JP2015076418A5 - - Google Patents

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Publication number
JP2015076418A5
JP2015076418A5 JP2013209535A JP2013209535A JP2015076418A5 JP 2015076418 A5 JP2015076418 A5 JP 2015076418A5 JP 2013209535 A JP2013209535 A JP 2013209535A JP 2013209535 A JP2013209535 A JP 2013209535A JP 2015076418 A5 JP2015076418 A5 JP 2015076418A5
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JP
Japan
Prior art keywords
ether
glycol
acetate
examples
ether acetate
Prior art date
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Granted
Application number
JP2013209535A
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English (en)
Japanese (ja)
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JP2015076418A (ja
JP6191372B2 (ja
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Application filed filed Critical
Priority claimed from JP2013209535A external-priority patent/JP6191372B2/ja
Priority to JP2013209535A priority Critical patent/JP6191372B2/ja
Priority to PCT/JP2014/073660 priority patent/WO2015049956A1/ja
Priority to CN201480054698.3A priority patent/CN105612606B/zh
Priority to KR1020167006434A priority patent/KR102232715B1/ko
Priority to US15/026,722 priority patent/US10037882B2/en
Priority to TW103134090A priority patent/TWI625322B/zh
Publication of JP2015076418A publication Critical patent/JP2015076418A/ja
Publication of JP2015076418A5 publication Critical patent/JP2015076418A5/ja
Publication of JP6191372B2 publication Critical patent/JP6191372B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013209535A 2013-10-04 2013-10-04 ウェハの洗浄方法 Active JP6191372B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013209535A JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法
US15/026,722 US10037882B2 (en) 2013-10-04 2014-09-08 Method for cleaning wafer
CN201480054698.3A CN105612606B (zh) 2013-10-04 2014-09-08 晶片的清洗方法
KR1020167006434A KR102232715B1 (ko) 2013-10-04 2014-09-08 웨이퍼의 세정 방법
PCT/JP2014/073660 WO2015049956A1 (ja) 2013-10-04 2014-09-08 ウェハの洗浄方法
TW103134090A TWI625322B (zh) 2013-10-04 2014-09-30 晶圓之洗淨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013209535A JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017111481A Division JP2017157863A (ja) 2017-06-06 2017-06-06 ウェハの洗浄方法

Publications (3)

Publication Number Publication Date
JP2015076418A JP2015076418A (ja) 2015-04-20
JP2015076418A5 true JP2015076418A5 (https=) 2016-10-27
JP6191372B2 JP6191372B2 (ja) 2017-09-06

Family

ID=52778552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013209535A Active JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法

Country Status (6)

Country Link
US (1) US10037882B2 (https=)
JP (1) JP6191372B2 (https=)
KR (1) KR102232715B1 (https=)
CN (1) CN105612606B (https=)
TW (1) TWI625322B (https=)
WO (1) WO2015049956A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4743340B1 (ja) * 2009-10-28 2011-08-10 セントラル硝子株式会社 保護膜形成用薬液
WO2017010321A1 (ja) * 2015-07-13 2017-01-19 富士フイルム株式会社 パターン構造の処理方法、電子デバイスの製造方法およびパターン構造の倒壊抑制用処理液
CN107925955B (zh) 2015-10-09 2021-04-27 日本电气株式会社 无线电接入网节点和移动终端及其通信方法、通信系统
WO2018058341A1 (en) * 2016-09-28 2018-04-05 Dow Global Technologies Llc Sulfoxide/glycol ether based solvents for use in the electronics industry
KR102519448B1 (ko) 2017-03-24 2023-04-07 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 처리 방법 및 이를 위한 조성물
JP6963166B2 (ja) * 2017-04-17 2021-11-05 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物
EP3735325A4 (en) 2018-01-05 2021-03-03 FUJIFILM Electronic Materials U.S.A, Inc. SURFACE TREATMENT COMPOSITIONS AND PROCEDURES
JP7274919B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
CN115668459B (zh) * 2020-05-21 2025-12-16 中央硝子株式会社 半导体基板的表面处理方法及表面处理剂组合物
KR20230015959A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물
CN116970446B (zh) * 2023-09-22 2024-01-09 山东天岳先进科技股份有限公司 碳化硅单晶材料amb覆铜的前处理溶液、产品及应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7838425B2 (en) 2008-06-16 2010-11-23 Kabushiki Kaisha Toshiba Method of treating surface of semiconductor substrate
JP4743340B1 (ja) 2009-10-28 2011-08-10 セントラル硝子株式会社 保護膜形成用薬液
JP5630385B2 (ja) * 2010-06-30 2014-11-26 セントラル硝子株式会社 保護膜形成用薬液及びウェハ表面の洗浄方法
US8828144B2 (en) 2010-12-28 2014-09-09 Central Grass Company, Limited Process for cleaning wafers
JP2013118347A (ja) * 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
US20120164818A1 (en) 2010-12-28 2012-06-28 Central Glass Company, Limited Process for Cleaning Wafers
JP2013102109A (ja) 2011-01-12 2013-05-23 Central Glass Co Ltd 保護膜形成用薬液

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