ° is inserted into a through hole provided in the substrate. The solder is fixed with a predetermined gap between the primary conductor and the substrate.

また、前記一次導体を前記基板に半田付け固定する際、前記基板と接触させて一次導体と基板の間に所定の間隙を確保するための突起部を前記端子の根本部にに設けたものである。 Further, when the primary conductor is soldered and fixed to the substrate, a protrusion is provided at the base portion of the terminal to contact the substrate and secure a predetermined gap between the primary conductor and the substrate. is there.

本発明のコアレス電流センサによれば、一次導体と基板の固定を基板に対する一次導体のＸ軸方向およびＹ軸方向、またＺ軸方向の全ての方向に対して高精度かつ容易に行うことができる。また、本発明のコアレス電流センサによれば、一次導体の発熱による電子部品への影響を抑えることができる。また、本発明のコアレス電流センサによれば、測定する電流の大きさに応じて、感磁素子へ印加する磁界の強さを容易に最適化できる。According to the coreless current sensor of the present invention, the primary conductor and the substrate can be fixed with high precision and easily in all directions of the primary conductor with respect to the substrate in the X-axis direction, the Y-axis direction, and the Z-axis direction. . Further, according to the coreless current sensor of the present invention, it is possible to suppress the influence on the electronic component due to the heat generation of the primary conductor. Moreover, according to the coreless current sensor of the present invention, the strength of the magnetic field applied to the magnetosensitive element can be easily optimized according to the magnitude of the current to be measured.

本実施形態におけるコアレス電流センサの平面図である。It is a top view of the coreless current sensor in this embodiment. 本実施形態におけるコアレス電流センサの側面図である。It is a side view of the coreless current sensor in this embodiment. 本実施形態におけるコアレス電流センサの一次導体を示す斜視図である。It is a perspective view which shows the primary conductor of the coreless current sensor in this embodiment.

以下、本発明に係るコアレス電流センサの実施形態について、図を用いて説明する。まず、図１および図２において、基板１の部品実装面には感磁素子２および増幅回路等を構成するための周辺回路部品３が実装されている。一次導体４（図１では一部破線で示す）は、基板１の裏面と所定の間隔７を空けた状態で、一次導体４の３カ所に略９０°に折り曲げて設けた端子５を基板１のスルーホール６に挿入して半田付け固定されている。この構成により、一次導体４と基板１の固定を高精度かつ容易に短時間で行うことができ、更に基板１と一次導体４の間に間隔７を設けることにより、基板１と一次導体４間の熱電導抵抗が上がるため、一次導体４の発熱が感磁素子２やその他電子部品３へ伝わりにくくなり、一次導体の発熱による影響を抑えることができる。Hereinafter, embodiments of a coreless current sensor according to the present invention will be described with reference to the drawings. First, in FIG. 1 and FIG. 2, the peripheral circuit component 3 for constituting the magnetosensitive element 2 and the amplifier circuit is mounted on the component mounting surface of the substrate 1. The primary conductor 4 (partially indicated by broken lines in FIG. 1) is provided with terminals 5 that are bent at approximately 90 ° at three locations on the primary conductor 4 with a predetermined distance 7 from the back surface of the substrate 1. Are inserted into the through holes 6 and fixed by soldering. With this configuration, the primary conductor 4 and the substrate 1 can be fixed with high accuracy and easily in a short time. Further, by providing a distance 7 between the substrate 1 and the primary conductor 4, the space between the substrate 1 and the primary conductor 4 can be achieved. Therefore, the heat generated by the primary conductor 4 is less likely to be transmitted to the magnetosensitive element 2 and other electronic components 3, and the influence of the heat generated by the primary conductor can be suppressed.

また、図３において端子５の根本部には突起部８が設けられており、一次導体４の端子５を基板１のスルーホール６に挿入する際、突起部８と基板１が接触するまで挿入した後半田付けを行うことで、所定の間隔７が正確かつ容易に確保できるよう構成されている。さらに、一次導体４に流す電流の大きさに応じて突起部８の突起寸法を変えることにより、前記一次導体４と基板１との間隔７の寸法、すなわち一次導体４と前記感磁素子２の距離が変わり、感磁素子２に印加される磁界の強さを最適化することができる。
なお、本実施例では一次導体４に端子５を３カ所設けているが、一次導体４が基板１に安定して固定できれば、端子５の数は２個以下または４個以上であっても良い。Further, in FIG. 3, a protrusion 8 is provided at the base of the terminal 5 , and when the terminal 5 of the primary conductor 4 is inserted into the through hole 6 of the substrate 1, it is inserted until the protrusion 8 and the substrate 1 come into contact with each other. Then, by soldering, the predetermined interval 7 can be accurately and easily secured. Further, by changing the projection size of the projection 8 according to the magnitude of the current flowing through the primary conductor 4, the size of the distance 7 between the primary conductor 4 and the substrate 1, that is, the primary conductor 4 and the magnetosensitive element 2. The distance changes, and the strength of the magnetic field applied to the magnetosensitive element 2 can be optimized.
In the present embodiment, three terminals 5 are provided on the primary conductor 4, but the number of terminals 5 may be two or less or four or more as long as the primary conductor 4 can be stably fixed to the substrate 1. .

１基板、２感磁素子、３周辺回路部品、４一次導体、５端子、６スルーホール、７間隙、８突起部1 Substrate, 2 Magnetic sensing element, 3 Peripheral circuit component, 4 Primary conductor, 5 Terminal, 6 Through hole, 7 Gap, 8 Protrusion

Claims

A magnetic sensitive element is disposed on the component mounting surface of the board, and a primary conductor is disposed on the back surface thereof. A magnetic field generated by a current flowing through the primary conductor is detected by the magnetic sensitive element and converted into a signal such as a voltage, thereby generating a primary current. In a coreless current sensor configured to measure a size , at least one or more soldering and fixing terminals formed by bending a part of a primary conductor at approximately 90 ° are provided, and the terminals are provided on the substrate. A coreless current sensor, which is configured to be inserted into a provided through hole and fixed by soldering with a predetermined gap between a primary conductor and a substrate.

2. The coreless current sensor according to claim 1, wherein when the primary conductor is fixed to the substrate by providing at least one protrusion at the base portion of the terminal , the first conductor and the substrate are brought into contact with the substrate. A coreless current sensor characterized in that a predetermined interval can be obtained between the two .