JP2008151792A5 - - Google Patents

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Publication number
JP2008151792A5
JP2008151792A5 JP2007324161A JP2007324161A JP2008151792A5 JP 2008151792 A5 JP2008151792 A5 JP 2008151792A5 JP 2007324161 A JP2007324161 A JP 2007324161A JP 2007324161 A JP2007324161 A JP 2007324161A JP 2008151792 A5 JP2008151792 A5 JP 2008151792A5
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JP
Japan
Prior art keywords
lead material
electronic component
pressure detection
lead
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007324161A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008151792A (ja
JP4969430B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007324161A priority Critical patent/JP4969430B2/ja
Priority claimed from JP2007324161A external-priority patent/JP4969430B2/ja
Publication of JP2008151792A publication Critical patent/JP2008151792A/ja
Publication of JP2008151792A5 publication Critical patent/JP2008151792A5/ja
Application granted granted Critical
Publication of JP4969430B2 publication Critical patent/JP4969430B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2007324161A 2007-12-17 2007-12-17 圧力検出装置 Expired - Lifetime JP4969430B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007324161A JP4969430B2 (ja) 2007-12-17 2007-12-17 圧力検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007324161A JP4969430B2 (ja) 2007-12-17 2007-12-17 圧力検出装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003154273A Division JP2004356494A (ja) 2003-05-30 2003-05-30 電子装置および圧力検出装置

Publications (3)

Publication Number Publication Date
JP2008151792A JP2008151792A (ja) 2008-07-03
JP2008151792A5 true JP2008151792A5 (enExample) 2010-07-29
JP4969430B2 JP4969430B2 (ja) 2012-07-04

Family

ID=39654071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007324161A Expired - Lifetime JP4969430B2 (ja) 2007-12-17 2007-12-17 圧力検出装置

Country Status (1)

Country Link
JP (1) JP4969430B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5712799B2 (ja) * 2011-06-03 2015-05-07 株式会社デンソー センサおよびその製造方法
JP2014195039A (ja) * 2013-02-26 2014-10-09 Tokai Rika Co Ltd 電子部品の接続構造
EP3109897A1 (en) * 2015-06-23 2016-12-28 Nxp B.V. A lead frame assembly
US9681568B1 (en) * 2015-12-02 2017-06-13 Ge Energy Power Conversion Technology Ltd Compact stacked power modules for minimizing commutating inductance and methods for making the same
CN114551419A (zh) * 2020-11-27 2022-05-27 株洲中车时代半导体有限公司 电阻贴片装置及其方法和igbt衬板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105565A (ja) * 1987-10-17 1989-04-24 Matsushita Electric Ind Co Ltd 混成集積回路用リードフレーム
JPH06268120A (ja) * 1993-03-16 1994-09-22 Hitachi Ltd パワースイッチングモジュールのヒートシンク
JP4117807B2 (ja) * 1997-06-24 2008-07-16 松下電工株式会社 電子部品のハンダ付け方法
JP2000165042A (ja) * 1998-11-30 2000-06-16 Nec Corp 薄膜多層配線基板
JP2002124616A (ja) * 2000-10-13 2002-04-26 Aisan Ind Co Ltd リードフレームのチップ部品実装構造
JP2002151612A (ja) * 2000-11-10 2002-05-24 Sumitomo Metal Electronics Devices Inc 光通信用パッケージ及びその製造方法
JP3791403B2 (ja) * 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
JP3752444B2 (ja) * 2001-11-16 2006-03-08 株式会社日立製作所 圧力検出装置

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