JP2015061509A5 - - Google Patents

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Publication number
JP2015061509A5
JP2015061509A5 JP2014179275A JP2014179275A JP2015061509A5 JP 2015061509 A5 JP2015061509 A5 JP 2015061509A5 JP 2014179275 A JP2014179275 A JP 2014179275A JP 2014179275 A JP2014179275 A JP 2014179275A JP 2015061509 A5 JP2015061509 A5 JP 2015061509A5
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JP
Japan
Prior art keywords
electric field
driving force
micro object
group
force
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Application number
JP2014179275A
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English (en)
Japanese (ja)
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JP6313169B2 (ja
JP2015061509A (ja
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Publication date
Priority claimed from US14/031,392 external-priority patent/US9473047B2/en
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Publication of JP2015061509A publication Critical patent/JP2015061509A/ja
Publication of JP2015061509A5 publication Critical patent/JP2015061509A5/ja
Application granted granted Critical
Publication of JP6313169B2 publication Critical patent/JP6313169B2/ja
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JP2014179275A 2013-09-19 2014-09-03 表面上でマイクロ物体を操作する間に静摩擦を抑える方法 Active JP6313169B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/031,392 2013-09-19
US14/031,392 US9473047B2 (en) 2013-09-19 2013-09-19 Method for reduction of stiction while manipulating micro objects on a surface

Publications (3)

Publication Number Publication Date
JP2015061509A JP2015061509A (ja) 2015-03-30
JP2015061509A5 true JP2015061509A5 (enExample) 2017-10-12
JP6313169B2 JP6313169B2 (ja) 2018-04-18

Family

ID=51625787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014179275A Active JP6313169B2 (ja) 2013-09-19 2014-09-03 表面上でマイクロ物体を操作する間に静摩擦を抑える方法

Country Status (3)

Country Link
US (1) US9473047B2 (enExample)
EP (1) EP2851336B1 (enExample)
JP (1) JP6313169B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431283B2 (en) 2013-09-19 2016-08-30 Palo Alto Research Center Incorporated Direct electrostatic assembly with capacitively coupled electrodes
US10141285B2 (en) 2013-09-19 2018-11-27 Palo Alto Research Center Incorporated Externally induced charge patterning using rectifying devices
WO2015112538A1 (en) * 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate transport vacuum platform
US10558204B2 (en) * 2016-09-19 2020-02-11 Palo Alto Research Center Incorporated System and method for scalable real-time micro-object position control with the aid of a digital computer
US10043687B2 (en) * 2016-12-27 2018-08-07 Palo Alto Research Center Incorporated Bumped electrode arrays for microassemblers
CN108675023B (zh) * 2018-05-02 2019-12-27 孝感量子机电科技有限公司 书写纸传送装置及书写装置
US11302554B2 (en) 2018-12-17 2022-04-12 Palo Alto Research Center Incorporated Micro assembler with fine angle control
US11203525B2 (en) * 2018-12-31 2021-12-21 Palo Alto Research Center Incorporated Method of controlling the placement of micro-objects
WO2020167939A1 (en) 2019-02-14 2020-08-20 Persimmon Technologies Corporation Magnetically guided material handling robot
US12020399B2 (en) 2020-11-16 2024-06-25 Xerox Corporation System and method for multi-object micro-assembly control with the aid of a digital computer
US11893327B2 (en) 2020-12-14 2024-02-06 Xerox Corporation System and method for machine-learning enabled micro-assembly control with the aid of a digital computer
US11921488B2 (en) 2020-12-15 2024-03-05 Xerox Corporation System and method for machine-learning-enabled micro-object density distribution control with the aid of a digital computer
US12334377B2 (en) 2023-01-17 2025-06-17 Xerox Corporation Chiplet loader for microassembler

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05184163A (ja) * 1991-12-27 1993-07-23 Masafumi Yano 静電アクチュエータ
JPH05207760A (ja) * 1992-01-27 1993-08-13 Ricoh Co Ltd 静電力アクチュエータ
JPH07203689A (ja) * 1993-12-31 1995-08-04 Toshiro Higuchi 静電アクチュエータ
JPH10271850A (ja) * 1997-03-26 1998-10-09 Oki Electric Ind Co Ltd 媒体搬送装置
JPH11163100A (ja) * 1997-11-27 1999-06-18 Toshiba Mach Co Ltd 静電移動ステージ装置
JPH11215853A (ja) * 1998-01-28 1999-08-06 Oki Electric Ind Co Ltd 搬送装置
JP2000143024A (ja) * 1998-11-10 2000-05-23 Oki Electric Ind Co Ltd 媒体搬送装置
US6923979B2 (en) 1999-04-27 2005-08-02 Microdose Technologies, Inc. Method for depositing particles onto a substrate using an alternating electric field
GB2354114A (en) * 1999-09-13 2001-03-14 Gareth John Monkman Micro-scale electrostatic gripper
US6687987B2 (en) * 2000-06-06 2004-02-10 The Penn State Research Foundation Electro-fluidic assembly process for integration of electronic devices onto a substrate
JP2006025578A (ja) * 2004-07-09 2006-01-26 Olympus Corp エレクトレットアクチュエータ
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US7332361B2 (en) * 2004-12-14 2008-02-19 Palo Alto Research Center Incorporated Xerographic micro-assembler
US7728427B2 (en) * 2007-12-07 2010-06-01 Lctank Llc Assembling stacked substrates that can form cylindrical inductors and adjustable transformers
US7861405B2 (en) 2008-03-03 2011-01-04 Palo Alto Research Center Incorporated System for forming a micro-assembler
US8581167B2 (en) 2010-11-16 2013-11-12 Palo Alto Research Center Incorporated Optically patterned virtual electrodes and interconnects on polymer and semiconductive substrates
US10014261B2 (en) 2012-10-15 2018-07-03 Palo Alto Research Center Incorporated Microchip charge patterning
US9431283B2 (en) 2013-09-19 2016-08-30 Palo Alto Research Center Incorporated Direct electrostatic assembly with capacitively coupled electrodes
US10141285B2 (en) * 2013-09-19 2018-11-27 Palo Alto Research Center Incorporated Externally induced charge patterning using rectifying devices

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