JP2015106660A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2015106660A JP2015106660A JP2013248544A JP2013248544A JP2015106660A JP 2015106660 A JP2015106660 A JP 2015106660A JP 2013248544 A JP2013248544 A JP 2013248544A JP 2013248544 A JP2013248544 A JP 2013248544A JP 2015106660 A JP2015106660 A JP 2015106660A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Abstract
Description
11 青色LED
12 緑色LED
13 封止樹脂
14 封止枠
15 赤色蛍光体
16 黄色蛍光体
17 基板
18 電極
Claims (4)
- 青色系の半導体発光素子である複数の青色素子と、
緑色系の半導体発光素子である複数の緑色素子と、
前記複数の青色素子からの青色光および前記複数の緑色素子からの緑色光を励起光として吸収して赤色光を発する赤色蛍光体が分散混入され、当該複数の青色素子および当該複数の緑色素子を被覆する封止樹脂と、を有し、
前記複数の青色素子と前記複数の緑色素子が互いに直列接続されることを特徴とする発光装置。 - 前記複数の青色素子と前記複数の緑色素子は、ともにInGaN系の半導体発光素子である、請求項1に記載の発光装置。
- 前記複数の青色素子と前記複数の緑色素子は、同一基板上で互いに並列接続される複数の列に分けられ、当該複数の列のそれぞれにおいて複数の青色素子と複数の緑色素子が互いに直列接続される、請求項1または2に記載の発光装置。
- 前記複数の列のそれぞれに含まれる前記複数の青色素子と前記複数の緑色素子の個数の比率はすべての列で等しい、請求項3に記載の発光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013248544A JP6230392B2 (ja) | 2013-11-29 | 2013-11-29 | 発光装置 |
US14/552,787 US20150155460A1 (en) | 2013-11-29 | 2014-11-25 | Light-emitting apparatus |
CN201420739846.2U CN204361094U (zh) | 2013-11-29 | 2014-11-28 | 发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013248544A JP6230392B2 (ja) | 2013-11-29 | 2013-11-29 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015106660A true JP2015106660A (ja) | 2015-06-08 |
JP6230392B2 JP6230392B2 (ja) | 2017-11-15 |
Family
ID=53262547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013248544A Active JP6230392B2 (ja) | 2013-11-29 | 2013-11-29 | 発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150155460A1 (ja) |
JP (1) | JP6230392B2 (ja) |
CN (1) | CN204361094U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017130497A (ja) * | 2016-01-18 | 2017-07-27 | 日亜化学工業株式会社 | 発光装置および発光装置を備えたバックライト |
JP2018535552A (ja) * | 2015-12-25 | 2018-11-29 | ▲廣▼州市添▲しん▼光▲電▼有限公司 | 効率的なledインテリジェント光源 |
JP2019114762A (ja) * | 2017-12-22 | 2019-07-11 | 日亜化学工業株式会社 | 発光装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596985B (zh) * | 2015-07-22 | 2017-08-21 | 億光電子工業股份有限公司 | 發光裝置 |
JP6522139B2 (ja) * | 2015-09-18 | 2019-05-29 | シチズン電子株式会社 | 発光装置 |
TWI800538B (zh) * | 2018-10-08 | 2023-05-01 | 晶元光電股份有限公司 | 發光元件 |
CN112669779A (zh) * | 2020-12-30 | 2021-04-16 | 佛山市国星光电股份有限公司 | 一种背光模组及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007158296A (ja) * | 2005-12-01 | 2007-06-21 | Samsung Electronics Co Ltd | 白色発光ダイオード |
JP2009060069A (ja) * | 2007-09-03 | 2009-03-19 | Ledtech Electronics Corp | 高演色性のあるアレイ型発光装置 |
US20100295068A1 (en) * | 2007-08-27 | 2010-11-25 | Bu Wan Seo | Light emitting device package and lighting apparatus using the same |
JP2011249807A (ja) * | 2010-05-24 | 2011-12-08 | Lg Innotek Co Ltd | 発光素子及びこれを含むライトユニット |
JP2012227249A (ja) * | 2011-04-18 | 2012-11-15 | Citizen Electronics Co Ltd | Ledパッケージ |
Family Cites Families (10)
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KR100702273B1 (ko) * | 1998-09-28 | 2007-03-30 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 조명 시스템 |
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
US6919584B2 (en) * | 2003-06-19 | 2005-07-19 | Harvatek Corporation | White light source |
JP4679183B2 (ja) * | 2005-03-07 | 2011-04-27 | シチズン電子株式会社 | 発光装置及び照明装置 |
US7993021B2 (en) * | 2005-11-18 | 2011-08-09 | Cree, Inc. | Multiple color lighting element cluster tiles for solid state lighting panels |
JP4805026B2 (ja) * | 2006-05-29 | 2011-11-02 | シャープ株式会社 | 発光装置、表示装置及び発光装置の制御方法 |
JP2010129583A (ja) * | 2008-11-25 | 2010-06-10 | Citizen Electronics Co Ltd | 照明装置 |
US9275979B2 (en) * | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
EP2365525A3 (en) * | 2010-03-12 | 2013-05-29 | Toshiba Lighting & Technology Corporation | Illumination apparatus having an array of red and phosphour coated blue LEDs |
JP6267635B2 (ja) * | 2012-05-21 | 2018-01-24 | 株式会社ドゥエルアソシエイツ | チップオンボード型のパッケージ基板を有する発光装置及びその製造方法 |
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2013
- 2013-11-29 JP JP2013248544A patent/JP6230392B2/ja active Active
-
2014
- 2014-11-25 US US14/552,787 patent/US20150155460A1/en not_active Abandoned
- 2014-11-28 CN CN201420739846.2U patent/CN204361094U/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007158296A (ja) * | 2005-12-01 | 2007-06-21 | Samsung Electronics Co Ltd | 白色発光ダイオード |
US20100295068A1 (en) * | 2007-08-27 | 2010-11-25 | Bu Wan Seo | Light emitting device package and lighting apparatus using the same |
JP2009060069A (ja) * | 2007-09-03 | 2009-03-19 | Ledtech Electronics Corp | 高演色性のあるアレイ型発光装置 |
JP2011249807A (ja) * | 2010-05-24 | 2011-12-08 | Lg Innotek Co Ltd | 発光素子及びこれを含むライトユニット |
JP2012227249A (ja) * | 2011-04-18 | 2012-11-15 | Citizen Electronics Co Ltd | Ledパッケージ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018535552A (ja) * | 2015-12-25 | 2018-11-29 | ▲廣▼州市添▲しん▼光▲電▼有限公司 | 効率的なledインテリジェント光源 |
JP2017130497A (ja) * | 2016-01-18 | 2017-07-27 | 日亜化学工業株式会社 | 発光装置および発光装置を備えたバックライト |
US10274667B2 (en) | 2016-01-18 | 2019-04-30 | Nichia Corporation | Light-emitting device with two green light-emitting elements with different peak wavelengths and backlight including light-emitting device |
JP2019114762A (ja) * | 2017-12-22 | 2019-07-11 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
CN204361094U (zh) | 2015-05-27 |
US20150155460A1 (en) | 2015-06-04 |
JP6230392B2 (ja) | 2017-11-15 |
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